• Management Science and Financial Engineering
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• v.11 no.1
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• pp.63-78
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• 2005

Disassembly scheduling is the problem of determining the ordering and disassembly schedules of used or end-of-life products while satisfying the demand of their parts or components over a certain planning horizon. This paper considers the case of the assembly product structure for the cost-based objective of minimizing the sum of purchase, setup, inventory holding, and disassembly operation costs. To represent and solve the problem optimally, this paper presents an integer programming model, which is a reversed form of the multi-level lot sizing formulation. Computational experiments on an example derived from the literature and a number of randomly generated test problems are done and the results are reported.

• Journal of the Korean Society for Precision Engineering
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• v.9 no.4
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• pp.36-43
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• 1992

This paper presents a hierarchical real-time operation control and monitoring scheme of the FMS/CIM center which has been implemented at the Automation and Systems Research Institute of Seoul National University. The hierarchical structure of the whole scheme consists of three lavers. The upper layer is in charge of on-line scheduling, computer network control, shop-floor monitoring and command generation for AGV dispatching, machining, assembly, inspection, set-up, etc. The middle layer has six modules, which are installed in the FMS host computer with the upper layer and run on the multi-tasking basis. Each module is connected to one of six cell controllers distributed in the FMS model plant and transfers operation command down to each cell controller through the Ethernet/TCP-IP local area network. The lower layer is comprised of six cell control software modules for machining cell, assembly cell, inspection cell, set-up stations. AS/RS and AGV. Each cell controller reports the status of the manufacturing facilites to the middle layer as well as ecxecuting the appropriate sequence control of the manufacturing processes.

• Bulletin of the Korean Space Science Society
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• 2004.10b
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• pp.344-346
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• 2004

KOMPSAT-2 (Korea Multi Purpose Satellite 2) which is scheduled to launch in 2005 year will communicate with KARI TTC (Tracking, Telemetry, and Command) station flying along sun synchronous orbits (685 km). The command from KARI TTC passes S-band omni-antenna, RF assembly, and transponder and finally reachs OBC (On Board Computer). The telemetry from KOMPSAT-2 arrives at KARI TTC through inverse procedure. In this paper, RF compatibility test between KOMPSAT-2 and KARI TTC station is demonstrated. RF interface for this test was established through real space and uplink signal test and downlink signal test and uplink & downlink signal test were performed.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.14 no.1
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• pp.1-9
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• 2002

The thermal response of electronic components during infrared reflow soldering is studied by a two-dimensional numerical model. The convective, radiative and conduction heat transfer within the reflow oven as well as within the card assembly are simulated. Parametric study is also performed to determine the thermal response of electronic components to various conditions such as conveyor velocities, exhaust velocities and emissivities. The results of this study can be used in selecting the oven operating conditions to ensure proper solder melting and minimization of thermally induced card assembly stresses.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1315-1316
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• 2006

Microarray-based DNA chips provide an architecture for multi-analyte sensing. In this paper, we report a new approach for DNA chip microarray fabrication. Multifunctional DNA chip microarray was made by immobilizing many kinds of biomaterials on transducers (particles). DNA chip microarray was prepared by randomly distributing a mixture of the particles on a chip pattern containing thousands of m-scale sites. The particles occupied a different sites from site to site. The particles were arranged on the chip pattern by the random fluidic self-assembly (RFSA) method, using a hydrophobic interaction for assembly.

• Proceedings of the KIEE Conference
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• 2004.11a
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• pp.271-274
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• 2004

Microarray-based DNA chips provide an architecture for multi-analyte sensing. In this paper, we report a new approach for DNA chip microarray fabrication. Multifunctional DNA chip microarray was made by immobilizing many kinds of biomaterials on transducers (particles). DNA chip microarray was prepared by randomly distributing a mixture of the particles on a chip pattern containing thousands of m-scale sites. The particles occupied a different sites from site to site. The particles were arranged on the chip pattern by the random fluidic self-assembly (RFSA) method, using a hydrophobic interaction for assembly.

• Journal of the Korean Society for Precision Engineering
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• v.26 no.9
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• pp.31-37
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• 2009

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.280-280
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• 2013

In green plants, energy generation is accomplished through light-harvesting photosystem, which utilize abundant visible light and multi-stepwise redox reaction to oxidize water and reduce NADP+, transferring electrons efficiently with active cofactors1. Inspired by natural photosynthesis, artificial solar water-splitting devices are being designed variously. However, the several approaches involving immobilization2, conjugation3, and surface modification4 still have limitations. We have made artificial photosynthesis templates by self-assembling tyrosine-based peptide to mimick photosystem II. Porphyrin sensitizer absorbing blue light strongly was conjugated with the templates and they were hybridized with cobalt oxide through the reduction of cobalt ions in an aqueous solution. The formation of hybrid templates was characterized using TEM, and their water oxidation performance was measured by fluorescence oxygen probe. Our results suggest that the bio-templated assembly of functional compounds has a great potential for artificial photosynthesis.

• Applied Microscopy
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• v.52
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• pp.11.1-11.9
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• 2022

Zoonotic poxvirus infections pose significant threat to human health as we have witnessed recent spread of monkeypox. Therefore, insights into molecular mechanism behind poxvirus replication cycle are needed for the development of efficient antiviral strategies. Virion assembly is one of the key steps that determine the fate of replicating poxviruses. However, in-depth understanding of poxvirus assembly is challenging due to the complex nature of multi-step morphogenesis and heterogeneous virion structures. Despite these challenges, decades of research have revealed virion morphologies at various maturation stages, critical protein components and interactions with host cell compartments. Transmission electron microscopy has been employed as an indispensable tool for the examination of virion morphology, and more recently for the structure determination of protein complexes. In this review, we describe some of the major findings in poxvirus morphogenesis and the contributions of continuously advancing electron microscopy techniques.

• Steel and Composite Structures
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• v.50 no.3
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• pp.265-280
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• 2024

The collapse behavior observed in single-story beam-column assembly (SSBCA) do not accurately represent the actual overall stress characteristic of multi-story frame structure (MSFS) under column loss scenario owing to ignoring the interaction action among different stories, leading to a disconnection between the anti-collapse behaviors of "components" and "overall structures", that is, the anti-collapse performance of frame structures with two different structural scales has not yet formed a combined force. This paper conducts a numerical and theoretical study to explore the difference of the collapse behaviors of the SSBCA and MSFS, and further to reveal the internal force relationships and boundary constraints at beam ends of models SSBCA and MSFS. Based on the previous experimental tests, the corresponding refined numerical simulation models were established and verified, and comparative analysis on the resistant-collapse performance was carried out, based on the validated modeling methods with considering the actual boundary constraints, and the results illustrates that the collapse behaviors of the SSBCA and MSFS is not a simple multiple relationship. Through numerical simulation and theoretical analysis, the development laws of internal force in each story beam under different boundary constraints was clarified, and the coupling relationship between the bending moment at the most unfavorable section and axial force in the composite beam of different stories of multi story frames with weld cover-plated flange connections was obtained. In addition, considering the effect of the yield performance of adjacent columns on the anti-collapse bearing capacities of the SSBCA and MSFS during the large deformation stages, the calculation formula for the equivalent axial stiffness at the beam ends of each story were provided.