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Microjoining Process for MEMS and Electronic Packaging
MEMS와 전자 패키징을 위한 마이크로 접합 공정
유중돈
(KIAST 기계공학과)
Publication Information
Journal of Welding and Joining
/
v.22, no.4
, 2004 , pp. 24-28
More about this Journal
More about this Journal
Frequency : Bimonthly
Publisher : The Korean Welding and Joining Society
KISTI Subject :
SCOPUS Subject :
Energy (miscellaneous)
,
Materials Science (miscellaneous)
Web of Science Subject :
Metallurgy &metallurgical Engineering
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