• Journal of Power Electronics
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• 제17권3호
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• pp.601-609
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• 2017

Gallium nitride (GaN) power switching devices are promising candidates for high switching frequency and high efficiency power conversion due to their fast switching, low on-state resistance, and high-temperature operation capability. In order to facilitate the use of these new devices better, it is required to investigate the device characteristics and performance in detail preferably by comparing with various conventional silicon (Si) devices. This paper presents a comprehensive study of GaN high electron mobility transistor (HEMT) based non-isolated point-of-load (POL) synchronous buck converter operating at 2.7 MHz with a high step-down ratio (24 V to 3.3 V). The characteristics and performance of GaN HEMT and three different Si devices are analytically investigated and the optimal operating point for GaN HEMT is discussed. Zero-voltage switching (ZVS) is implemented to minimize switching loss in high switching frequency operation. The prototype circuit and experimental data support the validity of analytical and simulation results.

• 한국산학기술학회논문지
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• 제9권3호
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• pp.649-657
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• 2008

본 논문은 트랜지스터 다이, 칩 커패시터, 커패시터와 트랜지스터 다이를 연결하는 와이어 본딩으로 구성된 질화갈륨 고출력 트랜지스터 패키지에 있어서, 그 출력 성능의 최적화에 대하여 언급한다. 와이어 본딩 방법에 따른 출력 전력의 최적화된 결과와, 와이어 본딩과 바이어스 조건에 따른 3차 상호변호 특성 최적화 등이 기술되어 있다. 또한 본 논문에는 제한된 면적내의 고출력 트랜지스터 패키지에서 와이어 본딩으로 구현된 인덕턴스에 따라 얼마나 그 출력 성능이 민감하게 반응하는지를 시뮬레이션을 통하여 제시하고 있다.

• 전력전자학회논문지
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• 제24권4호
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• pp.259-267
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• 2019

An active clamp flyback (ACF) converter applies a clamp circuit and circulates the energy of leakage inductance to the input side, thereby achieving a zero-voltage switching (ZVS) operation and greatly reducing switching losses. The switching losses are further reduced by applying a gallium nitride field effect transistor (GaN-FET) with excellent switching characteristics, and ZVS operation can be accomplished under light load with boundary conduction mode (BCM) operation. Optimal design is performed on the basis of loss analysis by selecting magnetization inductance based on BCM operation and a clamp capacitor for loss reduction. Therefore, the size of the reactive element can be reduced through high-frequency operation, and a high-efficiency and high-power-density converter can be achieved. This study proposes an optimal design for a high-efficiency and high-power-density BCM ACF converter based on GaN-FETs and verifies it through experimental results of a 65 W-rated prototype.

• 전기전자학회논문지
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• 제23권1호
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• pp.326-329
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• 2019

차세대 전력반도체 소재인 질화갈륨(GaN)이 증착된 GaN-on-Si 기판의 기술성숙도가 높아지면서 Si CMOS 소자와의 단일기판 집적화에 대한 관심이 고조되고 있다. CMOS 특성이 상대적으로 저하되는 (111)Si 보다 (110)Si의 CMOS소자가 집적화 관점에서 유리할 것으로 판단되며, 따라서 향후 전개될 GaN-on-(110)Si 플랫폼을 활용한 GaN 전력반도체 스위치소자와 Si CMOS소자의 단일기판 집적화에 적용될 수 있도록 국내 Si CMOS 파운드리 공정을 (110)Si 기판에 진행하였다. 제작된 CMOS소자의 기본특성 및 인버터체인 회로특성, 그리고 게이트 산화막의 신뢰성 분석을 통해 향후 국내 파운드리공정을 활용한 (110)Si CMOS기술과 GaN의 집적화의 가능성을 검증하였다.

• 마이크로전자및패키징학회지
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• 제25권4호
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• pp.9-15
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• 2018

This paper shows the principles and characteristics of the transient liquid phase (TLP) bonding technology for power modules packaging. The power module is semiconductor parts that change and manage power entering electronic devices, and demand is increasing due to the advent of the fourth industrial revolution. Higher operation temperatures and increasing current density are important for the performance of power modules. Conventional power modules using Si chip have reached the limit of theoretical performance development. In addition, their efficiency is reduced at high temperature because of the low properties of Si. Therefore, Si is changed to silicon carbide (SiC) and gallium nitride (GaN). Various methods of bonding have been studied, like Ag sintering and Sn-Au solder, to keep up with the development of chips, one of which is TLP bonding. TLP bonding has the advantages in price and junction temperature over other technologies. In this paper, TLP bonding using various materials and methods is introduced. In addition, new TLP technologies that are combined with other technologies such as metal powder mixing and ultrasonic technology are also reviewed.

• 마이크로전자및패키징학회지
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• 제28권1호
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• pp.13-20
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• 2021

GaN은 III-V족 화합물 반도체로 밴드갭을 조절하는 것이 가능하고 화학적으로 안정하기 때문에 다른 물질에 비해 산성, 염기성 용액에서 부식이 적다. 또한 GaN의 밴드갭이 물의 산화·환원 준위를 포함하고 있어 외부전압 없이 물 분해가 가능하다는 장점이 있다. 하지만 GaN 자체만으로는 태양광-수소 변환 효율(solar-to-hydrogen conversion efficiency, STH)이 낮아 이를 개선하기 위해 최근 활발한 연구가 이루어지고 있다. 본 총설에서는 GaN을 PEC 물분해의 광전극으로 사용하기 위한 방법들과 연구에 대해 정리하였다.

• 센서학회지
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• 제31권4호
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• pp.271-277
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• 2022

We analyzed the effects of the interface trap on the output characteristics of an inversion mode n-channel GaN Schottky barrier (SB)-MOSFET based on the N_it distribution using TCAD simulation. As interface trap number density (N_it) increased, the threshold voltage increased while the drain current density decreased. Under N_it=5.0×10¹⁰ cm^-2 condition, the threshold voltage was 3.2 V for V_DS=1 V, and the drain current density reduced to 2.4 mA/mm relative to the non-trap condition. Regardless of the N_it distribution type, there was an increase in the subthreshold swing (SS) following an increase in N_it. Under U-shaped N_it distribution, it was confirmed that the SS varied depending on the gate voltage. The interface fixed charge (Q_f) caused an shift in the threshold voltage and increased the off-state current collectively with the surface trap. In summary, GaN SB-MOSFET can be a building block for high power UV optoelectronic circuit provided the surface state is significantly reduced.

• 전자통신동향분석
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• 제37권5호
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• pp.11-21
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• 2022

GaN (Gallium-Nitride) is a promising candidate material in various radio frequency applications due to its inherent properties including wide bandgap, high carrier concentration, and high electron mobility/saturation velocity. Notably, AlGaN/GaN heterostructure field effect transistor exhibits high operating voltage and high power-density/power at high frequency. In next-generation radar systems, GaN power transistors and monolithic microwave integrated circuits (MMICs) are significant components of transmitting and receiving modules. In this paper, we introduce technological trends for C-/X-/Ku-band GaN MMICs including power amplifiers, low noise amplifiers and switch MMICs, focusing on the status of GaN MMIC fabrication technology and GaN foundry service. Additionally, we review the research for the localization of C-/X-/Ku-band GaN MMICs using in-house GaN transistor and MMIC fabrication technology. We also discuss the results of C-/X-/Ku-band GaN MMICs developed at Defense Materials and Components Convergence Research Department in ETRI.

• 한국전자파학회논문지
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• 제30권6호
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• pp.467-478
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• 2019

본 논문에서는 전자전용 재밍 송신기에 사용하기 위해서 개발된 광대역 평면형 능동위상배열 안테나 시스템의 설계 및 제작 그리고 측정 결과를 소개한다. 설계된 시스템은 $45^{\circ}$ slant 광대역 복사소자를 $8{\times}8$ 삼각 배열 구조로 배치하고, 광대역 GaN 반도체 고출력 증폭기와 GaAs 다기능집적회로(MFC)를 적용한 64개의 송신 채널을 구성하여 개발하였다. GaAs다기능집적회로는 광대역에서 빔 편이 현상을 피하기 위한 실시간 지연소자, 디지털 감쇠기 그리고 GaAs 구동증폭기를 포함하고 있어서 송신 빔 조향을 할 수 있으며, 시스템의 전자적 빔 조향 범위는 방위각/고각 방향으로 각각 ${\pm}45^{\circ}/{\pm}25^{\circ}$ 범위에서 가능하다. 개발된 시스템의 송신 빔 패턴 성능을 확인하기 위해 근접 전계 시험 시설을 이용하였다. 전자전용 송신 시스템 빔 패턴 측정 결과, 시스템의 유효방사출력은 목표성능(P) 대비 최대 9.8 dB 이상을 만족하였고, 방위각/고각 방향으로 각각 ${\pm}45^{\circ}/{\pm}25^{\circ}$ 빔 조향 결과 요구성능에 만족함을 확인하였다.

• 한국결정성장학회지
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• 제18권3호
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• pp.101-104
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• 2008

GaN films were grown on the vertical and horizontal reactors by the hydride vapour phase epitaxy (HVPE). The structural and optical characteristics of the GaN films were investigated depending on the reactor-type. GaN epilayers were characterized by double crystal X-ray diffraction (DC-XRD), transmission electron microscopy (TEM) and photoluminescence (PL). Surface defects of two kinds of the GaN films were revealed by the wet chemical etching method, using $H_3PO_4$ acid at $200^{\circ}C$ for 8 minutes. Hexagonal etch pits were analyzed by optical microscopy and SEM. Etch pit densities were calculated to be approximately $1.4{\times}10^7$ and $1.2{\times}10^6\;cm^{-2}$ for GaN layers grown on horizontal and vertical reactors, respectively. Those results show GaN grown in the vertical reactor having a better quality of optical properties and crystallinity than that in the horizontal reactor.