• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.4
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• pp.39-50
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• 2011

In this paper, we presents a CDR circuit for $2^{nd}$-generation AiPi+, one of the Intra-panel Interface. The speed of the proposed clock and data recovery is increased to 1.25 Gbps compared with that of AiPi+. The DLL-based CDR architecture is used to generate the multi-phase clocks. We propose the simple scheme for frequency detector (FD) to mitigate the harmonic-locking and reduce the complexity. In addition, the duty cycle corrector that limits the maximum pulse width is used to avoid the problem of missing clock edges due to the mismatch between rising and falling time of VCDL's delay cells. The proposed CDR is implemented in 0.18 um technology with the supply voltage of 1.8 V. The active die area is $660\;{\mu}m\;{\times}\;250\;{\mu}m$, and supply voltage is 1.8 V. Peak-to-Peak jitter is less than 15 ps and the power consumption of the CDR except input buffer, equalizer, and de-serializer is 5.94 mW.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.4
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• pp.62-68
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• 2010

This work proposes a 10b 100MS/s DAC based on a segmented local matching technique primarily for small chip area. The proposed DAC employing a segmented current-steering structure shows the required high linearity even with the small number of devices and demonstrates a fast settling behavior at resistive loads. The proposed segmented local matching technique reduces the number of current cells to be matched and the size of MOS transistors while a double-cascode topology of current cells achieves a high output impedance even with minimum sized devices. The prototype DAC implemented in a 0.13um CMOS technology occupies a die area of $0.13mm^2$ and drives a $50{\Omega}$ load resistor with a full-scale single output voltage of $1.0V_{p-p}$ at a 3.3V power supply. The measured DNL and INL are within 0.73LSB and 0.76LSB, respectively. The maximum measured SFDR is 58.6dB at a 100MS/s conversion rate.

• Korean Journal of Materials Research
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• v.25 no.5
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• pp.226-232
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• 2015

High temperature plasma coating technology has been applied to recover damaged aluminum dies from wear by spraying pure aluminum and alumina powder. However, the coated mixed powder layer composed of aluminum and alumina often undergoes a detachment from the substrate, making the coated substrate die unable to maintain its expected life span. In this study, in order to increase the bonding strength between the substrate and the coating layer, a pure aluminum layer was applied as an intermediate bond layer. In order to prepare the specimen with variable bond coating conditions, the bond coat layers with a various gun speed from 10 cm/sec to 30 cm/sec were prepared with coating cycle variations ranging from three to nine cycles. The specimen with a bond coat layer coated with a gun speed of 20 cm/sec and three coating cycles exhibited ~13MPa of adhesion strength, while the specimen without a bond coat layer showed ~6 MPa of adhesion strength. The adhesion strength with a variation of bond coat layer thickness is discussed in terms of coating parameters.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.8
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• pp.56-63
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• 2010

This work proposes a 12b 100MS/s 0.13um CMOS pipeline ADC for battery-powered mobile video applications such as DVB-Handheld (DVB-H), DVB-Terrestrial (DVB-T), Satellite DMB (SDMB), and Terrestrial DMB (TDMB) requiring high resolution, low power, and small size at high speed. The proposed ADC employs a three-step pipeline architecture to optimize power consumption and chip area at the target resolution and sampling rate. A single shared and switched op-amp for two MDACs removes a memory effect and a switching time delay, resulting in a fast signal settling. A two-step reference selection scheme for the last-stage 6b FLASH ADC reduces power consumption and chip area by 50%. The prototype ADC in a 0.13um 1P7M CMOS technology demonstrates a measured DNL and INL within 0.40LSB and 1.79LSB, respectively. The ADC shows a maximum SNDR of 60.0dB and a maximum SFDR of 72.4dB at 100MS/s, respectively. The ADC with an active die area of 0.92 $mm^2$ consumes 24mW at 1.0V and 100MS/s. The FOM, power/($f_s{\times}2^{ENOB}$), of 0.29pJ/conv. is the lowest of ever reported 12b 100MS/s ADCs.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.12
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• pp.91-96
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• 2011

In this paper, a low-power direct-conversion transmitter based on current-mode operation, which satisfies the IEEE 802.15.4 standard, is proposed and implemented in a $0.13{\mu}m$ CMOS technology. The proposed transmitter consists of DACs, LPFs, variable gain I/Q up-conversion mixer, a divide-by-two circuit with LO buffer, and a drive amplifier. By combining DAC, LPF, and variable gain I/Q up-conversion mixer with a simple current mirror configuration, the transmitter's power consumption is reduced and its linearity is improved. The drive amplifier is a cascode amplifier with gain controls and the 2.4GHz I/Q differential LO signals are generated by a divide-by-two current-mode-logic (CML) circuit with an external 4.8GHz input signal. The implemented transmitter has 30dB of gain control range, 0dBm of maximum transmit output power, 33dBc of local oscillator leakage, and 40dBc of the transmit third harmonic component. The transmitter dissipates 10.2mW from a 1.2V supply and the die area of the transmitter is $1.76mm{\times}1.26mm$.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.3
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• pp.77-85
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• 2008

This work proposes a 12b 130MS/s 108mW $1.8mm^2$ 0.18um CMOS ADC for high-quality video systems such as TFT-LCD displays and digital TVs requiring simultaneously high resolution, low power, and small size at high speed. The proposed ADC optimizes power consumption and chip area at the target resolution and sampling rate based on a three-step pipeline architecture. The input SHA with gate-bootstrapped sampling switches and a properly controlled trans-conductance ratio of two amplifier stages achieves a high gain and phase margin for 12b input accuracy at the Nyquist frequency. A signal-insensitive 3D-fully symmetric layout reduces a capacitor and device mismatch of two MDACs. The proposed supply- and temperature- insensitive current and voltage references are implemented on chip with a small number of transistors. The prototype ADC in a 0.18um 1P6M CMOS technology demonstrates a measured DNL and INL within 0.69LSB and 2.12LSB, respectively. The ADC shows a maximum SNDR of 53dB and 51dB and a maximum SFDR of 68dB and 66dB at 120MS/s and 130MS/s, respectively. The ADC with an active die area of $1.8mm^2$ consumes 108mW at 130MS/s and 1.8V.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.3
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• pp.69-76
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• 2008

This work proposes a 12b 1kS/s 65uA 0.35um CMOS algorithmic ADC for sensor interface applications such as accelerometers and gyro sensors requiring high resolution, ultra-low power, and small size simultaneously. The proposed ADC is based on an algorithmic architecture with recycling techniques to optimize sampling rate, resolution, chip area, and power consumption. Two versions of ADCs are fabricated with a conventional open-loop sampling scheme and a closed-loop sampling scheme to investigate the effects of offset and 1/f noise during dynamic operation. Switched bias power-reduction techniques and bias circuit sharing reduce the power consumption of amplifiers in the SHA and MDAC. The current and voltage references are implemented on chip with optional of-chip voltage references for low-power SoC applications. The prototype ADC in a 0.35um 2P4M CMOS technology demonstrates a measured DNL and INL within 0.78LSB and 2.24LSB, and shows a maximum SNDR and SFDR of 60dB and 70dB in versionl, and 63dB and 75dB in version2 at 1kS/s. The versionl and version2 ADCs with an active die area of $0.78mm^2$ and $0.81mm^2$ consume 0.163mW and 0.176mW at 1kS/s and 2.5V, respectively.

• Korean Journal of Poultry Science
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• v.32 no.4
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• pp.275-279
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• 2005

This study investigated the effect of dried food-waste diets (FW) fermented by Aspergillus oryzae (AEW), on egg Production and egg qualify in laying hens. One hundred sixty eight laying hens, 50 week old, ISA-Brown wtrain were randomly distributed into 7 treatments with 3 relpicates of 8 birds per replicate and fed with standards laying hen diet replaced with FW and AFW at die=rent level Basal Diet, 25, 10, $75\%$, respectively. There was a significant decrease in feed intake for FW $50\%$ diet and egg Production was statistically lower in all W diet treatments(p<0.05). Water consumption was increased as the replacement increased. Egg weight, egg shell thickness and strength were similar among treatments. However, egg yolk color and Haugh unit showed distinct differences when W were added to their diets(p<0.05). No difference was observed in egg yolk cholesterol. It seems that FW diet could decrease the egg Production, but would be able to improve egg Quality. From this results, AO seemed applicable to laying hen diet as supplements.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.9
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• pp.302-307
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• 2016

The technology of multistage deep drawing has been widely applied in the metal forming industry, in order to reduce both the manufacturing cost and time. A battery can used for mobile phone production is a well-known example of multistage deep drawing. It is very difficult to manufacture a battery can, however, because of its large thickness to height aspect ratio. Furthermore, the production of the final parts may result in assembly failure due to springback after multistage deep drawing. In industry, empirical methods such as over bending, corner setting and ironing have been used to reduce springback. In this study, a bottoming approach using the finite element method is proposed as a practical and scientific method of reducing springback. Bottoming induces compression stress in the deformed blank at the final stroke of the punch and, thus, has the effect of reducing springback. Different cases of the bottoming process are studied using the finite element program, DYNAFORM, to determine the optimal die design. The results of the springback simulation after bottoming were found to be in good agreement with the experimental results. In conclusion, the proposed bottoming method is expected to be widely used as a practical method of reducing springback in industry.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.4
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• pp.175-182
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• 2017

In light emitting diode (LED) chip packaging, wire bonding is an important process that connects the LED chip on the lead frame pad with the Au wire and enables electrical operation for the next process. The wire bonding process is divided by two types: thermo compression bonding and ultrasonic bonding. Generally, the wire bonding process consists of three steps: 1st ball bonding that bonds the shape of the ball on the LED chip electrode, looping process that hangs the wire toward another connecting part with a loop shape, and 2nd stitch bonding that forms and bonds to another electrode. This study analyzed the factors affecting the LED die bonding processes to optimize the process capability that bonds a small Zener diode chip on the PLCC (plastic-leaded chip-carrier) LED package frame, and then applied response surface analysis. The design of experiment (DOE) was established considering the five factors, three levels, and four responses by analyzing the factors. As a result, the optimal conditions that meet all the response targets can be derived.