• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.10
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• pp.859-864
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• 2003

We prepared SOI(silicon-on-insulator) wafer pairs of Si II SiO$_2$/Si$_3$N$_4$ II Si using wafer direct bonding with an electric furnace annealing(EFA), a fast linear annealing(FLA), and a rapid thermal annealing(RTA), respectively, by varying the annealing temperatures at a given annealing process. We measured the bonding area and the bonding strength with processes. EFA and FLA showed almost identical bonding area and theoretical bonding strength at the elevated temperature. RTA was not bonded at all due to warpage, We report that FLA process was superior to other annealing processes in aspects of surface temperature, annealing time, and bonding strength.

• Journal of the Semiconductor & Display Technology
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• v.10 no.2
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• pp.103-108
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• 2011

Ultrasonic welding is widely used in bonding of the same kind or dissimilar materials. The important variable of ultrasonic bonding is the bonding pressure, bonding time and applied amplitude energy. These variables have to be optimized in order to obtain the optimum bonding results. In this research, the important factor to optimal bonding between metal and glass were experimentally investigated by applying design of experiment.

• Restorative Dentistry and Endodontics
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• v.20 no.1
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• pp.97-112
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• 1995

The purpose of this study was to evaluate the effect of wetting condition made by drying time on bonding of resin cement to dentin. Freshly extracted bovine teeth were grinded to expose flat dentin surfaces. After the exposed dentin surfaces were treated with pretreatment agents and water rinse, each wetting condition of dentin surfaces was made according to drying times and methods including slight blow bry for I-second by air syringe, blow dry for 20-second by air syringe, and 12-hour dry in desiccator respectively. and then, previously made composite resin specimens were bonded onto each conditioned dentin surface of the specimen using Panavia-21(Kuraray Co.), Bistite(Tokuso Co.), and Choice(use with All bond-2, Bisco Inc.) resin cement according as manufacturer's instruction. Bonded specimens were stored in $37^{\circ}C$ distilled water for 24 hours, then the tensile bond strength was measured, cohesive failure rate was calculated, and fractured dentin surfaces and acrylic rod sides were examined under scanning electron microscope. The result were as follows ; In the group of bonding with Panavia-21 resin cement, higher tensile bond strength was seen in 12-hour dry group than in I-second and 20-second dry group(p<0.01). In the group of bonding with Bistite resin cement, higher tensile bond strength was seen in 1-second dry group than in 20-second and 12-hour dry group(p<0.01). In the group of bonding with Choice resin cement, no significant differences of bond strength under given drying time were seen. Cohesive failure rates derived from the groups of bonding with Panavia-21 and Choice resin cement were increased with the increase of tensile bond strength in each drying time. On SEM examination of fractured surface, adhesive failure mode with fractured resin tags was mostly seen in wet condition with I-second drying time in the group of bonding with Panavia-21 resin cement, mixed failure mode with shortened and fractured resin tag was seen in the group of bonding with Bistite resin cement, and regardless of drying time, and cohesive-adhesive mixed failure mode with fracture of 'Hollow' typed resin tags was mainly seen in the group of bonding with Choice resin cement.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.65-70
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• 2021

In this study, interfacial properties and mechanical properties of joints were reported after Cu pads finished with organic solderability preservative (OSP) on flame retardant-4 (FR-4) printed circuit board (PCB) and electronic components were joined with a Sn-57Bi-1Ag solder paste by using a laser bonding process. The laser bonding process was performed under various bonding conditions with changing a laser power and a bonding time and effects of bonding conditions on interfacial and mechanical properties of joints were analyzed. In order to apply for industry, properties of bonding joints using a reflow bonding process which are widely used were compared. When the laser bonding process were performed, we observed that Cu₆Sn₅ intermetallic compounds (IMCs) were fully formed at the interface although the bonding times were very short about 2 and 3 s. Furthermore, void formations of the joints by using the laser bonding process were suppressed at the joints with comparing to the reflow bonding process and shear strengths of bonding joints were higher than that by using the reflow bonding process. Therefore, in spite of a very short bonding time, it is expected that joints will be stably formed and have a high mechanical strength by using the laser bonding process.

• Journal of Adhesion and Interface
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• v.7 no.4
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• pp.28-31
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• 2006

Due to the miniaturization of MEMS and microelectronics the joining techniques also have to be adjusted. The dosing technology with viscous adhesives does not permit reproducible adhesive volumes, which are clearly under a nano-liter. A nano-liter means however a diameter of bonding area within the range of several 100 micrometers. Additional, viscous adhesives need a certain time, until they are cross linked or cured. The problem especially in the MEMS is the initial strength, since it gives the time, which is needed for joining an individual adhesive joint. The time up to the initial strength is with viscous, also with fast curing systems, within the range of seconds until minutes. Until the reach of the initial strength, the micro part must be fixed/held. Without sufficient adjustment/clamping it can come to a shift of the micro parts. Also existing micro adhesive bonding processes are not batch able, i.e. the individual adhesive joints of a micro system must be processed successively. In the context of the WCARP III 2006 now an innovative method is to be presented, how it is possible to solve the existing problems with micro bonding. i.e. a method is presented, which is batch able, possess a minimum joining geometry with some micrometers and is so fast that no problems with the initial strength arise. It is a method, which could revolutionize the sticking technology in the micro system engineering.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2016.05a
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• pp.22-23
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• 2016

This study aims to derive the optimal condition that ensures the monolithicity of ultra-high performance concrete (UHPC), through the evaluation of bonding shear performance with respect to the time of cold joint occurrence during the placement. From the direct shear test, while the normalized bonding shear strength reduction of UHPC with the delay time of 15 minutes was the lowest at around 8%, a dramatic degradation of bonding shear performance was observed after 15 minutes. XRD analysis of the middle and surface sections was performed in order to analyze the composition of the thin film formed at the surface of UHPC, and as a result, the main ingredient appeared to be SiO₂ from the XRD pattern of middle and surface sections, which is believed to be the result of the rising of SiO₂-based filler, used as anadmixture in this study, toward the surface, due to its low specific gravity.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.10a
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• pp.39-45
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• 2000

A small camera module fabricated by including bare chip bonding methods is utilized to realize advanced mobile devices. One of the driving forces is the TOG (Tape On Glass) bonding method which reduces the packaging size of the image sensor clip. The TOG module is a new thinner and smaller image sensor module, using flip chip interconnection method with the ACP (Anisotropic Conductive Paste). The TOG production process was established by determining the optimum bonding conditions for both optical glass bonding and image sensor clip bonding lo the flexible PCB. The bonding conditions, including sufficient bonding margins, were studied. Another bonding method is the flip chip bonding method for DSP (Digital Signal Processor) chip. A new AC\ulcorner was developed to enable the short resin curing time of 10 sec. The bonding mechanism of the resin curing method was evaluated using FEM analysis. By using these flip chip bonding techniques, small camera module was realized.

• Journal of Welding and Joining
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• v.29 no.1
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• pp.52-58
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• 2011

In this paper, the direct bonding process between FPCB and HPCB was studied. By using an ultrasonic horn which is mounted on the ultrasonic bonding machine, it is alternatively possible to bond the gold pads attached on the FPCB and HPCB at room temperature without an adhesive like ACA or NCA. The process condition for obtaining more bonding strength than 0.6 Kgf, which is commercially required, was carried out as 40 kHz of frequency, 0.6 MPa of bonding pressure and 2 second of bonding time. The peel off test was performed for evaluating bonding strength which results in more than 0.8 Kgf.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.7
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• pp.28-35
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• 2010

In the display industry, COG bonding method is being applied to production of LCD panels that are used for mobile phones and monitors, and is one of the mounting methods optimized to compete with the trend of ultra small, ultra thin and low cost of display. In COG bonding process, electrical characteristics such as contact resistance, insulation property, etc and mechanical characteristics such as bonding strength, etc depend on properties of conductive particles and epoxy resin along with ACF materials used for COG by manufacturers. As the properties of such materials have close relation to optimization of bonding conditions such as temperature, pressure, time, etc in COG bonding process, it is requested to carry out an in-depth study on characteristics of COG bonding, based on which development of bonding process equipment shall be processed. In this study were analyzed the characteristics of COG bonding process, performed the analysis and reliability evaluation on electrical and mechanical characteristics of COG bonding using ACF to find optimum bonding conditions for ACF, and performed the experiment on bonding characteristics regarding fine pitch to understand the affection on finer pitch in COG bonding. It was found that it is difficult to find optimum conditions because it is more difficult to perform alignment as the pitch becomes finer, but only if alignment has been made, it becomes similar to optimum conditions in general COG bonding regardless of pitch intervals.

• The Journal of Korean Academy of Prosthodontics
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• v.34 no.4
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• pp.833-849
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• 1996

The material of choice for functional and esthetic reconstruction of maxillofacial defects is silicone. Silicone has appropriate physical properties for maxillofacial prosthesis but it has weak edge strength. Therefore, a proper combination of silicone and polyurethane sheet is recommended to improve this weakness. Various primers are also used to enhance the adhesive strength between silicone and polyurethane sheet. The purpose of this study was to determine the adhesive strength of silicone and polyurethane sheet. Silicone elastomer mixture was made by admixing MDX4-4210 elastomer (40%) and Silastic Medical Adhesive Type A(60%). This silicone elastomer mixture was attached to polyurethane sheet, using one of three different primers(1205, S-2260, or A-304), treated for 1, 2, 4, 6, and 8 hours. These were then polymerized in room temperature, dry-heat oven or microwave oven. Six specimens per each group, a total of 270 specimens were prepared for final test. The differences of T-peel bonding strengths were then determined by a test. The differences of T-peel bonding strengths were then determined by a test method that was recommended by American Society for Testing and Materials C794-80. The results were statistically analyzed using the ANOVA and Mutiple Range Tests(Tukey' HSD). The reults were as follow. 1. Type of primer, primer reaction time, and methods of polymerization showed significant correlation on the T-peel bonding strengths in adhesiveness between silicone and polyurethane sheet. 2. A-304 primer showed statistically higher in T-peel bonding strength than otehr type of primers except for the polymerization in microwave oven with reaction times of 2, 6 hours(p<0.05). 3. No significant differences in T-peel bonding strength were observed among the polymerization methods. 4. The effect of reaction time by the primer type and polymerization method showed statistically significant differences in bonding strength among different reaction times. And in most cases, reaction time of 1 or 2 hours showed higher T-peel bonding strength.