• 한국산업융합학회 논문집
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• 제23권4_2호
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• pp.675-682
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• 2020

Multi-wire sawing is the prominent technology employed to cut hard material ingots into wafers. This paper aimed to research the effect of diamond toughness index on the cutting performance of electroplated diamond wire. Three different toughness index of diamond abrasives were used to manufacture electroplated diamond wires. The cutting performance of electroplated diamond wire is verified through experiments, in which sapphire ingot are cut using single wire sawing machine. A single wire saw for constant load slicing is developed for the cutting performance evaluation of electroplated diamond wire. Choosing the cutting depth, total cutting depth, cutting force and wear of electroplated diamond wires as evaluation parameters, the performance of electroplated diamond wire is evaluated. The results of this study showed that there was a significant direct relationship between the toughness index of diamond abrasives and the cutting performance. Results demonstrated that diamond abrasive with a high toughness index showed higher cutting performance. However, all diamond abrasives showed similar cutting performance under low load conditions. The results of this paper are useful for the development of cutting large diameter ingots and cutting high hardness ingots at high speed.

• Journal of Biosystems Engineering
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• 제28권3호
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• pp.209-216
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• 2003

Red pepper calyx cutting devices using a impacting force by a rotational cutter were devised and tested to obtain the fundamental data for development of a calyx removal unit. Fresh red peppers with 80∼87%(w.b.) of initial moisture contents were used as experimental materials. Square and wire type of rotational cutters were used to cut the red pepper calyx and the fresh red peppers were fed into the device both manually and automatically. Three rotational speeds of 250, 500, 700rpm were selected for a square, and 1000, 1500, 1800rpm for a wire type cutter respectively. Four types of red pepper fixing unit were used in manual feeding. The cutting rate of the square type cutter was over 50% regardless the shape and specification of the cutter. For the wire type cutter, the copper wire and nylon chord could not be applied to cut the red pepper calyx because of the low cutting rate. But for the fine wire, the cutting rate was higher and the cutting mechanism was more steady than copper wire and nylon chord. The cutting rate of automatic feeding and wire type cutting unit was about 70% for all levels of the rotational speed. The cutting rate was highly related to the impacting point of red pepper in carrier box. To increase the cutting rate using the rotational cutter, a proper device and mechanism was required to keep the impacting point consistently.

• Journal of Mechanical Science and Technology
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• 제17권6호
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• pp.816-824
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• 2003

In this study, variations of cutting performance with pulse time, open circuit voltage, wire speed and dielectric fluid pressure were experimentally investigated in Wire Electrical Discharge Machining (WEDM) process. Brass wire with 0.25 mm diameter and AISI 4140 steel with 10 mm thickness were used as tool and work materials in the experiments. The cutting performance outputs considered in this study were surface roughness and cutting speed. It is found experimentally that increasing pulse time, open circuit voltage, wire speed and dielectric fluid pressure increase the surface roughness and cutting speed. The variation of cutting speed and surface roughness with cutting parameters is modeled by using a regression analysis method. Then, for WEDM with multi-cutting performance outputs, an optimization work is performed using this mathematical models. In addition, the importance of the cutting parameters on the cutting performance outputs is determined by using the variance analysis (ANOVA).

• 한국기계가공학회지
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• 제17권6호
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• pp.83-90
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• 2018

This paper introduces a innovative diamond wire saw cutting technology and its experimental verification that can be utilized for cutting heavy structures. While conventional diamond wire saw cutting technologies such as water cooled cutting method and dry cutting method cause severe environmental problems due to generating massive concrete sludge or dust scattering, the proposed method can eliminate those problems considerably. Through extensive experiments using heavy structure test bed and real bridge pier structure, comprehensive analysis and comparative evaluation about various cutting methods were performed. As a result, the innovative diamond wire saw cutting method could achieve a similar cutting and cooling performance to the water cooled cutting method without generating concrete sludge and it showed an improved cutting and cooling performance to the dry cutting method without dust scattering. Consequently it is confirmed that the suggested cutting technology can be a promising environment-friendly alternative in the field of heavy structure dismantling.

• 대한기계학회논문집A
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• 제39권10호
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• pp.1069-1077
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• 2015

발파를 이용한 터널굴착시, 와이어쏘를 이용하여 심빼기 부분 외곽에 불연속면을 발생시켜 발파진동을 차단함으로써 소음 및 진동을 저감시키고자 하는 방법은 타 방법에 비해 시공이 간편하고 경제적일 것으로 예상된다. 본 논문에서는 터널굴착용 와이어쏘의 절삭 메커니즘을 규명하기 위하여 시간에 따른 절삭 깊이 변화와 절삭 중 암석 내부의 와이어쏘 곡선 형태를 파악할 수 있는 절삭 모델을 구축하고 검증하였다. 구축된 모델을 이용한 시뮬레이션을 통해 터널굴착용 와이어쏘 절삭의 특징을 살펴보고, 와이어쏘 인장력, 와이어쏘 속도, 피드 속도, 천공 깊이 및 천공 직경과 같은 주요 조건들이 절삭 성능에 미치는 영향을 검토하였으며, 이러한 검토 결과를 바탕으로 절삭 성능을 높이기 위한 방안을 제시하였다.

• 산업경영시스템학회지
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• 제23권59호
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• pp.119-127
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• 2000

This paper describes the database for wire cutting electrodischarge conditions and variable taper wire-cut Machining. Electodischarge wire-cut machining is applicable to all materials that are fairly good electrical conductors, including metals, alloys, and most carbides. Thus it provides a relatively simple method for making holes of any desired cross section in materials that are too hard or brittle to be machined by most other methods. In conventional wire cutting CAM systems usually generate the NC code omitting electrodischarge conditions, so operator edits the NC code manually. But it is very inefficient. Therefore in this paper we propose a wire cutting CAM system including database for electrodischarge conditions. Proposed system consists of three steps: 1) Development of database for electrodischarge conditions 2) Development of CAM functions, Including 2D CAD modeling tools, file I/O functions, wire path genera tion functions and postprocessor. 3) Development of variable taper wire-cut machining module. The proposed system has been tested in the JinYoung precision Machine Co.,LTD. and found to be working satisfactorily.

• 한국기계가공학회지
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• 제15권3호
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• pp.66-71
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• 2016

Reducing the wafer breakage rate and sawing thinner wafers will decrease the cost of solar cells. This study was carried out in order to identify ways to achieve this goal. In this study, the cutting force characteristics using an ingot tilting-type diamond multi wire-sawing machine were analyzed. The cutting force was analyzed while varying the tilting angles and wire speed. The obtained data were analyzed by classifying the tangential cutting force and the normal cutting force. In this cutting force experiment, the difference between the forces was confirmed; it was found that it rises with increasing the tilting angles and decreases when the wire speed elevates. The resulting value can be utilized as basic data for the determination of an ideal cutting recipe.

• 한국터널지하공간학회 논문집
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• 제17권6호
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• pp.615-621
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• 2015

In this paper diamond wire cutting method has been proposed to cut the rock in the tunnel face. Diamond wire saw method could cut the rock from tunnel face with very minor vibration and noise. In this study rock cutting process has been simulated with FEM method by using LS-DYNA explicit non-linear finite element code. Normal load act as an prime factor when cutting the rock surface. For observing the effect of normal load on bead, several experiments has been conducted by varying normal loads on the bead. From each experiment, cutting rate has been calculated to compare the cutting rate with different load conditions. By increasing the normal load on bead, cutting rate increases drastically.

• 한국기계가공학회지
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• 제15권1호
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• pp.26-33
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• 2016

In this study, a new method to develop a fixed diamond wire for silicon wafer machining by the multi-wire cutting method was developed. The new twist diamond wire has improved performance with high breaking strength and chip flutes structure. According to these characteristics, the new twist diamond wire can be used in the higher speed multi-wire cutting process with a long lifetime. Except the design of the new structure, the twist diamond wire is coating by electroless-electroplating process. It is good for reducing breakage and the falling-off of diamond grains. Based on the silicon material removal mechanism and performance of the wire-cutting machine, the optimal processing condition of the new twist diamond wire has been derived via mathematical analysis. At last, through the tensile testing and the machining experiments, the performance of the twist diamond wire has been obtained to achieve the development goals and exceed the single diamond wire.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2007년도 추계학술대회 논문집
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• pp.7-8
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• 2007