• Restorative Dentistry and Endodontics
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• v.30 no.6
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• pp.493-504
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• 2005

This study was performed to investigate the compatibility between 4 dentin adhesives and 4 resin luting cements. Dentin adhesives used in this study were All-Bond 2 (Bisco Inc., Schaumbrug, IL, USA), Clearfil SE-Bond (Kuraray Medical Inc, Osaka, Japan), Prompt L-Pop (3M Dental Products, St. Paul, MN, USA), One-Up Bond F (Tokuyama corp., Tokyo, Japan) Resin luting cements used in this study were Choice (Bisco Inc., Schaumbrug, IL, USA), Panavia F (Kuraray Medical Inc, Osaka, Japan), RelyX ARC (3M Dental Products, St. Paul, MN, USA) Bistite II DC (Tokuyama corp., Tokyo, Japan). Combination of each dentin adhesive and corresponding resin cement was made to 16 experimental groups. Flat dentin surfaces was created on mid-coronal dentin of extracted mandibular third molars, then dentin surface was polished with 320-grit silicon carbide abrasive papers. Indirect resin composite block (Tescera, Bisco) was fabricated. Its surface for bonding to tooth was polished with silicon carbide abrasive papers Each dentin adhesive was treated on tooth surface and resin composite overlay were luted with each resin cement. Each bonded specimen was poured in epoxy resin and sectioned occluso-gingivally into 1.0mm thick slab, then further sectioned into $1.0{\times}1.0mm^2$ composite-dentin beams. Microtensile bond strength was tested at a crosshead speed of 1.0mm/min. The data were analysed by one-way ANOVA and Duncan's multiple comparison tests The results of this study were as follows, 2-step self-etching dentin adhesive which has additional bonding resin is more comparison than tests. self-etching dentin adhesive.

• Journal of Industrial Technology
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• v.39 no.1
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• pp.33-39
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• 2019

This paper addresses effects of nanoscale structures on structural colors of micropatterned transparent substrate by light diffraction. Structural colors is widely investigated because they present colors without any chemical pigments. Typically structural colors is presented by diffraction of light on a micropatterned surface or by multiple interference of light on a surface containing a periodic or quasi-periodic nano-structures. In this paper, each structural colors induced by quasi-periodic nano-structures, periodic micro-structures, and nano/micro dual structures is measured in order to investigate effects of nanoscale and microscale structures on structural colors in the transparent substrate. Using pre-fabricated pattern mold and hot-embossing process, nanoscale and microscale structures are replicated on the transparent PMMA(Poly methyl methacrylate) substrate. Nanoscale and microscale pattern molds are prepared by anodic oxidation process of aluminum sheet and by reactive ion etching process of silicon wafer, respectively. Structural colors are captured by digital camera, and their optical transmittance spectrum are measured by UV/visible spectrometer. From experimental results, we found that nano-structures provide monotonic colors by multiple interference, and micro-structures induce iridescent colors by diffraction of light. Structural colors is permanent and unchangeable, thus it can be used in various application field such as security, color filter and so on.

• The korean journal of orthodontics
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• v.26 no.5 s.58
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• pp.497-507
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• 1996

The aim of present study in vitro was to evaluate and compare the effects of different washing times of enamels etched with low phosphoric acid solution which makes unsoluble salts and etched but contaminated with saliva on shear bond strength of an orthodontic adhesive to enamel, and to observe the washing effect on the etched enamel surface by scanning electron microscope. All brackets were bonded with Mono-$Lok2^{TM)}$) on the labial surface of extracted human bicuspids after etching with $20w/w\%\;and\;37w/w$ and phosphoric acid solution for 60seconds and then washing for 0,5,10 and 20seconds respectedly. After etching with $37w/w\%$ phosphoric acid solution and contaminating with saliva for 30seconds and then washing for 0,5,20 and 30seconds and re-etching for 10seconds. After 24hours passed in the $37^{\circ}C$ water bath, the shear bond strengths were measured on Universal Test Machine. The data were evaluated and tested by ANOVA and Duncan's multiple range test, and those results were as follows. 1. There was no significant differences between (p>0.05) shear bond strength of bonded brackets with 5, 10, 20seconds washing etched enamel using $37{\%}w/w{\%}$ phosphoric acid solution. 2. The shear bond strength of bonded brackets with $20w/w\%$ phosphoric acid and then washing for 5seconds showed bonded strength durable to occlusal force but its coefficiency score was high and etched surface was not cleaned completely and therefore it was assumed that its clinical application is not applicable. 3. There was no significant differences between (p>0.05) shear bond strengths of bonded brckets with washing for 5seconds etched enamel using $37w/w\%$ phosphoric acid solution and 10,20 seconds washing etched enamel using $20w/w\%$ phosphoric acid solution. 4. The shear bond strength of washing for 5seconds etched enamel which was contaminated with saliva showed sufficient bonded strength durable to occlusal force but its coefficiency score was high and therefore its clinical application was not applicable. 5. After etching, the sample contaminated with saliva showed the sufficient shear bond strength even washing 20seconds without re-etching.

• Transactions on Electrical and Electronic Materials
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• v.14 no.6
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• pp.304-307
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• 2013

Reverse engineering of semiconductor devices utilizes delayering processes, in order to identify how the interconnection lines are stacked over transistor gates. Cu metal has been used in recent fabrication technologies, and de-processes becomes more difficult with the shrinking device dimensions. In this article, reverse engineering technologies to reveal the Cu interconnection lines and Cu via-plugs embedded in dielectric layers are investigated. Stacked dielectric layers are removed by $CF_4$ plasma etching, then the exposed planar Cu metal lines and via-plugs are selectively delineated by wet chemical solution, instead of the commonly used plasma-based dry etch. As a result, we have been successful in extracting the layouts of multiple layers within a system IC, and this technique can be applicable to other logic IC, analog IC, and CMOS IC, etc.

• Journal of Korean Institute of Industrial Engineers
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• v.27 no.4
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• pp.394-405
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• 2001

Since most real-world application data involve continuous-valued attributes, properly addressing the discretization process for constructing a decision tree is an important problem. A continuous-valued attribute is typically discretized during decision tree generation by partitioning its range into two intervals recursively. In this paper, by removing the restriction to the binary discretization, we present a hybrid multi-interval discretization algorithm for discretizing the range of continuous-valued attribute into multiple intervals. On the basis of experiment using semiconductor etching machine, it has been verified that our discretization algorithm constructs a more efficient incremental decision tree compared to previously proposed discretization algorithms.

• Journal of Integrative Natural Science
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• v.2 no.1
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• pp.41-44
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• 2009

Photonic crystals containing multiple rugate structure are prepared by electrochemical etchings. Typically etched rugate PSi prepared in this study. Etching is carried out in a Teflon cell by using a two-electrode configuration with a Pt mesh counter electrode. They exhibit sharp photonic band gaps in the optical reflectivity spectrum. This reflectivity can be tuned to appear anywhere in the visible to near-infrared spectral range, depending on the programmed etch waveform. We study the method of full width half maxima and reflectivity index control by using amplitude.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.1269-1271
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• 2008

We find some array mura are caused by S/D bridge or channel open in 4 mask process. The gray tone PR thickness non-uniformity is the main reason of these defects. By the adjustment of exposure and dry etch parameters, S/D bridge and channel open ratio drops by 10.87%.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.808-810
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• 2005

Inexpensive large area arrays of thin film transistors (TFTs) on flexible substrates will enable many new display products that cannot be cost effectively manufactured by conventional means. This paper presents a new approach for low cost manufacturing of electronic devices using roll-to-roll (R2R) processes exclusively. It was developed in partnership by Hewlett Packard Laboratories and Iowa Thin Film Technologies (ITFT), a solar cell manufacturer. The approach combines ITFT's unique processes for vacuum deposition and etching of semiconductors, dielectrics and metals on continuous plastic webs with a method HP has invented for the patterning and aligning the multiple layers of a TFT with sub-micron accuracy and feature size.

• Journal of Integrative Natural Science
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• v.2 no.3
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• pp.207-210
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• 2009

Multiple rugate structures can be etched on a silicon wafer and placed in the same physical location, showing that many sharp spectral lines can be obtained in the optical reflectivity spectrum. Porous silicon samples were prepared by electrochemical etch of heavily doped p-type silicon wafers. The etching solution consisted of a 3:1 volume mixture of aqueous 48% hydrofluoric acid and absolute ethanol. Galvanostatic etch was carried out in a Teflon cell by using a two-electrode configuration with a Pt mesh counterelectrode. A sinusoidal current density waveform varying between 51.5 and $74.6mA/cm^2$ is applied. The anodization current was supplied by a Keithley 2420 high-precision constant current source which is controlled by a computer to allow the formation of PSi multilayer.

• Proceedings of the KIEE Conference
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• 1998.07g
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• pp.2509-2511
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• 1998

In this study, we formed the piezoelectric film and estimated its characteristics for sensor application. The $Pb(Zr,Ti)O_3(PZT)$ was chosen as piezoelectric material and we used Sol-Gel method to form film. To increase film thickness, the multiple coatings were performed, and the good characteristics obtained in thick film compared to thin film. Because PZT film showed fine etching property as well as other good characteristics, it was thought that it was appropriate material for sensor fabrication.