A Study on the Thermo-mechanical Characteristics and Adhesion Reliability of Anisotropic Conductive Films Depend on the Curing Methods of Epoxy Resins |
Gil, Man-Seok
(Department of Polymer Science and Engineering, Chungnam National University)
Seo, Kyoung-Won (ACF Research Institute, H&S HighTech) Kim, Jae-Han (ACF Research Institute, H&S HighTech) Lee, Jong-Won (ACF Research Institute, H&S HighTech) Jang, Eun-Hee (ACF Research Institute, H&S HighTech) Jeong, Do-Yeon (ACF Research Institute, H&S HighTech) Kim, Su-Ja (ACF Research Institute, H&S HighTech) Kim, Jeong-Soo (Department of Polymer Science and Engineering, Chungnam National University) |
1 | K. S. Moon, J. Wu, and C. P. Wong, IEEE Trans. Comp. Packag. Technol., 26, 375, (2003). DOI ScienceOn |
2 | M. J. Yim and K. W. Paik, Int. J. Adhes. Adhes., 26, 304 (2006). DOI ScienceOn |
3 | Z. Lai and J. Liu, IEEE Trans. Comp. Pack. Manuf. Tech. Part B, 19, 644 (1996). DOI ScienceOn |
4 | J. S. Hwang, M. J. Yim, and K. W. Paik, J. Electron. Mater., 35, 1722 (2006). DOI ScienceOn |
5 | C. Wang and P. J. Bos, Displays, 25, 187 (2004). DOI ScienceOn |
6 | J. V. Crivello and J. H. W. Lam, J. Polym. Sci., Polym. Chem. Ed., 18, 1021 (1980). DOI |
7 | T. Lijima, N. Yoshioka, and M. Tomoi, Eur. Polym. J., 28, 573 (1992). DOI ScienceOn |
8 | S. J. Park and H. C. Kim, J. Polym. Sci. Part B: Polym. Phys., 39, 121 (2001). DOI ScienceOn |
9 | R. L. Wheeler, The Epoxy Resin Formulators Training Manual, The Society of The Plastics Industry, New York, 1984. |
10 | S. J. Park, M. S. Cho, and J. R. Lee, Polymer(Korea), 23, 413 (1999). |
11 | J. M. Kim, J. of KWJS, 25, 133 (2007). |
12 | J. Gu, S. C. Narang, and E. L. Pearce, J. Appl. Polym. Sci., 30, 2997 (1985). DOI ScienceOn |
13 | S. V. Rosato, D. P. Dimattia, and D. V. Rosato, Designing with Plastics and Composites, Nostrand Reinhold, New York, 1991. |
14 | R. S Bauer, Epoxy Resin Chemistry, American Chemical Society, Washington D.C., 1979. |
15 | C. A. May, Epoxy Resin, Marcel Dekker, New York, 1988. |
16 | S. Asai, J. Appl. Polym. Sci., 56, 769 (1995). DOI ScienceOn |
17 | Y. Li and C. P. Wong, Mater. Sci. Eng. R, 51, 1 (2006). DOI ScienceOn |
18 | M. J. Yim, J. Electron. Mater., 33, 76 (2004). DOI ScienceOn |