Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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Thermal stabilities and dynamic mechanical properties of dielectric materials for thermal imprint lithography

임프린트 공법적용을 위한 절연재료의 열적, 기계적 성질

  • Cho, Jae-Choon (Samsung electro-mechanics Central R&D Institute eMD center) ;
  • Ra, Seung-Hyun (Samsung electro-mechanics Central R&D Institute eMD center)
  • 조재춘 (삼성전기 중앙연구소 eMD center) ;
  • 나승현 (삼성전기 중앙연구소 eMD center)
  • Published : 2007.06.21
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Abstract

Recently, imprint lithography have received significant attention due to an alternative technology for photolithography on high performance microelectronic devices. In this work, we investigated thermal stabilities and dynamic mechanical properties of dielectric materials for thermal imprint lithography. Curing behaviours, thermal stabilities, and dynamic mechanical properties of the dielectric materials cured with various curing agent and spherical filler were studied using dynamic differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), rheometer and universal test machine(UTM).

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