• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 1999년도 1st Korea-Japan Advanced Semiconductor Packaging Technology Seminar
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• pp.9-43
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• 1999

• 대한전자공학회논문지SD
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• 제41권10호
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• pp.31-39
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• 2004

이 논문은 파워 잡음 특성이 칩(chip)의 코아 동작에 따라 DDR DRAM용 모듈(Module)과 패키지(package)의 종류의 영향을 받는 다는 것을 보여주고 있다. 이를 분석하기 위해 상용 TSOP-based DIMM 과 FBGA-based DIMM에서 FBGA와 TSOP 패키지형 DRAM 칩을 가지고 임피던스 모양과 파워 잡음을 분석하였다. 일반적인 상식과 달리, FBGA 패키지의 잡음 격리 특성이 TSOP 패키지의 잡음 격리 특성보다 전달되는 잡음에 더 약하고 민감하다는 것이 발견되었다. 또한 자체 및 전달 잡음 특성을 조절하는데 있어서는 모듈상의 디커풀링 커패시터(decoupling capacitors)들 위치가 패키지 자체의 리드선 인덕턴스(lead inductance)보다 더 중요하다는 것을 또한 시뮬레이션 결과들은 보여준다. 따라서 잡음 억제나 잡음 전달로부터 격리의 목표설정 값을 만족시키는 것은 패키지 형태 뿐 아니라 모듈 전체를 고려한 파워 분배 시스템의 설계를 통해서만 얻어질수 있다.

• 전기학회논문지P
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• 제67권2호
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• pp.63-69
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• 2018

In this paper, the operation principle of a bi-directional switch type resonant AC link snubber circuit was described, together with the practical design procedure, which employs in the proposed power module bridge package type resonant AC link snubber. The novel prototype of power module bridge package type resonant AC link snubber-assisted voltage type sinewave soft switching PWM inverter using IGBT power module was demonstrated herein. It was verified that both the auxiliary power switches in this resonant AC link snubber circuit and the main power switches commutate under the condition of soft switching commutation principle. In addition, the power losses of the new soft switching inverter treated here were analyzed by implementing the experimental data of the IGBT and diode v-i characteristics in addition to switching power loss characteristics into our original computer simulation software developed by the authors. Then, the voltage type sinewave soft switching PWM inverter was high efficiency than that of hard switching PWM inverter, along with performance operation waveforms. In the future, the comparative feasibility study of power module bridge type resonant AC link snubber and its related soft switching inverter in addition to the other types resonant snubber assisted soft switching inverter should be done from a practical point of view.

• 한국전자파학회논문지
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• 제17권11호
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• pp.1105-1111
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• 2006

본 논문에서는 저온 소성 세라믹(LTCC)에 기초한 SiP 기술을 이용하여 60 GHz 무선 통신을 위한 송신기용 초소형 전력 증폭기 LTCC모듈을 설계 및 제작하여 그 특성을 측정하였다. 60 GHz대역에서 LTCC 다층 기판과 전력 증폭기 MMIC의 상호 연결 손실을 줄이기 위해 와이어 본드와 기판 사이의 천이를 최적화하였고, MMIC 집적을 위한 고 격리 구조를 제안하였다. 와이어 본드 천이의 경우, 와이어의 인덕턴스를 감소시키기 위해 매칭 회로의 설계와 와이어 상호간의 간격을 최적화하였다. 또한 상호 연결 불연속 효과로 인한 전계의 방사를 억제하기 위해 코프라나 와이어 본드 구조를 이용하였다. 고 격리 모듈 구조를 위하여, LTCC 기판 내부에 DC 전원 배선을 내장시키고 비아로 그 주위를 차폐를 시켰다. 5층의 LTCC 기판을 사용하여 제작된 전력 증폭기 LTCC모듈의 크기는 $4.6{\times}4.9{\times}0.5mm^3$이고, $60{\sim}65GHz$ 대역에서 이득과 P1dB 출력 전력은 각각 10 dB와 11 dBm이다.

• 전기학회논문지
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• 제58권1호
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• pp.107-112
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• 2009

This paper describes design and fabrication issues of the SiP(System in Package) one-chip for a portable digital broadcasting receiver. It includes RF tuner chip, demodulator chip and passive components for the receiver system. When we apply the SiP one-chip technology to the broadcasting receiver, the system board size can be reduced from $776mm^2$ to $144mm^2$. SiP one-chip has an advantage that the area reduces more 81% than separated chips. Also the sensitivity performance advances -1dBm about 36 channels in the RF weak electric field, the power consumption reduces about 2mW and the C/N keeps on the same level.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2008년도 하계종합학술대회
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• pp.491-492
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• 2008

According to high-speed large scale integration trend of Memory module product, many type of noises, such a reflection, cross-talk simultaneous switching noise, occur on the Package PCB and they make the deterioration of memory module's performance and reliability. As module products have more high efficiency, Hardware of test board and socket has to be considered In test of the high-speed Memory Module. we mainly focused on improvement of Signal integrity Using the High Frequency Test socket that we invented

• 한국컴퓨터정보학회논문지
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• 제21권11호
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• pp.59-64
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• 2016

In this paper, we design and implement an Application based on android platform, which can control arduino Prime Smart Car using Bluetooth communication. This Application consist of Bluetooth communication module, manual mode module, and line-tracer mode module. In the Bluetooth communication module, it checks the on/off status of Smartphone Bluetooth. If Bluetooth status is off, it activates Bluetooth, selects the corresponding device from Bluetooth device list, and connects with a pair. In order to reduce coding time, we implements Bluetooth communication using inherited class from android Bluetooth package. In the manual mode module, it implements six direction moving button and stop button, which can control arduino Prime Smart Car. In the line-tracer mode module, it implements Prime Smart Car with self-driving function using TCRT5000 sensor. And moving button and stop button is disabled.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회B
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• pp.2444-2448
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• 2007

The multi channel of DDI which is the core part of the LCD-TV has been propelled. When multi channel in DDI is introduced, it brings a thermal problem because of the increased power. To solve the thermal problem of the DDI it needs to be investigated each at the package level and module level. It is important to extract the junction temperature(Tj) of DDI clearly from the system level. The objective of this research is to construct a compact model. The compact model is to reduce LCD module including DDI. When the compact model is used, it will be able to easily handle the boundary condition and accurately predict the temperature. Consequently, the temperature of DDI can be calculated easily at the system level. Through this research,we also proposed the cooling plan of DDI for a protection of overheating. The cooling plan was utilized in DDI design.

• 한국광학회:학술대회논문집
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• 한국광학회 2003년도 제14회 정기총회 및 03년 동계학술발표회
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• pp.298-299
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• 2003

As the demand for high frequency(bandwidth) optical module of reduced cost is increased, there are considerable needs for low cost／ high reliable optical packaging method. In order to meet these requirements, the researches using silicon optical bench(SiOB) technology have been developed as one of the leading technology. In this paper, we discuss optical package using one aspherical lens mounted on SiOB by passive alignment, and present the reliability data for the optical module, which are temperature cycling between 40C and +85C, and high temperature storage 85C(unbiased), 2000hour.

• 반도체디스플레이기술학회지
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• 제15권4호
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• pp.1-9
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• 2016

The warpage on mobile phone camera packages occurs due to the CTE(Coefficient of Thermal Expansion) mismatch between a thin silicon die and a substrate. The warpage in the optical instruments such as camera module has an effect on the field curvature, which is one of the factors degrading the optical performance and the product yield. In this paper, we studied the effect of die bonding epoxy on the package and optical performance of mobile phone camera packages. We calculated the warpages of camera module packages by using a finite element analysis, and their shapes were in good agreement showing parabolic curvature. We also measured the warpages and through-focus MTF of camera module specimens with experiments. The warpage was improved on an epoxy with low elastic modulus at both finite element analysis and experiment results, and the MTF performance increased accordingly. The results show that die bonding epoxy affects the warpage generated on the image sensor during the packaging process, and this warpage eventually affects the optical performance associated with the field curvature.