Proceedings of the IEEK Conference (대한전자공학회:학술대회논문집)
- 2008.06a
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- Pages.491-492
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- 2008
Improvement of Memory Module Test Signal Integrity Using High Frequency Socket
High Frequency Socket 개발을 통한 Memory Module Test Signal Integrity 향상
- Kim, Min-Su (Electrical Engineering Graduate School Korea University) ;
- Kim, Su-Ki (Electrical Engineering Graduate School Korea University)
- Published : 2008.06.18
Abstract
According to high-speed large scale integration trend of Memory module product, many type of noises, such a reflection, cross-talk simultaneous switching noise, occur on the Package PCB and they make the deterioration of memory module's performance and reliability. As module products have more high efficiency, Hardware of test board and socket has to be considered In test of the high-speed Memory Module. we mainly focused on improvement of Signal integrity Using the High Frequency Test socket that we invented
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