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Sensitivity Analysis on the Thermal Response of Electronic Components during Infrared Reflow Soldering  

손영석 (동의대학교 기계. 산업시스템공학부 기계공학전공)
신지영 (동의대학교 기계. 산업시스템공학부 기계공학전공)
Publication Information
Korean Journal of Air-Conditioning and Refrigeration Engineering / v.14, no.1, 2002 , pp. 1-9 More about this Journal
Abstract
The thermal response of electronic components during infrared reflow soldering is studied by a two-dimensional numerical model. The convective, radiative and conduction heat transfer within the reflow oven as well as within the card assembly are simulated. Parametric study is also performed to determine the thermal response of electronic components to various conditions such as conveyor velocities, exhaust velocities and emissivities. The results of this study can be used in selecting the oven operating conditions to ensure proper solder melting and minimization of thermally induced card assembly stresses.
Keywords
Thermal response of electronic components; Infrared reflow soldering; 2-D numerical model; Multi- mode heat transfer;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
연도 인용수 순위
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