Browse > Article
http://dx.doi.org/10.4313/JKEM.2012.25.10.844

Effect of Curing Method on the Reliability of Silicone Encapsulant for Light Emitting Diode  

Kim, Wan-Ho (New Lighting Solution R&BD Sector, Korea Photonics Technology Institute)
Jang, Min-Suk (New Lighting Solution R&BD Sector, Korea Photonics Technology Institute)
Kang, Young-Rae (New Lighting Solution R&BD Sector, Korea Photonics Technology Institute)
Kim, Ki-Hyun (New Lighting Solution R&BD Sector, Korea Photonics Technology Institute)
Song, Sang-Bin (New Lighting Solution R&BD Sector, Korea Photonics Technology Institute)
Yeo, In-Seon (Department of Electrical Engineering, Chonnam National University)
Kim, Jae-Pil (New Lighting Solution R&BD Sector, Korea Photonics Technology Institute)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.25, no.10, 2012 , pp. 844-848 More about this Journal
Abstract
Encapsulant curing in terms of convection oven leads to thermal induced stress due to nonuniform thermal conductivity in LED package. We have adopted infrared (IR) light for silicone curing in order to release the stress. The light uniformity irradiated on an encapsulant surface is confirmed to be uniform by optical simulation. Shear strength of die paste using IR compared to convection oven is increased 19.2% at the same curing time, which indicates curing time can be shortened. The indentation depth difference between center and edge of silicone encapsulant in terms of convection oven and IR are 14.8% and 3.4%, respectively. Curing by IR also shows 2.3% better radiant flux persistency rate of LED at $85^{\circ}C$ after 1,000 h reliability test compared to convection curing.
Keywords
LED; Silicone; Encapsulation; Reliability; Convection curing; Infrared curing;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
1 A. C. Loss and S. George, J. Compos. Mater., 17, 135, (1983).   DOI
2 H. Lee, J. Park, M. Kim, and J. Kim, J. KIEEME 22, 1033 (2009).
3 S. Lee, S. Lee, J. Yang, J. Lee, and D. Park, Trans. KIEE, 59, 609 (2010).
4 Z. Liu. S. Liu, Kai Wang, and X. Luo, Front. Optoelectron. China, 2, 119 (2009).   DOI
5 D. A. Steigerwald, J. C. Bhat, D. Collins, R. M. Fletcher, M. O. Holcomb, M. J. Ludowise, P. S. Martin, and S. L. Rudaz, IEEE J. Sel. Topics Quantum Electron., 8, 310 (2002).   DOI   ScienceOn
6 E. F. Schubert, Light Emitting Diode, 2nd ed. (Cambridge University Press, Cambridge, 2006) p. 195.
7 L. Liu, B. M. Zhang, D. F. Wang, and Z. J. Wu, Compos. Struct., 73, 303 (2006).   DOI
8 P. Olivier, J. P. Cottu, and B. Ferret. Composites., 26, 509 (1995).   DOI
9 J. M. Tang, I. W. Lee, and G. S. Springer, J. Compos. Mater., 21, 421 (1987).   DOI