Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Estimation of Interfacial Fracture Energy of Cu/Cr/Polyimide System by T Peel Test

T peel 테스트에 의한 Cu/Cr/Polyimide계의 계면파괴에너지 평가

  • Song, J.Y. (Dept. of Materials Science and Engineering, KAIST) ;
  • Yu, Jin (Dept. of Materials Science and Engineering, KAIST)
  • 송재용 (한국과학기술원 재료공학과) ;
  • 유진 (한국과학기술원 재료공학과)
  • Published : 2000.11.01
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