Sensitivity Analysis on the Thermal Response of Electronic Components during Infrared Reflow Soldering
![]() |
손영석
(동의대학교 기계. 산업시스템공학부 기계공학전공)
신지영 (동의대학교 기계. 산업시스템공학부 기계공학전공) |
1 |
A Detailed Model of the Infrared Reflow Soldering Process
/
DOI ScienceOn |
2 |
Enhancements of the SIMPLE Method for Predicting Incompressible Fluid Flows
/
DOI |
3 |
Heat Transfer Analysis of Infrared Reflow Soldering Process for Attaching Electronic Components to Printed Circuit Boards
/
과학기술학회마을 |
4 |
Component Thermal Management in Infrared Solder Reflow
/
|
5 |
The Process Modeling of the Infrared Reflow Soldering of Printed Circuit Board Assemblies
/
DOI |
6 |
Mixed Convection in Horizontal Channels with Discrete Material and Top Exhaust
/
DOI ScienceOn |
7 |
/
|
8 |
/
|
9 |
/
|
10 |
/
|
11 |
Thermal Effects During Infrared Solder Reflow-Part I. Heat Transfer Mechanisms
/
DOI |
12 |
Temperature Distribution in IC Plastic Packages in the Reflow Soldering Process
/
DOI ScienceOn |
13 |
Thermal Effects During Infrared Solder Reflow-Part II. A Model of the Reflow Process
/
DOI |
14 |
/
|
![]() |