• Title/Summary/Keyword: high-throughput process

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Throughput-efficient Online Relay Selection for Dual-hop Cooperative Networks

  • Lin, Yuan;Li, Bowen;Yin, Hao;He, Yuanzhi
    • KSII Transactions on Internet and Information Systems (TIIS)
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    • v.9 no.6
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    • pp.2095-2110
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    • 2015
  • This paper presents a design for a throughput-efficient online relay selection scheme for dual-hop multi-relay cooperative networks. Problems arise with these networks due to unpredictability of the relaying link quality and high time-consumption to probe the dual-hop link. In this paper, we firstly propose a novel probing and relaying protocol, which greatly reduces the overhead of the dual-hop link estimation by leveraging the wireless broadcasting nature of the network. We then formulate an opportunistic relay selection process for the online decision-making, which uses a tradeoff between obtaining more link information to establish better cooperative relaying and minimizing the time cost for dual-hop link estimation to achieve higher throughput. Dynamic programming is used to construct the throughput-optimal control policy for a typically heterogeneous Rayleigh fading environment, and determines which relay to probe and when to transmit the data. Additionally, we extend the main results to mixed Rayleigh/Rician link scenarios, i.e., where one side of the relaying link experiences Rayleigh fading while the other has Rician distribution. Numerical results validate the effectiveness and superiority of our proposed relaying scheme, e.g., it achieves at least 107% throughput gain compared with the state of the art solution.

Full validation of high-throughput bioanalytical method for the new drug in plasma by LC-MS/MS and its applicability to toxicokinetic analysis

  • Han, Sang-Beom
    • Proceedings of the Korean Society of Toxicology Conference
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    • 2006.11a
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    • pp.65-74
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    • 2006
  • Modem drug discovery requires rapid pharmacokinetic evaluation of chemically diverse compounds for early candidate selection. This demands the development of analytical methods that offer high-throughput of samples. Naturally, liquid chromatography / tandem mass spectrometry (LC-MS/MS) is choice of the analytical method because of its superior sensitivity and selectivity. As a result of the short analysis time(typically 3-5min) by LC-MS/MS, sample preparation has become the rate- determining step in the whole analytical cycle. Consequently tremendous efforts are being made to speed up and automate this step. In a typical automated 96-well SPE(solid-phase extraction) procedure, plasma samples are transferred to the 96-well SPE plate, internal standard and aqueous buffer solutions are added and then vacuum is applied using the robotic liquid handling system. It takes only 20-90 min to process 96 samples by automated SPE and the analyst is physically occupied for only approximately 10 min. Recently, the ultra-high flow rate liquid chromatography (turbulent-flow chromatography)has sparked a huge interest for rapid and direct quantitation of drugs in plasma. There is no sample preparation except for sample aliquotting, internal standard addition and centrifugation. This type of analysis is achieved by using a small diameter column with a large particle size(30-5O ${\mu}$m) and a high flow rate, typically between 3-5 ml/min. Silica-based monolithic HPLC columns contain a novel chromatographic support in which the traditional particulate packing has been replaced with a single, continuous network (monolith) of pcrous silica. The main advantage of such a network is decreased backpressure due to macropores (2 ${\mu}$m) throughout the network. This allows high flow rates, and hence fast analyses that are unattainable with traditional particulate columns. The reduction of particle diameter in HPLC results in increased column efficiency. use of small particles (<2 urn), however, requires p.essu.es beyond the traditional 6,000 psi of conventional pumping devices. Instrumental development in recent years has resulted in pumping devices capable of handling the requirements of columns packed with small particles. The staggered parallel HPLC system consists of four fully independent binary HPLC pumps, a modified auto sampler, and a series of switching and selector valves all controlled by a single computer program. The system improves sample throughput without sacrificing chromatographic separation or data quality. Sample throughput can be increased nearly four-fold without requiring significant changes in current analytical procedures. The process of Bioanalytical Method Validation is required by the FDA to assess and verify the performance of a chronlatographic method prior to its application in sample analysis. The validation should address the selectivity, linearity, accuracy, precision and stability of the method. This presentation will provide all overview of the work required to accomplish a full validation and show how a chromatographic method is suitable for toxirokinetic sample analysis. A liquid chromatography/tandem mass spectrometry (LC-MS/MS) method developed to quantitate drug levels in dog plasma will be used as an example of tile process.

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Development of Rapid Thermal Processor for Large Glass LTPS Production

  • Kim, Hyoung-June;Shin, Dong-Hoon
    • 한국정보디스플레이학회:학술대회논문집
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    • 2006.08a
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    • pp.533-536
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    • 2006
  • VIATRON TECHNOLOGIES has developed Field-Enhanced Rapid Thermal Processor (FERTP) system that enables LTPS LCD and AMOLED manufacturers to produce poly-Si films at low cost, high throughput, and high yield. The FE-RTP allows the diverse process options including crystallization, thermal oxidation of gate oxides and fast pre-compactions. The process and equipment compatibility with a-Si TFT lines is able to provide a viable solution to produce poly-Si TFTs using a-Si TFT lines.

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Developing Low Cost, High Throughput Si Through Via Etching for LED Substrate (LED용 Si 기판의 저비용, 고생산성 실리콘 관통 비아 식각 공정)

  • Koo, Youngmo;Kim, GuSung;Kim, Sarah Eunkyung
    • Journal of the Microelectronics and Packaging Society
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    • v.19 no.4
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    • pp.19-23
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    • 2012
  • Silicon substrate for light emitting diodes (LEDs) has been the tendency of LED packaging for improving power consumption and light output. In this study, a low cost and high throughput Si through via fabrication has been demonstrated using a wet etching process. Both a wet etching only process and a combination of wet etching and dry etching process were evaluated. The silicon substrate with Si through via fabricated by KOH wet etching showed a good electrical resistance (${\sim}5.5{\Omega}$) of Cu interconnection and a suitable thermal resistance (4 K/W) compared to AlN ceramic substrate.

Applying scheduling techniques for improving the performance of network equipment network subsystem (네트워크 장비 성능 향상을 위한 네트워크 서브시스템 스케줄링 기법 적용)

  • Bae, Byoungmin;Kim, MinJung;Lee, GowangLo;Jung, YungJoon
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2013.05a
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    • pp.65-67
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    • 2013
  • The recent high-performance network equipment is required, and also require high network bandwidth utilization. It is a trend to develop increasingly using multi-core processors for high-performance network servers. Propose a method to improve the performance of the network sub-system, considering the characteristics of multi-core as a way to improve these high-performance and high network throughput. In this paper, we confirm through experiments on how to improve the communication performance, optimize performance and take full advantage of multi-core by Network communication process to improve the performance of the multi-core processor architecture, the process of concentration, the overhead for each core, based on network traffic according to the interrupt affinity in this process to determine the optimal core to give. The experiments were implemented in the Linux kernel, and experiments to improve the network throughput up to 30%, bringing reduces the Linux communication process to improve the performance of the processor overhead of up to 10%.

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Numerical Analysis for Improvement of Cooling Performance in Nanoimprint Lithography Process (나노임프린트 공정에서의 냉각성능 개선에 대한 수치해석)

  • Lee, Ki-Yeon;Jun, Sang-Bum;Kim, Kug-Weon
    • Journal of the Semiconductor & Display Technology
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    • v.10 no.4
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    • pp.89-94
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    • 2011
  • In recent years there have been considerable attentions on nanoimprint lithography (NIL) by the display device and semiconductor industry due to its potential abilities that enable cost-effective and high-throughput nanofabrication. A major disadvantage of thermal NIL is the thermal cycle, that is, heating over glass transition temperature and then cooling below it, which requires a significant amount of processing time and limits the throughput. One of the methods to overcome this disadvantage is to improve the cooling performance in NIL process. In this paper, a numerical analysis model of cooling system in thermal NIL was development by CAD/CAE program and the performance of the cooling system was analyzed by the model. The calculated temperatures of nanoimprint device were verified by the measurements. By using the analysis model, the case that the cooling material is replaced by liquid nitrogen is investigated.

Characterization of Al2O3 Thin Film Encasulation by Plasma Assisted Spatial ALD Process for Organic Light Emitting Diodes

  • Yong, Sang Heon;Cho, Sung Min;Chung, Ho Kyoon;Chae, Heeyeop
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.234.2-234.2
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    • 2014
  • Organic light emitting diode (OLED) is considered as the next generation flat panel displays due to its advantages of low power consumption, fast response time, broad viewing angle and flexibility. For the flexible application, it is essential to develop thin film encapsulation (TFE) to protect oxidation of organic materials from oxidative species such as oxygen and water vapor [1]. In many TFE research, the inorganic film by atomic layer deposition (ALD) process demonstrated a good barrier property. However, extremely low throughput of ALD process is considered as a major weakness for industrial application. Recently, there has been developed a high throughput ALD, called 'spatial ALD' [2]. In spatial ALD, the precursors and reactant gases are supplied continuously in same chamber, but they are separated physically using a purge gas streams to prevent mixing of the precursors and reactant gases. In this study, the $Al_2O_3$ thin film was deposited by spatial ALD process. We characterized various process variables in the spatial ALD such as temperature, scanning speed, and chemical compositions. Water vapor transmission rate (WVTR) was determined by calcium resistance test and less than $10-^3g/m^2{\cdot}day$ was achieved. The samples were analyzed by x-ray photoelectron spectroscopy (XPS) and field emission scanning electron microscope (FE-SEM).

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Oxide Planarization of Trench Structure using Chemical Mechanical Polishing(CMP) (기계화학적 연마를 이용한 트렌치 구조의 산화막 평탄화)

  • 김철복;김상용;서용진
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.15 no.10
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    • pp.838-843
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    • 2002
  • Chemical mechanical polishing(CMP) process has been widely used to planarize dielectric layers, which can be applied to the integrated circuits for deep sub-micron technology. The reverse moat etch process has been used for the shallow trench isolation(STI)-chemical mechanical polishing(CMP) process with conventional low selectivity slurries. Thus, the process became more complex, and the defects were seriously increased. In this paper, we studied the direct STI-CMP process without reverse moat etch step using high selectivity slurry(HSS). As our experimental results show, it was possible to achieve a global planarization without the complicated reverse moat process, the STI-CMP process could be dramatically simplified, and the defect level was reduced. Therefore the throughput, yield, and stability in the ULSI semiconductor device fabrication could be greatly improved.

Flow Behaviors of Polymers in Micro Hot Embossing Process (미세 핫엠보싱 공정에서 폴리머의 유동특성)

  • Ban Jun Ho;Shin Jai Ku;Kim Byeong Hee;Kim Heon Young
    • Journal of the Korean Society for Precision Engineering
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    • v.22 no.8 s.173
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    • pp.159-164
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    • 2005
  • The Hot Embossing Lithography(HEL) as a method fur the fabrication of the nanostructure with polymer is becoming increasingly important because of its simple process, low cost, high replication fidelity and relatively high throughput. In this paper, we carried out experimental studies and numerical simulations in order to understand the viscous flow of the polymer (PMMA) film during the hot embossing process. To grasp the characteristics of the micro patterning rheology by process parameters (embossing temperature, pressure and time), we have carried out various experiments by using the nickel-coated master fabricated by the deep RIE process and the plasma sputtering. During the hot embossing process, we have observed the characteristics of the viscoelastic behavior of polymer. Also, the viscous flow during the hot embossing process has been simulated by the continuum based FDM(Finite Difference Method) analysis considering the micro effect, such as a surface tension and a contact angle.