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http://dx.doi.org/10.6117/kmeps.2021.28.2.065

Interfacial and Mechanical Properties of Sn-57Bi-1Ag Solder Joint with Various Conditions of a Laser Bonding Process  

Ahn, Byeongjin (Korea Institute of Industrial Technology (KITECH))
Cheon, Gyeong-Yeong (Korea Institute of Industrial Technology (KITECH))
Kim, Jahyeon (Korea Institute of Industrial Technology (KITECH))
Kim, Jungsoo (Korea Institute of Industrial Technology (KITECH))
Kim, Min-Su (Korea Institute of Industrial Technology (KITECH))
Yoo, Sehoon (Korea Institute of Industrial Technology (KITECH))
Park, Young-Bae (School of Materials Science and Engineering, Andong National University)
Ko, Yong-Ho (Korea Institute of Industrial Technology (KITECH))
Publication Information
Journal of the Microelectronics and Packaging Society / v.28, no.2, 2021 , pp. 65-70 More about this Journal
Abstract
In this study, interfacial properties and mechanical properties of joints were reported after Cu pads finished with organic solderability preservative (OSP) on flame retardant-4 (FR-4) printed circuit board (PCB) and electronic components were joined with a Sn-57Bi-1Ag solder paste by using a laser bonding process. The laser bonding process was performed under various bonding conditions with changing a laser power and a bonding time and effects of bonding conditions on interfacial and mechanical properties of joints were analyzed. In order to apply for industry, properties of bonding joints using a reflow bonding process which are widely used were compared. When the laser bonding process were performed, we observed that Cu6Sn5 intermetallic compounds (IMCs) were fully formed at the interface although the bonding times were very short about 2 and 3 s. Furthermore, void formations of the joints by using the laser bonding process were suppressed at the joints with comparing to the reflow bonding process and shear strengths of bonding joints were higher than that by using the reflow bonding process. Therefore, in spite of a very short bonding time, it is expected that joints will be stably formed and have a high mechanical strength by using the laser bonding process.
Keywords
interfacial property; mechanical property; Sn-57Bi-1Ag; laser bonding; Cu OSP; intermetallic compound;
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