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A Study on the Thermo-mechanical Characteristics and Adhesion Reliability of Anisotropic Conductive Films Depend on the Curing Methods of Epoxy Resins  

Gil, Man-Seok (Department of Polymer Science and Engineering, Chungnam National University)
Seo, Kyoung-Won (ACF Research Institute, H&S HighTech)
Kim, Jae-Han (ACF Research Institute, H&S HighTech)
Lee, Jong-Won (ACF Research Institute, H&S HighTech)
Jang, Eun-Hee (ACF Research Institute, H&S HighTech)
Jeong, Do-Yeon (ACF Research Institute, H&S HighTech)
Kim, Su-Ja (ACF Research Institute, H&S HighTech)
Kim, Jeong-Soo (Department of Polymer Science and Engineering, Chungnam National University)
Publication Information
Polymer(Korea) / v.34, no.3, 2010 , pp. 191-197 More about this Journal
Abstract
To improve the curing method of anisotropic conductive film (ACF) at low temperature, it was studied to replace the thermal latent curing agent of imidazole compounds by the curing agent of cationically initiating type. Thermo-mechanical properties such as glass transition temperature, storage modulus, and coefficient of thermal expansion were investigated for the analysis of curing behavior. The reliability of ACF were observed in thermal cycle and high temperature-high humidity test. ACF using cationic initiator showed faster curing, lower CTE, and higher $T_g$ than the case of using imidazole curing agent, which is important for the high temperature stability. Furthermore, ACF using cationic initiator maintained a stable contact resistance in reliability test, although it was cured at low temperature and fast rate. With these results, it was confirmed that the curing method of epoxy had great effect on thermo-mechanical properties and reliability of ACF.
Keywords
anisotropic conductive film; epoxy; curing; reliability; thermal property;
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1 K. S. Moon, J. Wu, and C. P. Wong, IEEE Trans. Comp. Packag. Technol., 26, 375, (2003).   DOI   ScienceOn
2 M. J. Yim and K. W. Paik, Int. J. Adhes. Adhes., 26, 304 (2006).   DOI   ScienceOn
3 Z. Lai and J. Liu, IEEE Trans. Comp. Pack. Manuf. Tech. Part B, 19, 644 (1996).   DOI   ScienceOn
4 J. S. Hwang, M. J. Yim, and K. W. Paik, J. Electron. Mater., 35, 1722 (2006).   DOI   ScienceOn
5 C. Wang and P. J. Bos, Displays, 25, 187 (2004).   DOI   ScienceOn
6 J. V. Crivello and J. H. W. Lam, J. Polym. Sci., Polym. Chem. Ed., 18, 1021 (1980).   DOI
7 T. Lijima, N. Yoshioka, and M. Tomoi, Eur. Polym. J., 28, 573 (1992).   DOI   ScienceOn
8 S. J. Park and H. C. Kim, J. Polym. Sci. Part B: Polym. Phys., 39, 121 (2001).   DOI   ScienceOn
9 R. L. Wheeler, The Epoxy Resin Formulators Training Manual, The Society of The Plastics Industry, New York, 1984.
10 S. J. Park, M. S. Cho, and J. R. Lee, Polymer(Korea), 23, 413 (1999).
11 J. M. Kim, J. of KWJS, 25, 133 (2007).
12 J. Gu, S. C. Narang, and E. L. Pearce, J. Appl. Polym. Sci., 30, 2997 (1985).   DOI   ScienceOn
13 S. V. Rosato, D. P. Dimattia, and D. V. Rosato, Designing with Plastics and Composites, Nostrand Reinhold, New York, 1991.
14 R. S Bauer, Epoxy Resin Chemistry, American Chemical Society, Washington D.C., 1979.
15 C. A. May, Epoxy Resin, Marcel Dekker, New York, 1988.
16 S. Asai, J. Appl. Polym. Sci., 56, 769 (1995).   DOI   ScienceOn
17 Y. Li and C. P. Wong, Mater. Sci. Eng. R, 51, 1 (2006).   DOI   ScienceOn
18 M. J. Yim, J. Electron. Mater., 33, 76 (2004).   DOI   ScienceOn