Journal of the Korean Society of Manufacturing Process Engineers (한국기계가공학회지)

The Korean Society of Manufacturing Process Engineers (한국기계가공학회)
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A Study on Cutting Force during Multi Wire Sawing of Silicon Wafers for Solar Cells

태양전지용 실리콘 웨이퍼의 멀티 와이어 쏘잉 시 절삭저항력에 관한 연구

  • Hwang, In-Hwan (Department of Engineering Science & Mechanics, Kumoh National Institute of Technology) ;
  • Park, Sang-Hyun (Department of Engineering Science & Mechanics, Kumoh National Institute of Technology) ;
  • An, Kuk-Jin (SAEHAN NANOTECH LTD.) ;
  • Kwun, Geon-Dae (SAEHAN NANOTECH LTD.) ;
  • Lee, Chan-Jong (Department of Engineering Science & Mechanics, Kumoh National Institute of Technology)
  • Received : 2015.12.21
  • Accepted : 2016.04.04
  • Published : 2016.06.30
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Abstract

Reducing the wafer breakage rate and sawing thinner wafers will decrease the cost of solar cells. This study was carried out in order to identify ways to achieve this goal. In this study, the cutting force characteristics using an ingot tilting-type diamond multi wire-sawing machine were analyzed. The cutting force was analyzed while varying the tilting angles and wire speed. The obtained data were analyzed by classifying the tangential cutting force and the normal cutting force. In this cutting force experiment, the difference between the forces was confirmed; it was found that it rises with increasing the tilting angles and decreases when the wire speed elevates. The resulting value can be utilized as basic data for the determination of an ideal cutting recipe.

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References

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