Browse > Article

Flow Behaviors of Polymers in Micro Hot Embossing Process  

Ban Jun Ho (강원대학교 기계 메카트로닉스공학과 대학원)
Shin Jai Ku (강원대학교 기계 메카트로닉스공학과 대학원)
Kim Byeong Hee (강원대학교 기계 메카트로닉스공학부)
Kim Heon Young (강원대학교 기계 메카트로닉스공학부)
Publication Information
Journal of the Korean Society for Precision Engineering / v.22, no.8, 2005 , pp. 159-164 More about this Journal
Abstract
The Hot Embossing Lithography(HEL) as a method fur the fabrication of the nanostructure with polymer is becoming increasingly important because of its simple process, low cost, high replication fidelity and relatively high throughput. In this paper, we carried out experimental studies and numerical simulations in order to understand the viscous flow of the polymer (PMMA) film during the hot embossing process. To grasp the characteristics of the micro patterning rheology by process parameters (embossing temperature, pressure and time), we have carried out various experiments by using the nickel-coated master fabricated by the deep RIE process and the plasma sputtering. During the hot embossing process, we have observed the characteristics of the viscoelastic behavior of polymer. Also, the viscous flow during the hot embossing process has been simulated by the continuum based FDM(Finite Difference Method) analysis considering the micro effect, such as a surface tension and a contact angle.
Keywords
Hot embossing; PMMA(polymethylmethacrylate); Viscosity; Contact angle; Micro rheology;
Citations & Related Records
연도 인용수 순위
  • Reference
1 Chen, A., Lebib, A., Carcenac, F., Launois, H., Schmidt, G., Tormen, M., Muller, G. and Reinhoudl, N., 'Micro contact printing and pattern transfer with a tri-layer processing,' Microelectronic Engineering, Vol. 53, No. 1-4, pp. 253-256, 2000   DOI   ScienceOn
2 Heng, Y., Minhang, B., Shaoqun, S., Xinxin, L., Dacheng, Z. and Guoyin, W., 'A novel technique for measuring etch rate distribution of Si,' Sensors and Actuators A: Physical, Vol. 79, No.2, pp. 136-140, 2000   DOI   ScienceOn
3 Bogdanski, N., Schulz, H., Wissen, M., Scheer, C., Zajadacz, J. and Zimmer, K., '3D-Hot embossing of undercut structures - an approach to micro-zippers,' Microelectronic Engineering, Vol. 73-74, pp. 190-195, 2004   DOI
4 Guotuan, G., Zhijun, Z. and Hongxin, D., 'Preparation and characterization of hydrophobic organic-inorganic composite thin films of $PMMA/SiO_2/TiO_2$ with low friction coefficient,' Applied Surface Science, Vol. 221, issues 1-4, pp. 129-135, 2004   DOI
5 Hirai, Y., Fujiwara, M., Okuno, T. and Tanaka, Y., 'Study of the resist deformation in nanoimprint lithography,' Journal of Vacuum Science and Technology B, Vol. 19, No.6, pp. 2811-2815, 2001   DOI   ScienceOn
6 Schift, H., Jaszewski, R. W., David, Cand., Gobrecht, J., 'Nanostructuring of polymers and fabrication of interdigitated electrodes by hot embossing lithography,' Microelectronic Engineering, Vo1.46, pp. 121-124, 1999   DOI   ScienceOn
7 Becker, H., Heim, U., 'Hot embossing as a method for the fabrication of polymer high aspect ratio structures,' Sensors and Actuators A: Physical, Vol. 83, No. 1-3, pp. 130-135, 2000   DOI   ScienceOn
8 Piraux, L., George, J. M., Despres, J. F., Leroy, C., Ferain, E., Legras, R., Ounadjela, K., Fert, A., 'Giant magnetoresistance in magnetic multilayered nanowires,' Applied Physics Letters, Vol. 65, No. 19, pp. 2484-2486, 1994   DOI   ScienceOn
9 Chou, S. Y., Krauss, P.R. and Renstrom, P. J., 1995, ' Imprint of Sub-25 nm Vias and Trenches in Polymers,'Appl. Phys. lett., Vol. 67, Issue 21, pp. 3114~3116   DOI   ScienceOn