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http://dx.doi.org/10.14775/ksmpe.2016.15.1.026

A Study on New Twist-Diamond Wire Characteristics for Improving Processing Performance  

Park, Chang-Yong (Kumoh National Institute of Technology)
Kweon, Hyun-Kyu (Kumoh National Institute of Technology)
Peng, Bo (Kumoh National Institute of Technology)
Jung, Bong-Gyo (GL.TECH)
Publication Information
Journal of the Korean Society of Manufacturing Process Engineers / v.15, no.1, 2016 , pp. 26-33 More about this Journal
Abstract
In this study, a new method to develop a fixed diamond wire for silicon wafer machining by the multi-wire cutting method was developed. The new twist diamond wire has improved performance with high breaking strength and chip flutes structure. According to these characteristics, the new twist diamond wire can be used in the higher speed multi-wire cutting process with a long lifetime. Except the design of the new structure, the twist diamond wire is coating by electroless-electroplating process. It is good for reducing breakage and the falling-off of diamond grains. Based on the silicon material removal mechanism and performance of the wire-cutting machine, the optimal processing condition of the new twist diamond wire has been derived via mathematical analysis. At last, through the tensile testing and the machining experiments, the performance of the twist diamond wire has been obtained to achieve the development goals and exceed the single diamond wire.
Keywords
Wire Cutting; Silicon Wafer; Silicon Machining; Implanted Diamond Wire (IDW);
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
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