• Proceedings of the IEEK Conference
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• 1998.10a
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• pp.569-572
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• 1998

The semiconductor technology for the deep submicron $regime(0.18\mu\textrm{m})$ and larger wafer $diameters(300\mu\textrm{m})$ has been increased its cost with each wafer. Hence, in order to reduce the number of characterization experiments of a new process, lithographic modeling is more important than it was. In this paper, we introduced a new method to extract Dill ABC parameters from the refractive index changes. In order to evaluate our exact method, results of experiments and calculations for several resists were compared with other methods〔1〕through the lithographic simulation.

• Journal of Sensor Science and Technology
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• v.33 no.1
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• pp.7-11
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• 2024

Soft-pressure sensors have numerous applications in soft robotics, biomedical devices, and wearable smart devices. Herein, we present a highly sensitive electronic skin device with an isotropic wrinkled pressure sensor. A conductive ink for soft pressure sensors is produced by a solution process using polydimethylsiloxane (PDMS), poly 3-hexylthiophene (P3HT), carbon black, and chloroform as the solvents. P3HT provides high reproducibility and conductivity by improving the ink dispersibility. The conductivity of the ink is optimized by adjusting the composition of the carbon black and PDMS. Soft lithography is used to fabricate a conductive elastic structure with an isotropic wrinkled structure. Two conductive elastic structures with an isotropic wrinkle structure is stacked to develop a pressure sensor, and it is confirmed that the isotropic wrinkle structure is more sensitive to pressure than when two elastic structures with an anisotropic wrinkle structure are overlapped. Specifically, the pressure sensor fabricated with an isotropic wrinkled structure can detect extremely low pressures (1.25 Pa). Additionally, the sensor has a high sensitivity of 15.547 kpa^-1 from 1.25 to 2500 Pa and a linear sensitivity of 5.15 kPa^-1 from 2500 Pa to 25 kPa.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.11 no.6
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• pp.1099-1103
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• 2007

TFT's have been intensively researched for possible electronic and display applications. Through tremendous engineering and scientific efforts, a-Si:H TFT fabrication process was greatly improved. In this paper, the reason on defects occurring at a-Si:H TFT fabrication process is analyzed and solved, so a-Si:H TFT's yield is increased and reliability is improved. The a-Si:H TFT of this paper is inverted staggered type TFT. The gate electrode is formed by patterning with length of $8{\mu}m{\sim}16{\mu}m$ and width of $80{\sim}200{\mu}m$ after depositing with gate electrode (Cr). We have fabricated a-SiN:H, conductor, etch-stopper and photo-resistor on gate electrode in sequence, respectively. We have deposited n+a-Si:H, NPR(Negative Photo Resister) layer after forming pattern of Cr gate electrode by etch-slower pattern. The NPR layer by inverting pattern of upper Sate electrode is patterned and the n+a-Si:H layer is etched by the NPR pattern. The NPR layer is removed. After Cr layer is deposited and patterned, the source-drain electrode is formed. The a-Si:H TFT made like this has problems at photo-lithography process caused by remains of PR. When sample is cleaned, this remains of PR makes thin chemical film on surface and damages device. Therefor, in order to improve this problem we added ashing process and cleaning process was enforced strictly. We can estimate that this method stabilizes fabrication process and makes to increase a-Si:H TFT's yield.

• Journal of the Korean Magnetics Society
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• v.24 no.4
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• pp.101-106
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• 2014

The glass/Ta(5.8 nm)/NiFe(5 nm)/Cu(2.3 nm)/NiFe(3 nm)/IrMn(12 nm)/Ta(5.8 nm) GMR-SV (giantmagneto-resistance-spin valve) multilayer structure films with a magnetoresistance ratio (MR) of 5.0 % and a magnetic sensitivity (MS) of 1.5%/Oe was deposited by dc magnetron sputtering method. Also, GMR-SV device having a width of $7{\mu}m{\sim}8{\mu}m$ similar to the diameter of RBC (red blood cell) was fabricated by the light lithography process. When RBCs coupled with several magnetic beads with a diameter of $1{\mu}m$ dropped upon the GMR-SV device having MR = 1.06% and MS = 0.3 %/Oe, there is observed the variation of about included of a resistance value of ${\Delta}R=0.4{\Omega}$ and ${\Delta}MR=0.15%$ around a external magnetic field of -0.6 Oe. From these results, the GMR-SV device having the width magnitude of a few micron size can be applied as the biosensor for the analysis of a new magnetic property of hemoglobin inside of RBC combined to magnetic beads.

• Journal of the Korean Magnetics Society
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• v.22 no.5
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• pp.173-177
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• 2012

The multilayer structure of glass/Ta(5.8 nm)/NiFe(5 nm)/Cu(t nm)/NiFe(3 nm)/FeMn(12 nm)/Ta(5.8 nm) as typical GMR-SV (giant magnetoresistance-spin valve) films is prepared by ion beam sputtering deposition (IBD). The coercivity and magnetoresiatance ratio are increased and decreased for the decrease of Cu thickness when the thickness of nonmagnetic Cu layer from is varied 2.2 nm to 3.0 nm. It means that the decrease of non-magntic layer is effected to the interlayer exchange coupling of pinned layer and the spin configuration array of free layer. For experiment of detecting and dropping of magnetic beads we used the GMR-SV sensor with glass/Ta/NiFe/Cu/NiFe/FeMn/Ta structure. From the comparison of before and after for the dropping status of magnetic bead, the variations of MR ratio, $H_{ex}$, and $H_c$ are showed 0.9 %, 3 Oe, and 2 Oe, respectively. The fabrication of GMR-SV sensor was included in the process of film deposition, photo-lithography, ion milling, and MR measurement. Further, GMR-SV device can be easily integrated so that detecting biosensor on a single chip becomes possible.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.27 no.4B
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• pp.365-371
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• 2002

In this paper, the fabricated power PHEMT devices for millimeter-wave that is below a gate-length of 0.2 $\mu\textrm{m}$ using electronic beam lithography technologies, and the DC and frequency characteristics and an output power characteristics were Measured at the various bias conditions. The unit process that is used in PHEMT's manufacture used that low-resistance ohmic contact, air-bridge and back-side lapping process technologies, and so on. The fabricated power PHEMT have an S521 gain of 4 dB and a maximum transconductance(gm) of 317 mS/mm, an unilateral current gain(fT) of 62 GHz, a maximum oscillation frequency(fmax) of 120 GHz at 35 GHz, and a maximum power output(Pmax) of 16 dBm, a power gain(GP) of 4 dB and a drain efficiency(DE) of 35.5 %.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.13 no.1
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• pp.15-18
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• 2003

High purity single crystalline calcium fluoride ($CaF_2$) has excellent optical transmission characteristics down to deep UV and is therefore selected as the main optical material for the next generation of lithography apparatus operating at wavelength of 157 nm. The growth of large sized $CaF_2$ single crystals with the required properties for this optical application can be achieved only by optimizing the crystal growth process by the aid of numerical simulation. This needs especially a precise calculation of the heat transport and temperature distribution in the solid and liquid $CaF_2$ under crystal growth conditions. As $CaF_2$ is considered to be semitransparent, the internal radiative heat transfer in $CaF_2$ plays an decisive role in the simulation of the heat transport. On the other hand it is very difficult to obtain quantitative experimental data for evaluating numerical models as $CaF_2$ is extremely corrosive at high temperatures. In this work we present a newly developed experimental technique to perform temperature measurements in $CaF_2$-crystal as well as in the melt under conditions of crystal growth process. These experimental results are compared to calculated temperature data, which were obtained by using different numerical models concerning the internal heat transfer in semitransparent $CaF_2$. It will be shown, that an advanced model, which was developed by the authors, gives a much better agreement with experimental data as a standard model, which was taken from the literature.

• Korean Journal of Materials Research
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• v.28 no.4
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• pp.208-213
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• 2018

Epitaxial ($11{\bar{2}}0$) a-plane GaN films were grown on a ($1{\bar{1}}02$) R-plane sapphire substrate with photoresist (PR) masks using metal organic chemical vapor deposition (MOCVD). The PR mask with striped patterns was prepared using an ex-situ lithography process, whereas carbonization and heat treatment of the PR mask were carried out using an in-situ MOCVD. The heat treatment of the PR mask was continuously conducted in ambient $H_2/NH_3$ mixture gas at $1140^{\circ}C$ after carbonization by the pyrolysis in ambient $H_2$ at $1100^{\circ}C$. As the time of the heat treatment progressed, the striped patterns of the carbonized PR mask shrank. The heat treatment of the carbonized PR mask facilitated epitaxial lateral overgrowth (ELO) of a-plane GaN films without carbon contamination on the R-plane sapphire substrate. Thhe surface morphology of a-plane GaN films was investigated by scanning electron microscopy and atomic force microscopy. The structural characteristics of a-plane GaN films on an R-plane sapphire substrate were evaluated by ${\omega}-2{\theta}$ high-resolution X-ray diffraction. The a-plane GaN films were characterized by X-ray photoelectron spectroscopy (XPS) to determine carbon contamination from carbonized PR masks in the GaN film bulk. After $Ar^+$ ion etching, XPS spectra indicated that carbon contamination exists only in the surface region. Finally, the heat treatment of carbonized PR masks was used to grow high-quality a-plane GaN films without carbon contamination. This approach showed the promising potential of the ELO process by using a PR mask.

• Journal of the Korean Magnetics Society
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• v.13 no.3
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• pp.115-120
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• 2003

We have developed laser micro-machining technology for fabrication of the micro thin-film inductors. After the thin layers of FM/M/FM films were coated to the silicon substrate by using the conventional sputtering method, the new laser machining was applied to the patterning process that used to be carried out by the semiconductor lithography procedure. A CW Nd:YAG laser operating in TEM$\sub$00/ mode was actively Q-switched to obtain the very short pulse of 200 ns. The laser micro-machining process with pulse energy and repetition rate have been optimized as 5 mJ/pulse and 5 kHz, respectively, to obtain the line resolution as fine as 20 $\mu\textrm{m}$.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.12
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• pp.1101-1106
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• 2014

Hybrid manufacturing technology has been advanced to overcome limitations due to traditional fabrication methods. To fabricate a micro/nano-scale structure, various manufacturing technologies such as lithography and etching were attempted. Since these manufacturing processes are limited by their materials, temperature and features, it is necessary to develop a new three-dimensional (3D) printing method. A novel nano-scale 3D printing system was developed consisting of the Nano-Particle Deposition System (NPDS) and the Focused Ion Beam (FIB) to overcome these limitations. By repeating deposition and machining processes, it was possible to fabricate micro/nano-scale 3D structures with various metals and ceramics. Since each process works in different chambers, a transfer process is required. In this research, nanoscale 3D printing system was briefly explained and an alignment algorithm for nano-scale 3D printing system was developed. Implementing the algorithm leads to an accepted error margin of 0.5% by compensating error in rotational, horizontal, and vertical axes.