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Effect of Die Bonding Epoxy on the Warpage and Optical Performance of Mobile Phone Camera Packages  

Son, Sukwoo (Science of Measurement, University of Science and Technology)
Kihm, Hagyong (Center for Space Optics, Korea Research Institute of Standards and Science)
Yang, Ho Soon (Center for Space Optics, Korea Research Institute of Standards and Science)
Publication Information
Journal of the Semiconductor & Display Technology / v.15, no.4, 2016 , pp. 1-9 More about this Journal
Abstract
The warpage on mobile phone camera packages occurs due to the CTE(Coefficient of Thermal Expansion) mismatch between a thin silicon die and a substrate. The warpage in the optical instruments such as camera module has an effect on the field curvature, which is one of the factors degrading the optical performance and the product yield. In this paper, we studied the effect of die bonding epoxy on the package and optical performance of mobile phone camera packages. We calculated the warpages of camera module packages by using a finite element analysis, and their shapes were in good agreement showing parabolic curvature. We also measured the warpages and through-focus MTF of camera module specimens with experiments. The warpage was improved on an epoxy with low elastic modulus at both finite element analysis and experiment results, and the MTF performance increased accordingly. The results show that die bonding epoxy affects the warpage generated on the image sensor during the packaging process, and this warpage eventually affects the optical performance associated with the field curvature.
Keywords
die bonding epoxy; warpage; package; mobile phone camera; field curvature; MTF;
Citations & Related Records
Times Cited By KSCI : 6  (Citation Analysis)
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