Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2000.10a
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- Pages.39-45
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- 2000
Flip Chip Interconnection Method Applied to Small Camera Module
- Segawa, Masao (Manufacturing Engineering Research Center, Toshiba Corp.) ;
- Ono, Michiko (Manufacturing Engineering Research Center, Toshiba Corp.) ;
- Karasawa, Jun (Manufacturing Engineering Research Center, Toshiba Corp.) ;
- Hirohata, Kenji (Research & Development Center, Toshiba Corp.) ;
- Aoki, Makoto (Fukaya Visual Products Works, Toshiba Corp.) ;
- Ohashi, Akihiro (Fukaya Visual Products Works, Toshiba Corp.) ;
- Sasaki, Tomoaki (Fukaya Visual Products Works, Toshiba Corp.) ;
- Kishimoto, Yasukazu (New Product Development Center, Toshiba Chemical Corp.)
- Published : 2000.10.01
Abstract
A small camera module fabricated by including bare chip bonding methods is utilized to realize advanced mobile devices. One of the driving forces is the TOG (Tape On Glass) bonding method which reduces the packaging size of the image sensor clip. The TOG module is a new thinner and smaller image sensor module, using flip chip interconnection method with the ACP (Anisotropic Conductive Paste). The TOG production process was established by determining the optimum bonding conditions for both optical glass bonding and image sensor clip bonding lo the flexible PCB. The bonding conditions, including sufficient bonding margins, were studied. Another bonding method is the flip chip bonding method for DSP (Digital Signal Processor) chip. A new AC\ulcorner was developed to enable the short resin curing time of 10 sec. The bonding mechanism of the resin curing method was evaluated using FEM analysis. By using these flip chip bonding techniques, small camera module was realized.
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