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Design and Fabrication of the System in Package for the Digital Broadcasting Receiver  

Kim, Jee-Gyun (명지대 공대 전기공학과)
Lee, Heon-Yong (명지대 공대 전기공학과)
Publication Information
The Transactions of The Korean Institute of Electrical Engineers / v.58, no.1, 2009 , pp. 107-112 More about this Journal
Abstract
This paper describes design and fabrication issues of the SiP(System in Package) one-chip for a portable digital broadcasting receiver. It includes RF tuner chip, demodulator chip and passive components for the receiver system. When we apply the SiP one-chip technology to the broadcasting receiver, the system board size can be reduced from $776mm^2$ to $144mm^2$. SiP one-chip has an advantage that the area reduces more 81% than separated chips. Also the sensitivity performance advances -1dBm about 36 channels in the RF weak electric field, the power consumption reduces about 2mW and the C/N keeps on the same level.
Keywords
Digital Broadcasting; System in Package; System on Package; Multi Chip Module; Intermediate Frequency;
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