• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제55권3호
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• pp.111-115
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• 2006

We investigated accelerated soft error rate(ASER) in 8M static random access memory(SRAM) cells. The effects on ASER by well structure, operational voltage, and cell transistor threshold voltage are examined. The ASER decreased exponentially with respect to operational voltage. The chips with buried nwell1 layer showed lower ASER than those either with normal well structure or with buried nwell1 + buried pwell structure. The ASER decreased as the ion implantation energy onto buried nwell1 changed from 1.5 MeV to 1.0 MeV. The lower viscosity of the capping layer also revealed lower ASER value. The decrease in the threshold voltage of driver or load transistor in SRAM cells caused the increase in the transistor on-current, resulting in lower ASER value. We confirmed that in order to obtain low ASER SRAM cells, it is necessary to also the buried nwell1 structure scheme and to fabricate the cell transistors with low threshold voltage and high on-current.

• ETRI Journal
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• 제37권6호
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• pp.1188-1198
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• 2015

In this paper, a multi-time programmable (MTP) cell based on a $0.18{\mu}m$ bipolar-CMOS-DMOS backbone process that can be written into by using dual pumping voltages - VPP (boosted voltage) and VNN (negative voltage) - is used to design MTP memories without high voltage devices. The used MTP cell consists of a control gate (CG) capacitor, a TG_SENSE transistor, and a select transistor. To reduce the MTP cell size, the tunnel gate (TG) oxide and sense transistor are merged into a single TG_SENSE transistor; only two p-wells are used - one for the TG_SENSE and sense transistors and the other for the CG capacitor; moreover, only one deep n-well is used for the 256-bit MTP cell array. In addition, a three-stage voltage level translator, a VNN charge pump, and a VNN precharge circuit are newly proposed to secure the reliability of 5 V devices. Also, a dual memory structure, which is separated into a designer memory area of $1row{\times}64columns$ and a user memory area of $3rows{\times}64columns$, is newly proposed in this paper.

• 전자공학회논문지A
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• 제32A권11호
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• pp.71-78
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• 1995

Based on the popular 4-transistor SRAM cell, an analytical expression of the minimum cell ratio was derived by modeling the static read operation. By analyzing the relatively simple expression for the minimum cell ratio, which was derived assuming the ideal transistor characteristics, effects of the changes in supply voltage and process parameters on the minimum cell ratio was predicted, and the minimum power supply voltage for read operation was determined. The results were verified by simulations utilizing the suggested simulation method, which is suitable for monitoring the lower limit of supply voltage for proper cell operation. From the analysis, it was shown that the worst condition for cell operation is low temperature and low supply voltage, and that the operation margin can be effectively improved by reducing the threshold voltage of the cell transistors.

• 전기전자학회논문지
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• 제1권1호
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• pp.11-18
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• 1997

회로 시뮬레이터를 이용하는 DC 셀 노드전압 분석방법을 적용하여, 고저항 SRAM 셀 구조에서 기생저항들과 트랜지스터 비대칭에 의해 야기되는 정적 읽기동작에서의 동작마진을 조사하였다. 이상적인 셀에 기생저항을 선택적으로 추가함으로써 각 기생저항들이 동작 마진에 끼치는 영향을 조사한 뒤, 기생저항이 좌우대칭 쌍으로 존재하는 경우에 대해 조사하고, 또한 셀 트랜지스터의 채널폭을 선택적으로 변화시켜 트랜지스터의 비대칭을 야기시킴으로써 트랜지스터 비대칭에 의한 동작 마진의 저하를 분석하였다. 분석 방법은 시뮬레이션된 셀 노드전압 특성에서 두 셀 노드전압이 하나의 값으로 수렴되는 전원전압의 값과 $V_{DD}=5V$에서 셀 노드전압의 차를 비교함으로써 상대적인 동작 마진을 비교하는 방법을 사용하였다. 회로 시뮬레이션에 의존한 본 분석으로부터 셀의 정적 읽기동작에 가장 심각한 영향을 끼치는 기생저항 성분과 트랜지스터의 비대칭 형태를 규명함으로써 새로운 셀 구조 설계시 참고할 수 있는 기준을 제시하였다.

• 전자공학회논문지A
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• 제32A권10호
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• pp.25-34
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• 1995

A new vertical power MOSFET with over-current protection capability is proposed. The MOSFET consists of main power MOSFET cell, sensing MOSFET cell and lateral npn bipolar transistor. The proposed MOSFET may be fabricated by a conventional DMOS process without any additional fabrication step. Overcurrent state is sensed by the newly designed lateral bipolar transistor. Mixed-mode simulations proved that the overcurrent protection is achieved by the proposed MOSFET successfully with a small protection area less than 0.2 % of the total die area.

• 대한전자공학회논문지
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• 제24권6호
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• pp.1080-1086
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• 1987

SLAGEN, a system for symbolic cell layout based on artificial intelligence approach, takes as input a transistor connection description of CMOS standard cells and environment information, and outputs a symbolic layout description. SLAGEN performas transistor grouping by a heuristic search method, in order to minimize the number of separations, and then performs group reordering and transistor reordering with an eye toward minimizing routing. Next, SLAGEN creates a rough initial routing in order to guarantee functionality and correctness, and then improve the initial routing by a rule-based approach.

• ETRI Journal
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• 제25권5호
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• pp.288-296
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• 2003

In this study, we present a 260k color TFT LCD driver chip set that consumes only 5 mW in the module, which has exceptionally low power consumption. To reduce power consumption, we used many power-lowering schemes in the logic and analog design. A driver IC for LCDs has a built-in graphic SRAM. Besides write and read operations, the graphic SRAM has a scan operation that is similar to the read operation of one row-line, which is displayed on one line in an LCD panel. Currently, the embedded graphic memory is implemented by an 8-transistor leaf cell and a 6-transistor leaf cell. We propose an efficient scan method for a 6-transistor embedded graphic memory that is greatly improved over previous methods. The proposed method is implemented in a 0.22 ${\mu}m$ process. We demonstrate the efficacy of the proposed method by measuring and comparing the current consumption of chips with and without our proposed scheme.

• 한국전기전자재료학회논문지
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• 제17권4호
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• pp.426-431
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• 2004

We have studied the pressure-dependent liquid crystal's dynamics in a twisted nematic (TN) liquid crystal panel with thin film transistor by applying an external pressure to it. When the external pressure is applied to the panel in a dark state, the disclination lines were generated as a light leakage whereas they did not appear in a simple test cell that has only pixel and common electrodes. It was because the disclination lines were Provoked by the electric field between pixel electrode and data/gate bus line for active matrix driving. Consequently, the external pressure resulted in dynamic instability of the liquid crystal so that the disclination lines at the data/gate bus line intruded into the active area.

• 한국전기전자재료학회논문지
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• 제20권2호
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• pp.113-117
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• 2007

We have investigated the effects of doping concentration in polysilicon floating gate on the endurance characteristics of the EEPROM cell haying the structure of spacer select transistor. Several samples were prepared with different implantation conditions of phosphorus for the floating gate. Results show the dependence of doping concentration in polysilicon floating gate on performance of EEPROM cell from the floating gate engineering point of view. All of the samples were endured up to half million programming/erasing cycle. However, the best $program-{\Delta}V_{T}$ characteristic was obtained in the cell doped at the dose of $1{\times}10^{15}/cm^{2}$.

• ETRI Journal
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• 제27권5호
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• pp.579-584
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• 2005

A CMOS direct-conversion mixer with a single transistor-level topology is proposed in this paper. Since the single transistor-level topology needs smaller supply voltage than the conventional Gilbert-cell topology, the proposed mixer structure is suitable for a low power and highly integrated RF system-on-a-chip (SoC). The proposed direct-conversion mixer is designed for the multi-band ultra-wideband (UWB) system covering from 3 to 7 GHz. The conversion gain and input P1dB of the mixer are about 3 dB and -10 dBm, respectively, with multi-band RF signals. The mixer consumes 4.3 mA under a 1.8 V supply voltage.