Cu Thickness Effects on Bonding Characteristics in Cu-Cu Direct Bonds |
Kim, Jae-Won
(School of Materials Science and Engineering, Andong National University)
Jeong, Myeong-Hyeok (School of Materials Science and Engineering, Andong National University) Carmak, Erkan (EV Group) Kim, Bioh (EV Group) Matthias, Thorsten (EV Group) Lee, Hak-Joo (Nano-Mechanical System Rearch Division, Korea Institute of Machinery & Materials) Hyun, Seung-Min (Nano-Mechanical System Rearch Division, Korea Institute of Machinery & Materials) Park, Young-Bae (School of Materials Science and Engineering, Andong National University) |
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