Browse > Article
http://dx.doi.org/10.5781/KWJS.2011.29.1.052

Study of Metal(Au) Bump for Transverse Ultrasonic Bonding  

Ji, Myeong-Gu (Seoul National University of Science and Technology, School of NID Fusion Nano Micro Robot System)
Song, Chun-Sam (Seoul National University of Science and Technology, Institute for Industrial Technology Policy(INTEP))
Kim, Joo-Hyun (Kookmin university, school of mechanical engineering)
Kim, Jong-Hyeong (Seoul National University of Science and Technology, School of Mechanical Design and Automation Engineering)
Publication Information
Journal of Welding and Joining / v.29, no.1, 2011 , pp. 52-58 More about this Journal
Abstract
In this paper, the direct bonding process between FPCB and HPCB was studied. By using an ultrasonic horn which is mounted on the ultrasonic bonding machine, it is alternatively possible to bond the gold pads attached on the FPCB and HPCB at room temperature without an adhesive like ACA or NCA. The process condition for obtaining more bonding strength than 0.6 Kgf, which is commercially required, was carried out as 40 kHz of frequency, 0.6 MPa of bonding pressure and 2 second of bonding time. The peel off test was performed for evaluating bonding strength which results in more than 0.8 Kgf.
Keywords
Ultrasonic bonding; Bump direct bonding; FPCB; Au to Au bonding; Display module bonding;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
1 J.W. Kim, Y.C. Lee, D.G. Kim and S.B. Jung, "Reliability of Adhesive Interconnections for Application in Display Module", Microelectron. Eng., 84 (2007). 2691   DOI   ScienceOn
2 Kim. Gyu-Seok, Lee. Yeong-U, Hong. Seong-Jun, Lee. Gi-Ju, Jeong. Jae-Pil, "Ultrasonic bonding of flexible to rigid PCB ", Proceedings of the KWS Conference,, pp.172-174, October 2006 (in Korean)   과학기술학회마을
3 H. Maruo, Y. Seki and Y. Unami, "Development of Ultrasonic Flip Chip Bonding for Flexible Printed Circuit", Proceeding of HDP'04, 2004, 307
4 K. Tanida, M. Umemoto, Y. Tomita, M. Tago, R. Kajiwara, Y. Akiyama and K. Takahashi, "Au Bump Interconnection with Ultrasonic Flip-Chip Bonding in 20um Pitch", Jpn. J. Appl. Phys. 42 (2003), 2198   DOI
5 M. Umemoto, K. Tanida, Y. Tomita, and K. Takahashi, "Non-metallurgical bonding technology with super-narrow gap for 3D stacked LSI," Proc. of Electronic Components and Technology, 285-288, Dec. 2002
6 M. Tago, Y. Tomita, Y. Nεmoto, K. Tanida, M. Umemoto. and K. Takahashi, "Superfìne flip-chip bonding technology utilizing tin-capped Cu bumps in 20um-pitch," Tech. Digest, 6th VLSI Pakaging Workshop of Japan, Kyoto, Japan, 161-164, 2002. 19-2 (2001)atical Theory of Heat Distribution during Welding and Cuttin, 200-207
7 C. H. Tsan, M. A. Schimidt, and S. M. Spεarmg, "Fabrication process and plasticity of gold-gold thennocompression bonds," Proc. of the 6th International Symposium on Semicoηductor Wafer Bonding Science, technology and Applications, 1-8, 2001
8 M. Umemolo, Y. Tomita, T. Morifuji, T. Ando, T. Sato, and K. Takahashi， "Superfine flip-chip interconnection in 20um-pitch utilizing reliable microthin underfill technology for 3D stacked LSI," Proc. of the 52nd Electronic Components Technology, 1454- 1459, 2002
9 J.M. Koo and S.B Jung:"Interfacial Reaction and Bump Shear Property of Electroplated Sn-37Pb Solder Bump with Ni Under Bump Metallization during Multiple Reflows", Adv. Mater. Research 15-17, (2006) 181