• The Journal of the Korea Contents Association
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• v.6 no.3
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• pp.38-45
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• 2006

A dual-level low voltage differential signalling (DLVDS) circuit is proposed aiming at reducing transmission lines for a LCD driver IC. We apply two data to the proposed DLVDS circuit as inputs. Then, the transmitter converts two inputs to two kinds of fully differential signals. In this circuit, two transmission lines are sufficient to transfer two inputs while keeping the LVDS feature. However, the circuit has a common mode bias fluctuation due to difference of the input bias and the reference bias. We compensate the common mode bias fluctuation using a feedback circuit of the current source bias. The receiver recovers the original input data through a level decoding circuit. We fabricated the proposed circuit using $0.25{\mu}m$ CMOS technology. The simulation results of proposed circuit shows 1-Gbps/2-line data rate and 35mW power consumption at 2.5V supply voltage, respectively.

• Journal of Power Electronics
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• v.9 no.6
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• pp.884-891
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• 2009

An address voltage stabilization circuit for the single-side driving (SSD) method for AC plasma display panels (PDP) is proposed. The single-side driving method, which eliminates a common sustaining driver, uses only two electrodes in a three electrode AC PDP structure. The high-impedance (Hi-Z) mode operation of the data drive ICs during the sustaining period is needed for surface gas-discharge without misfiring in the SSD method but it produces the problem that the address voltage increases up to the breakdown voltage. The proposed circuit based on a flyback converter can stabilize the address voltage under the breakdown voltage and provide better surface gas-discharge performance without any misfiring in the SSD scheme.

• ETRI Journal
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• v.20 no.1
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• pp.37-45
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• 1998

Reduced surface field lateral double-diffused MOS transistor for the driving circuits of plasma display panel and field emission display in the 120V region have been integrated for the first time into a low-voltage $1.2{\mu}m$ analog CMOS process using p-type bulk silicon. This method of integration provides an excellent way of achieving both high power and low voltage functions on the same chip; it reduces the number of mask layers double-diffused MOS transistor with a drift length of $6.0{\mu}m$ and a breakdown voltage greater than 150V was self-isolated to the low voltage CMOS ICs. The measured specific on-resistance of the lateral double-diffused MOS in $4.8m{\Omega}{\cdot}cm^2$ at a gate voltage of 5V.

• Journal of the Korean Institute of Telematics and Electronics B
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• v.32B no.11
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• pp.1374-1382
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• 1995

In TFT-LCDs, as the display size area becomes larger, and the resolution higher, we have to consider the image degradation effects due to the incorporation of the TFT-LCD parameters such as the data-line resistance, the common electrode resistance, the data-line to common parasitic capacitance, and the output characteristics of driver ICs. One of the degradation effects is crosstalk resulting from the coupling between the source bus-line and common electrode. Since a source signal which represents a large number of display data is supposed to vary frequently, the common signal level is affected through the coupling effect, resulting in the degradation of nearby pixel drive signals. Therefore, we proposed a method to compensate for this source-common electrode coupling effect, we also designed and experimented the feasibility of our crosstalk compensation circuit in the actual TFT-LCD. We saw that the newly designed compensation circuit greatly reduced the crosstalk in display pattern image.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.1
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• pp.59-67
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• 2007

This paper presents a low power dual-level low voltage differential signaling (DLVDS) technique using current source switching for LCD driver ICs in portable products. The transmitter makes dual level signal that has two different level signal 400mVpp and 250mVpp while keeping the advantages of LVDS. The decoding circuit recovers the primary signal from DLVDS. The low power DLVDS is implemented using a $0.25{\mu}m$ CMOS process under 2.5V supply. The proposed circuit shows 800Mbps/2-line data rate and 9mW, 11.5mW power consumptions in transmitter and receiver, respectively. The proposed DLVDS scheme reduce power consumption dramatically compare with conventional one.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.4
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• pp.292-297
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• 2003

We fabricated a single crystal silicon thin film transistor for active matrix organic light emitting displays(AMOLEDs) using silicon on insulator wafer (SOI wafer). Poly crystal silicon thin film transistor(poly-Si TFT) Is actively researched and developed nowsdays for a pixel switching devices of AMOLEDs. However, poly-Si TFT has some disadvantages such as high off-state leakage currents and low field-effect mobility due to a trap of grain boundary in active channel. While single crystal silicon TFT has many advantages such as high field effect mobility, low off-state leakage currents, low power consumption because of the low threshold voltage and simultaneous integration of driving ICs on a substrate. In our experiment, we compared the property of poly-Si TFT with that of SOI TFT. Poly-Si TFT exhibited a field effect mobility of 34 $\textrm{cm}^2$/Vs, an off-state leakage current of about l${\times}$10$\^$-9/ A at the gate voltage of 10 V, a subthreshold slope of 0.5 V/dec and on/off ratio of 10$\^$-4/, a threshold voltage of 7.8 V. Otherwise, single crystal silicon TFT on SOI wafer exhibited a field effect mobility of 750 $\textrm{cm}^2$/Vs, an off-state leakage current of about 1${\times}$10$\^$-10/ A at the gate voltage of 10 V, a subthreshold slope of 0.59 V/dec and on/off ratio of 10$\^$7/, a threshold voltage of 6.75 V. So, we observed that the properties of single crystal silicon TFT using SOI wafer are better than those of Poly Si TFT. For the pixel driver in AMOLEDs, the best suitable pixel driver is single crystal silicon TFT using SOI wafer.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.10
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• pp.7-14
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• 2008

In this paper, we designed the HVIC(High Voltage Gate Driver IC) which has improved noise immunity characteristics and high driving capability. Operating frequency and input voltage range of the designed HVIC is up to 500kHz and 650V, respectively. Noise protection and schmitt trigger circuit is included in the high-side level shifter of designed IC which has very high dv/dt noise immunity characteristic(up to 50V/ns). And also, rower dissipation of high-side level shifter with designed short-pulse generation circuit decreased more that 40% compare with conventional circuit. In addition, designed HVIC includes protection and UVLO circuit to prevent cross-conduction of power switch and sense power supply voltage of driving section, respectively. Protection and UVLO circuit can improve the stability of the designed HVIC. Spectre and Pspice circuit simulator were used to verify the operating characteristics of the designed HVIC.

• Journal of Radiation Industry
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• v.6 no.1
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• pp.31-40
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• 2012

There are two methods to fabricate the readout electronic to a large-area CMOS image sensor (LACIS). One is to design and manufacture the sensor part and signal processing electronics in a single chip and the other is to integrate both parts with bump bonding or wire bonding after manufacturing both parts separately. The latter method has an advantage of the high yield because the optimized and specialized fabrication process can be chosen in designing and manufacturing each part. In this paper, LACIS chip, that is optimized design for the latter method of fabrication, is presented. The LACIS chip consists of a 3-TR pixel photodiode array, row driver (or called as a gate driver) circuit, and bonding pads to the external readout ICs. Among 4 types of the photodiode structure available in a standard CMOS process, $N_{photo}/P_{epi}$ type photodiode showed the highest quantum efficiency in the simulation study, though it requires one additional mask to control the doping concentration of $N_{photo}$ layer. The optimized channel widths and lengths of 3 pixel transistors are also determined by simulation. The select transistor is not significantly affected by channel length and width. But source follower transistor is strongly influenced by length and width. In row driver, to reduce signal time delay by high capacitance at output node, three stage inverter drivers are used. And channel width of the inverter driver increases gradually in each step. The sensor has very long metal wire that is about 170 mm. The repeater consisted of inverters is applied proper amount of pixel rows. It can help to reduce the long metal-line delay.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.46 no.4
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• pp.64-69
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• 2009

This paper addresses the simulation methodology of signal integrity and power integrity for mobile display modules. The proposed technique can be applied to analyse a circuit module which consist of connector, FPCB and driver ICs. The recent demand of serial interconnection technology in the mobile display industry needs delicate impedance control of signal and power traces to prohibit system malfunctioning and to reduce electromagnetic field radiation. Based on the S-parameter and Z-parameter analysis, we analyse the correlation between frequency-domain and time-domain measurements. With multi-port macros, signal integrity can be included in power integrity analysis in time domain.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2008.10a
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• pp.600-603
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• 2008

In this paper, a new circuit design named memory-in-pixel for low power consumption of the liquid crystal display (LCD) is presented. Since each pixel has a memory, it is able to express 8 color grades using the data saved in the memory without the operation of the gate and source driver ICs so that it can reduce the power consumption of the LCD panel. A memory circuit consists of modified S-R flip-flop (NAND-type) implemented in the pixel, which can supply AC bias for operating the liquid crystal (LC) with the interlocking clocks (CLK_A and CLK_B). This circuit is more complex than the inverter-type memory circuit, but it has lower power consumption of approximately 50% than the circuit. We have investigated the power consumption both NAND and inverter-type memory circuit using a Smart SPICE for the resolution of $96{\times}128$. The estimated power consumption of the inverter-type memory was about 0.037mW. On the other hand, the NAND-type memory showed power consumption of about 0.007mW.