• 폴리머
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• 제34권3호
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• pp.191-197
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• 2010

이방성 전도필름(ACF)의 경화방법을 개선하기 위하여 이미다졸계 경화제 대신에 저온에서도 경화가 빠른 열잠재성 양이온 개시제형 경화제를 사용한 에폭시 수지의 경화를 연구하였다. 경화특성의 분석을 위해 유리전이온도, 저장모듈러스, 열팽창계수를 포함한 열적기계적 특성을 조사하였으며 열사이클, 고온고습 신뢰성을 관찰하였다. 열잠재성 양이온 개시제형 경화제를 사용한 ACF가 이미다졸계 경화제를 사용한 경우보다 경화속도는 빨랐으며, 열팽창계수는 낮았고, $T_g$가 높아서 고온안정성도 우수하였다. 또 낮은 온도와 빠른 경화에도 불구하고 안정적인 접속 저항을 유지하여 높은 신뢰성을 나타내었다. 본 연구를 통하여 에폭시 경화방법은 ACF의 열적기계적 특성과 신뢰성에 큰 영향을 미치는 중요한 인자임을 확인하였다.

• 한국재료학회:학술대회논문집
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• 한국재료학회 1996년도 재료학회 추계학술발표회
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• pp.183-183
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• 1996

• 한국전기전자재료학회논문지
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• 제25권10호
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• pp.844-848
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• 2012

Encapsulant curing in terms of convection oven leads to thermal induced stress due to nonuniform thermal conductivity in LED package. We have adopted infrared (IR) light for silicone curing in order to release the stress. The light uniformity irradiated on an encapsulant surface is confirmed to be uniform by optical simulation. Shear strength of die paste using IR compared to convection oven is increased 19.2% at the same curing time, which indicates curing time can be shortened. The indentation depth difference between center and edge of silicone encapsulant in terms of convection oven and IR are 14.8% and 3.4%, respectively. Curing by IR also shows 2.3% better radiant flux persistency rate of LED at $85^{\circ}C$ after 1,000 h reliability test compared to convection curing.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.242-242
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• 2006

Increasingly complex tasks are performed by computers or cellular phone, requiring more and more memory capacity as well as faster and faster processing speeds. This leads to a constant need to develop more highly integrated circuit systems. Therefore, there have been numerous studies by many engineers investigating circuit patterning. In particular, PCB including module/package substrates such as FCB (Flip Chip Board) has been developed toward being low profile, low power and multi-functionalized due to the demands on miniaturization, increasing functional density of the boards and higher performances of the electric devices. Imprint lithography have received significant attention due to an alternative technology for photolithography on such devices. The imprint technique. is one of promising candidates, especially due to the fact that the expected resolution limits are far beyond the requirements of the PCB industry in the near future. For applying imprint lithography to FCB, it is very important to control thermal properties and mechanical properties of dielectric materials. These properties are very dependent on epoxy resin, curing agent, accelerator, filler and curing degree(%) of dielectric materials. In this work, the epoxy composites filled with silica fillers and cured with various accelerators having various curing degree(%) were prepared. The characterization of the thermal and mechanical properties wasperformed by thermal mechanical analysis (TMA), thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), rheometer, an universal test machine (UTM).

• 접착 및 계면
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• 제19권2호
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• pp.74-82
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• 2018

아크릴레이트 기반의 점착제를 가교 시키는 기술은 다양하게 소개되어 왔다. 본 연구에서는 에폭시 변성 단량체와 메틸아지리딘 가교제를 활용하여 높은 가교 밀도를 가지는 아크릴 구조체를 만들었다. 베이스구조체를 제조하기 위해서 빠른 제조 공정이 가능하고 무용제 공정이 가능한 UV 중합 기술을 활용했다. FT-IR, 경화거동 및 접착특성 평가를 통해 UV경화도 및 2차경화 온도에 따른 특성 변화를 확인하고자 하였다. 겔분율은 선경화 $800mJ/cm^2$, 120도 후 경화온도 조건에서 50%이상 확보할 수 있었으며, 180도 경화조건에서 80%이상 확보 할 수 있었다. 경화 시간이 길어짐에 따라 경화도가 100%에 도달하였으며 이를 통해 열경화를 통한 2차 경화가 효과적임을 확인 할 수 있었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.220-221
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• 2007

Recently, imprint lithography have received significant attention due to an alternative technology for photolithography on high performance microelectronic devices. In this work, we investigated thermal stabilities and dynamic mechanical properties of dielectric materials for thermal imprint lithography. Curing behaviours, thermal stabilities, and dynamic mechanical properties of the dielectric materials cured with various curing agent and spherical filler were studied using dynamic differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), rheometer and universal test machine(UTM).

• 한국건축시공학회지
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• 제4권2호
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• pp.113-118
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• 2004

This study is a basic experiment on quality management of the compression strength of high strength concrete, aiming. at quality management of high strength mass concrete by giving the temperature hysteresis of the mass test pieces to managerial test pieces. Different from ordinary concrete, high strength concrete generally shows the temperature high rising caused by hydration heat inside the concrete. It is known that, in mass concrete, thermal stress occurs due to the difference in temperature between the inside and the outside, which causes a significant difference in compression strength between structure beams and managerial test pieces. It is also reported that there is a large difference between the compression strength of cylindrical managerial test pieces of standard underwater curing and the strength of structure beam concrete. Thus, this study made concrete test pieces in an optimal mix ratio for each strength level, and also created thermal insulation curing box and managerial test pieces. Then it carried out comparative analysis in relation to core strength and suggested equipment and a technique that can control the strength of high strength concrete mass more conveniently and accurately.

• 정보저장시스템학회논문집
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• 제3권3호
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• pp.113-117
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• 2007

재생층이 상변화물질로 이루어진 초해상 광디스크에 있어서, 기록 전과 후에 thermal curing 을 실시하여 신호품질과 재생안정성이 크게 향상되었다. Pre-curing으로 수천 회 이하에서 나타나는 short-term stability가 향상되었고, post-curing 한 후 mid-term stability 가 향상되었다. 그리고, pre- and post-curing 후 noise level 은 전반적으로 $1{\sim}2dB$가 낮아졌고, CNR은 $2{\sim}3dB$, jitter 는 $2{\sim}3%$ 가 향상되었다.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2012년도 춘계 학술논문 발표대회
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• pp.81-83
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• 2012

This paper is to compare the temperature history of the concrete using existing curing sheet and developed curing sheet made with double layered bubble sheet subjected to clod climate. Field application was conducted. According to results, application of developed curing sheet makes the temperature of curing house and concrete higher than existing curing sheet by about 3℃. This is due to the lower thermal conductivity of developed curing sheet.

• 대한치과보철학회지
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• 제35권4호
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• pp.697-705
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• 1997

The purpose of this study was to evaluate the effects of two metal adhesive primers on the shear bond strengths of self-curing resin to Ni-Cr a]toy and the effects of 1000 thermal cycling on the durability of the bond. The two selected metal adhesive primers were Metal Primer II(G-C corp., Japan) and MR Bond(Tokuyama corp., Japan) and no treatment groups were used as control. All specimens were divided into two groups according to thermal cycling. In the group without thermal cycling, the specimens were stored in water for 24 hours. In the group with thermal cycling, the specimens were thermocycled 1000 times at temperature of $5^{\circ}C\;and\;55^{\circ}C$. Shear bond strengths were measured using the Universal testing machine(Zwick 145641, Germany) with a crosshead speed of 0.5 mm/min. The results were as follows: 1. MR Bond significantly improved the shear bond strength of resin to Ni-Cr alloy before and after thermal cycling. 2. There were no difference in the shear bond strength of resin to Ni-Cr alloy between Metal Primer II treated group and no treatment group. 3. Regardless of the type and the use of adhesive primers, there were tendency of decrease in shear bond strength with 1000 thermal cycling.