• 한국전기전자재료학회논문지
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• 제18권11호
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• pp.977-982
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• 2005

Al/AlN/n-type 6H-SiC (0001) MIS structures were prepared by AlN layers on vicinal 6H-SiC(0001) substrates with reactive RF magnetron sputtering method. The AlN films were annealed at $900^{\circ}C$, $N_2$ atmosphere lot 1 minutes showed the best result. With XRD analysis, AlN(0002) peak was clearly found. The typical dielectric constant value of the AlN film in the MIS capacitors was obtained as 8.4 from photo C-V. Also, the gate leakage current density of the MlS capacitor was $10^{-10}\;A/cm^2$ order within the electric field of 1.8 MV/cm. Finally, the amount of interface trap densities, $D_{it}$, was evaluated as $5.3\times10^{10}\;eV^{-1}cm^{-2}$ at (Ec-0.85) eV.

• 한국전기전자재료학회논문지
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• 제21권4호
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• pp.329-334
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• 2008

Aluminum oxide films were deposited on n-type GaN substrates by RF magnetron sputtering technique for MIS devices applications using optimized conditions, Well-behaved C - V characteristics were obtained measured in MIS capacitors structures. The calculated interface trap density measured at $300^{\circ}C$ was about $9\times10^{10}/cm^2$ eV in the upper bandgap. The gate leakage current densities of the MIS structures were about $10^{-9}A/cm^2$ and about $10^{-4}A/cm^2$ measured at room temperature and at $300^{\circ}C$ for $a{\pm}1MV/cm$, respectively. These results indicate that the interface property of this structure is enough quality to MIS devices applications.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1994년도 하계학술대회 논문집 C
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• pp.1463-1465
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• 1994

The electrical characteristics of $Al/Ta_2O_5/Si$ metal-oxide-semiconductor (MOS) capacitors were studied. $Ta_2O_5$ films on p-type silicon had been prepared by ionized cluster beam epitaxy technique (ICBE). This $Ta_2O_5$ films have low leakage current, high breakdown strength and low flat band shift. In this research, a single crystalline cpitaxial film of $Ta_2O_5$ has been grown on p-Si wafer using an ICBE technique. The native oxide layer ($SiO_2$) on the silicon substrate was removed below $500^{\circ}C$ by use of an accelerated arsenic ion beam, instead of a high temperature deposition. $Ta_2O_5$ films formed by ICBE technique can be received considerable attention for applications to coupling capacitors, gate dielectrics in MOS devices, and memory storage capacitor insulator because of their high dielectric constants above 20 and low temperature process.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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• pp.998-1001
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• 2009

A new flexible TFT backplane structure with improved mechanical reliability is proposed. Amorphous indium-gallium-zinc-oxide (a-IGZO) thin film transistors based on this structure have been fabricated on a polyimide substrate, and the resultant mechanical durability has been evaluated in a cyclic bending test. The panel can withstand 10,000 bending cycles at a bending radius of 5 mm without any noticeable TFT degradation. After 10K bending cycles, the change of threshold voltage, mobility, sub-threshold slope, and gate leakage current were only -0.22V, -0.13$cm^2$/V-s, -0.05V/decade, and $-3.05{\times}10^{-13}A$, respectively.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 추계학술대회 논문집 전기물성,응용부문
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• pp.65-66
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• 2006

AIGaN/GaN 고전자 이동도 트랜지스터 (High Electron Mobility Transistors, HEMTs)는 와이드 밴드-갭과 높은 항복 전계 및 우수한 채널 특성으로 인해 마이크로파 응용분야와 전력용 반도체에서 각광받고 있다. 최근, 전력 응용분야에서 요구되는 높은 항복 전압과 출력, 우수한 주파수 특성을 획득하기 인해 이중 게이트 AIGaN/GaN HEHTs에 관한 연구가 발표되고 있다. 본 논문에서는 AIGaN/GaN HEMTs에 이중 게이트를 적용하여, 두 개의 게이트와 드레인, 소스의 누설 전류를 각각 측정하여 이중 게이트 AIGaN/GaN HEMTS의 누설 전류 메커니즘을 분석하였다. 또한 제안된 소자의 $SiO_2$ 패시베이션 전 후의 누설 전류 특성을 비교하였다. $SiO_2 $ 패시베이션되지 않은 소자의 누설 전류는 드레인, 소스와 추가 게이트로부터 주 게이트로 흐른 반면, 패시베이션 된 소자 누설 전류는 드레인으로부터 주 게이트 방향의 누설 전류만 존재하였다. $SiO_2$ 패시베이션 된 소자의 누설 전류는 (87.31 nA ) 패시베이션 되지 않은 소자의 누설 전류 ( $8.54{\mu}A$ )에 비해 의게 감소하였다.

• 한국전기전자재료학회논문지
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• 제20권12호
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• pp.1017-1021
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• 2007

To implement tera bit level non-volatile memories of low power and fast operation, proving statistical reproductivity and satisfying reliabilities at the nano-scale are a key challenge. We fabricate the charge trapping nano scaled SONOS unit memories and 64 bit flash arrays and evaluate reliability and performance of them. In case of the dielectric stack thickness of 4.5 /9.3 /6.5 nm with the channel width and length of 34 nm and 31nm respectively, the device has about 3.5 V threshold voltage shift with write voltage of $10\;{\mu}s$, 15 V and erase voltage of 10 ms, -15 V. And retention and endurance characteristics are above 10 years and $10^5$ cycle, respectively. The device with LDD(Lightly Doped Drain) process shows reduction of short channel effect and GIDL(Gate Induced Drain Leakage) current. Moreover we investigate three different types of flash memory arrays.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 하계학술대회 논문집
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• pp.743-746
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• 2000

Metal-ferroelectric-insulator-semiconductor(MFIS) devices using Pt/$LiNbO_3$/Si structure were successfully fabricated. The dielectric constant of the AIN film calculated from the capacitance in the accumulation region in the capacitance-voltage(C-V) curve was about 8.2. The gate leakage current density of MIS devices using a aluminum electrode showed the least value of 1$\times$$1O^{-8}$A/$cm^2$ order at the electric field of 500kV/cm. The dielectric constant of $LiNbO_3$film on AIN/Si structure was about 23 derived from 1MHz capacitance-voltage (C-V) measurement and the resistivity of the film at the field of 500kV/cm was about 5.6$\times$ $1O^{13}$ $\Omega$.cm.

• 전기전자학회논문지
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• 제23권3호
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• pp.988-993
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• 2019

지난 수십 년간 반도체 업계에서는 반도체 소자의 성능을 높이고 높은 밀도로 반도체 소자를 칩 위에 집적하기 위해 끊임없이 그 크기를 축소해 왔다. 하지만, 게이트 제어의 감소, 높아진 누설 전류, 그리고 단 채널 효과와 같은 다양한 문제점에 직면하면서 이를 극복할 수 있는 차세대 반도체에 점점 더 많은 관심을 보이고 있다. 본 논문에서는 다음 반도체 세대를 이끌 후보로 관심을 받고 있는 CNTFET(Carbon NanuTube Field Effect Transistor)을 활용하여 디지털 회로를 디자인하는 방법에 대해 논하고자 한다. CNTFET이 분명 구조적으로 기존 MOSFET과 다른 구조를 가진 만큼, CNTFET을 활용하여 디지털 회로를 디자인할 때, 기존 디지털 회로 기법을 어떻게 활용할 수 있는지 자세히 알아보고 시뮬레이션을 통해 두 소자의 성능 차이를 확인해 보고자 한다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제38회 동계학술대회 초록집
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• pp.257-257
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• 2010

One of the critical issues for applications of flexible organic thin film transistors (OTFTs) for flexible electronic systems is the electrical stabilities of the OTFT devices, including variation of the current on/off ratio ($I_{on}/I_{off}$), leakage current, threshold voltage, and hysteresis, under repetitive mechanical deformation. In particular, repetitive mechanical deformation accelerates the degradation of device performance at the ambient environment. In this work, electrical stabilities of the pentacene organic thin film transistors (OTFTs) employing multi-stack hybrid encapsulation layers were investigated under mechanical cyclic bending. Flexible bottom-gated pentacene-based OTFTs fabricated on flexible polyimide substrate with poly-4-vinyl phenol (PVP) dielectric as a gate dielectric were encapsulated by the plasma-deposited organic layer and atomic layer deposited inorganic layer. For cyclic bending experiment of flexible OTFTs, the devices were cyclically bent up to $10^5$ times with 5mm bending radius. In the most of the devices after $10^5$ times of bending cycles, the off-current of the OTFT with no encapsulation layers was quickly increased due to increases in the conductivity of the pentacene caused by doping effects from $O_2$ and $H_2O$ in the atmosphere, which leads to decrease in the $I_{on}/I_{off}$ and increase in the hysteresis. With encapsulation layers, however, the electrical stabilities of the OTFTs were improved significantly. In particular, the OTFTs with multi-stack hybrid encapsulation layer showed the best electrical stabilities up to the bending cycles of $10^5$ times compared to the devices with single organic encapsulation layer. Changes in electrical properties of cyclically bent OTFTs with encapsulation layers will be discussed in detail.

• 한국진공학회지
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• 제16권5호
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• pp.359-365
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• 2007

본 논문에서는 zinc oxide (ZnO)와 gallium이 도핑 된 zinc oxide (GZO)를 이용하여 radio frequency (RF) magnetron sputtering 방법에 의해 상온에서 제작된 bottom-gate 박막 트랜지스터의 특성을 평가하고 분석하였다. 게이트 절연층 물질로서 새로운 물질을 사용하지 않고 열적 성장된 $SiO_2$를 사용하여 게이트 누설 전류를 수 pA 수준까지 줄일 수 있었다. ZnO와 GZO 박막의 표면 제곱평균제곱근은 각각 1.07 nm, 1.65 nm로 측정되었다. 그리고 ZnO 박막은 80% 이상, GZO 박막은 75% 이상의 투과도를 가지고 있었고, 박막의 두께에 따라 투과도가 달라졌다. 또한 두 시료 모두 (002) 방위로 잘 정렬된 wurtzite 구조를 가지고 있었다. 제작된 ZnO 박막 트랜지스터는 2.5 V의 문턱 전압, $0.027\;cm^2/(V{\cdot}s)$의 전계효과 이동도, 104의 on/off ratio, 1.7 V/decade의 gate voltage swing 값들을 가지고 있었고, enhancement 모드 특성을 가지고 있었다. 반면에 GZO 박막 트랜지스터의 경우에는 -3.4 V의 문턱 전압, $0.023\;cm^2/(V{\cdot}s)$의 전계효과 이동도, $2{\times}10^4$의 on/off ratio, 3.3 V/decade의 gate voltage swing 값들을 가지고 있었고, depletion 모드 특성을 가지고 있었다. 우리는 기존의 ZnO와 1wt%의 Ga이 도핑된 ZnO를 이용하여 두 가지 모드의 트랜지스터 특성을 보이는 박막 트랜지스터를 성공적으로 제작하고 분석하였다.