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A Study on the Metal-Glass Bonding Using Ultrasonic  

Jeong, An-Mok (Manufacturing System R&D Group, Korea Institute of Industrial Technology)
Jeon, Euy-Sik (Mechanical Engineering, Kongju National University)
Kim, Cheol-Ho (Manufacturing System R&D Group, Korea Institute of Industrial Technology)
Publication Information
Journal of the Semiconductor & Display Technology / v.10, no.2, 2011 , pp. 103-108 More about this Journal
Abstract
Ultrasonic welding is widely used in bonding of the same kind or dissimilar materials. The important variable of ultrasonic bonding is the bonding pressure, bonding time and applied amplitude energy. These variables have to be optimized in order to obtain the optimum bonding results. In this research, the important factor to optimal bonding between metal and glass were experimentally investigated by applying design of experiment.
Keywords
Metal-glass bonding; DOE; Free solder;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
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