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http://dx.doi.org/10.14775/ksmpe.2016.15.3.066

A Study on Cutting Force during Multi Wire Sawing of Silicon Wafers for Solar Cells  

Hwang, In-Hwan (Department of Engineering Science & Mechanics, Kumoh National Institute of Technology)
Park, Sang-Hyun (Department of Engineering Science & Mechanics, Kumoh National Institute of Technology)
An, Kuk-Jin (SAEHAN NANOTECH LTD.)
Kwun, Geon-Dae (SAEHAN NANOTECH LTD.)
Lee, Chan-Jong (Department of Engineering Science & Mechanics, Kumoh National Institute of Technology)
Publication Information
Journal of the Korean Society of Manufacturing Process Engineers / v.15, no.3, 2016 , pp. 66-71 More about this Journal
Abstract
Reducing the wafer breakage rate and sawing thinner wafers will decrease the cost of solar cells. This study was carried out in order to identify ways to achieve this goal. In this study, the cutting force characteristics using an ingot tilting-type diamond multi wire-sawing machine were analyzed. The cutting force was analyzed while varying the tilting angles and wire speed. The obtained data were analyzed by classifying the tangential cutting force and the normal cutting force. In this cutting force experiment, the difference between the forces was confirmed; it was found that it rises with increasing the tilting angles and decreases when the wire speed elevates. The resulting value can be utilized as basic data for the determination of an ideal cutting recipe.
Keywords
Multi Wire Sawing Machine; Diamond Wire Saw; Cutting Force; Silicon Ingot;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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