• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.1-9
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• 2010

Three-dimensional (3-D) integration is an emerging technology, which vertically stacks and interconnects multiple materials, technologies, and functional components such as processor, memory, sensors, logic, analog, and power ICs into one stacked chip to form highly integrated micro-nano systems. Since CMOS device scaling has stalled, 3D integration technology allows extending Moore's law to ever high density, higher functionality, higher performance, and more diversed materials and devices to be integrated with lower cost. The potential benefits of 3D integration can vary depending on approach; increased multifunctionality, increased performance, increased data bandwidth, reduced power, small form factor, reduced packaging volume, increased yield and reliability, flexible heterogeneous integration, and reduced overall costs. It is expected that the semiconductor industry's paradiam will be shift to a new industry-fusing technology era that will offer tremendous global opportunities for expanded use of 3D based technologies in highly integrated systems. Anticipated applications start with memory, handheld devices, and high-performance computers and extend to high-density multifunctional heterogeneous integration of IT-NT-BT systems. This paper attempts to introduce new 3D integration technologies of the chip self-assembling stacking and 3D heterogeneous opto-electronics integration for realizng the super-chip.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.61-66
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• 2010

Cu-Cu thermo-compression bonding process was successfully developed as functions of the deposited Cu thickness and $Ar+H_2$ forming gas annealing conditions before and after bonding step in order to find the low temperature bonding conditions of 3-D integrated technology where the interfacial toughness was measured by 4-point bending test. Pre-annealing with $Ar+H_2$ gas at $300^{\circ}C$ is effective to achieve enough interfacial adhesion energy irrespective of Cu film thickness. Successful Cu-Cu bonding process achieved in this study results in delamination at $Ta/SiO_2$ interface rather than Cu/Cu interface.

• Journal of Fisheries and Marine Sciences Education
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• v.23 no.2
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• pp.153-161
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• 2011

Creating standards on thermal environment has been organized traditionally based on the youth and the manhood who are in mainly active layer of a society. However, traditional creating standards have differences from the physiology of the aged who have weak physical ability than younger person. As a result, it causes a health problem of the aged. Therefore, In this study, we had a basic study to create a comfortable thermal environment which had considered to a physical ability and a physiology of the aged, and build a ecological residence space to maintain health. We had several experiments with the aged; Experiment, Comfort Sensation Vote, Mean Skin Temperature and Analyzing HRV. The result have following by: 1)For the aged, the summer recommend temperature, $26^{\circ}C$, is appropriate within first 30 ~ 40 minutes, but it should be increasing the temperature after that time. 2) By considering PMV status and thermal feeling of the aged, they are prefer to higher temperature than normal setting of air-condition system. 3) In the condition of the summer recommend temperature, $26^{\circ}C$, they had answered in neutral or comfort with the comfort sensation vote. However, we had figure out that they had stress in a lower temperature by analyzing the result of HRV.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.38.2-38.2
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• 2011

구리는 현재 반도체 배선으로 가장 많이 사용되는 재료이다. 배선기술이 발전함에 따라 배선두께가 얇아지게 되었고 배선간의 간격 또한 좁아지게 되었다. 간격의 감소는 RC delay 문제점을 야기하였고 이를 해결하기 위해 배선 사이에 Low-k물질을 채우는 노력이 지속되었다. 이상적으로 가장 낮은 유전율을 나타내는 물질은 공기 즉, 아무것도 채우지 않는 것이다. 하지만 이렇게 되면 기계적인 문제가 발생하는데 이를 해결하기 위해서 구리의 강도를 향상시켜야 한다. 강도를 높이려면 Hall-Petch 관계에 의해 결정립의 크기를 작게 만들어야 한다. 그렇지만 이는 곧 전기전도도의 감소를 나타내기 때문에 소자의 구동에 문제가 되어왔다. 이 문제를 해결하기 위해 펄스전해증착을 통한 나노사이즈의 쌍정구조를 가지는 구리의 개발이 진행되었다. 나노쌍정구리는 결정립이 정합면으로 이루어져 있는 쌍정구조로 이루어져 있어 전기전도도의 감소를 최소화하고 강도를 비약적으로 향상시킬 수 있을뿐더러 연신율도 높일 수 있다는 장점을 가지고 있다. 이렇게 고강도 저저항을 나타내는 나노쌍정구리는 Via filling, Through Silicon Via(TSV)에서의 칩간 연결 배선, 2차전지의 전극 등에 적용 가능성이 매우 높다. 이들은 주로 첨가제와 함께 전해증착을 통해 제작된다. 하지만 이러한 첨가제를 넣고 나노쌍정구리를 합성하기 위해 펄스전해증착을 시행할 경우, 나노 쌍정구리의 형성이 억제되고, Off-time이 존재하지 않는 일반 전해증착에서와는 다른 현상이 나타나게 된다. 이러한 이유로 본 연구에서는 현재 가장 많이 사용되고 있는 첨가제인 Poly (ethylene glycol) (PEG, 억제제)와 bis (3-sulfopropyl) disulfide (SPS, 가속제)을 사용하여 그 이유를 알아보고 첨가제를 사용하면서 나노쌍정구리의 밀도를 높일 수 있는 방안에 대해서 실험을 진행하였다.

• Journal of the Korean Association of Oral and Maxillofacial Surgeons
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• v.39 no.4
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• pp.161-167
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• 2013

Objectives: The objective of this study is compare the rate of marginal bone resorption around hydroxyapatite-coated implants given different loading times in order to evaluate their stability. Materials and Methods: The study was conducted retrospectively for one year, targeting 41 patients whose treatment areas were the posterior maxilla and the mandible. Osstem TS III HA (Osstem Implant Co., Busan, Korea) and Zimmer TSV-HA (Zimmer Dental, Carlsbad, CA, USA), which employ the new hydroxyapatite coating technique, were used. The patients were divided into two groups - immediate and delayed loading - and the bone level at the time of loading commencement and after one year of loading was measured using periapical radiography. Differences between the groups were evaluated using Mann-Whitney (${\alpha}$=0.05). Results: For all patients as a single group, the survival rate of the implants was 100%, and the mean marginal bone loss was $0.26{\pm}0.59mm$. In comparison of the differences by loading, mean marginal bone loss of $0.32{\pm}0.69mm$ was recorded for the immediate loading group whereas the delayed loading group had mean marginal bone loss of $0.16{\pm}0.42mm$. However, the difference was not significant (P>0.05). Conclusion: Within the limited observation period of one year, predictable survival rates can be expected when using immediately loaded hydroxyapatite-coated implants.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.117-123
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• 2014

Cu through-vias, which can be used as thermal vias or vertical interconnects, were formed using bottom-up electrodeposition filling as well as top-down electrodeposition filling into open via-holes and their microstructures were observed. Solid Cu through-vias without voids could be successfully formed by bottom-up filling as well as top-down filling with direct-current electrodeposition. While chemical-mechanical polishing (CMP) to remove the overplated Cu layer was needed on both top and bottom surfaces of the specimen processed by top-down filling method, the bottomup process has an advantage that such CMP was necessary only on the top surface of the sample.

• The Journal of Advanced Prosthodontics
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• v.10 no.2
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• pp.85-92
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• 2018

PURPOSE. This research evaluated clinical outcomes of two types of hydroxyapatite (HA)-coated implants: OT (Osstem TS III-HA, Osstem implant Co., Busan, Korea) and ZM (Zimmer TSV-HA, Zimmer dental, Carlsbad, USA). MATERIALS AND METHODS. The research was conducted on 303 implants (89 of OT, 214 of ZM), which were placed from January 16, 2010 to December 20, 2012. The prognosis was evaluated in terms of success rates, survival rates, annual marginal bone loss, and implant stability quotients (ISQ). The samples were classified into immediate, early, conventional, and delayed groups according to the loading time. RESULTS. Overall, there were no significant differences between OT and ZM in success rates, survival rates, and annual marginal bone loss, except for the result of secondary stability. OT showed $77.83{\pm}8.23ISQ$, which was marginally higher than $76.09{\pm}6.90ISQ$ of ZM (P<.05). In terms of healing periods, only immediate loading showed statistically significant differences (P<.05). Differences between OT and ZM were observed in terms of two indices, the annual marginal bone loss ($0.17{\pm}0.58mm/year$ < $0.45{\pm}0.80mm/year$) and secondary stability ($84.36{\pm}3.80ISQ$ > $82.48{\pm}3.69ISQ$) (P<.05). OT and ZM did not have any statistically significant differences in early, conventional, and delayed loading (P>.05). CONCLUSION. OT (97.75%) and ZM (98.50%) showed relatively good outcomes in terms of survival rates. In general, OT and ZM did not show statistically significant differences in most indices (P>.05), although OT performed marginally better than ZM in the immediate loading and 1-stage surgery (P<.05).

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.7
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• pp.30-36
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• 2011

Three-dimensional (3D) memories using through-silicon vias (TSVs) as vertical bus across memory layers are implemented by many semiconductor companies. 3D memories are composed of known-good-dies (KGDs). If additional faults are arisen during bonding, they should be repaired. In order to enhance the yield of 3D memories with inter-die redundancies, a die-matching method is needed to effectively stack memory dies in a 3D memory. In this paper, a new die-matching method is proposed for 3D memory yield enhancement with inter-die redundancies considering additional faults arisen during bonding. Three boundary-limited conditions are used in the proposed die-matching method; they set bounds to the search spaces for selecting memory dies to manufacture a 3D memory. Simulation results show that the proposed die-matching method can greatly enhance the 3D memory yield.

• Journal of Fisheries and Marine Sciences Education
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• v.18 no.2
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• pp.77-84
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• 2006

This research evaluates thermal comfort by comparing the case of maintain cooing temperature of room with the case of raising it at the point of time that human body begins to adapt. An experiment uses constant temperature & humidity chamber 2 places. Pretesting room make up summer season environment, the testing room control by air-conditioner. In condition that maintain temperature of $33^{\circ}C$. The subjects stay in the pretesting room during the 30 minute for the heat storage amount of the normal summertime. The subjects stay in the testing room under each case (case 1: maintaining $24^{\circ}C$, case 2: maintaining $26^{\circ}C$, case 3: up $1^{\circ}C$ after maintaining $24^{\circ}C$ during 30 minute, case 4: up $1^{\circ}C$ after maintaining $26^{\circ}C$ during 40 minute). 1. Result of comparison of case 1 and case 2 appears that thermal sensitive vote examine from slight cool to cool and thermal comfort examine slight comfort by temperature rise at human body adaptation point of time.2. Test of case 3 and case 4 appear similar value at thermal sensitive vote and thermal comfort.3. Through the case 2 and case 4, continuous thermal comfort maintain at $24^{\circ}C$, if raise $26^{\circ}C$, same thermal comfort maintain after a human body adaptation temperature rising effect bring energy saving.

• Journal of Fisheries and Marine Sciences Education
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• v.18 no.1
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• pp.11-18
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• 2006

Man has always striven to create a thermally comfortable environment. This is reflected in building traditions around the world - from ancient history to present day. Today, creating a thermally comfortable environment is still one of the most important parameters to be considered when designing buildings. It is defined in the ISO 7730 standard as being "That condition of mind which expresses satisfaction with the thermal environment". A definition most people can agree on, but also a definition is not easily converted into physical parameters. Thermal comfort is a matter of many physical parameters, and not just one, as for example the air temperature that is set by air-conditioner. The most important matter Today's common offices and homes are only depending on air-conditioning as a cooling system during the summer. This kind of system tends to be focused on the person who controls it and those who are around the air-conditioner while thermal-comfort is neglected. Futhermore, the people's body conditions are not considered during each time that beginning, middle, last of the air-conditioning which causing displeasure of the residents more and more. This kind of operating system is set for a long time may causes unbalanced air condition and man's psychologic displeasure goes to increase.