1 |
Christopher M. Scanlan and Nozad Karim, ''System-in-Package technology, application and trends'', SMTA International Proceedings, 2001, pp. 764-773
|
2 |
이성수, 'SiP(System-in Package) 기술', 주간기술동향, Vol. 242, pp. 25-33, 2006.4
|
3 |
N. Tanaka and Y. Yoshimira, 'Ultra-Thin 3D-Stacked SiP formed Using Room-Temperature Bonding between Stacked Chips', 2005 ECTC Conference, pp. 788-794, 2005
|
4 |
윤종광, 'SOP(System-on-Packaging) for Mega-Function System Integration', 세라미스트, Vol. 8, No. 6, pp. 46-52, 2005. 12
과학기술학회마을
|
5 |
Andrew Holland, 'Innovations in QFN Packaging Targeting RF and Image Sensor System-in-Package', IMAPS MicroTech 2006
|
6 |
M. Karnezos, F. Carson and R. Pendse, '3D packaging promises performance, reliablility gains with small footprints and lower profiles', Chip Scale Review, 2005
|
7 |
Wei Koh, 'System in Package (SiP) Technology Applications', IEEE Electronic Packaging Technology Conference, pp. 61-66, 2005. 8
DOI
|
8 |
Tiao Zhou, Mark Gerber, Moody Dreiza, 'Stacked Die Package Design Guidelines', IMAPS 2004
|
9 |
Priest, J., Ahmad, M.외 3인, 'Feasibility Study of a SiP for High Performance and Reliability Product Application', IEEE High Density Microsystem Design and Packaging and Component Failure Analysis Conference, pp. 1-5, 2005. 7
DOI
|
10 |
Shan Gao, Jupyo Hong 외 3인, 'Effects of Packaging Materials on the Reliability of System in Package', IEEE/ICEPT Electronic Packaging Technology Conference, pp. 1-5, 2007. 8
DOI
|