• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.23 no.3
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• pp.230-236
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• 2014

Wafer level package technology is added to the surface of wafer circuit packages to create a semiconductor technology that can minimize the size of the package. However, in conventional packaging, warpage and fracture are major concerns for semiconductor manufacturing. We optimized the wafer dam design using a finite element method according to the dam height and heat distribution thermal properties. The dam design influences the uniform deposition of the image sensor and prevents the filling material from overflowing. In this study, finite element analysis was employed to determine the key factors that may affect the reliability performance of the dam package. Three-dimensional finite element models were constructed using the simulation software ANSYS to perform the dam thermo-mechanical simulation and analysis.

• Journal of Sensor Science and Technology
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• v.31 no.1
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• pp.36-40
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• 2022

High-power devices, such as LEDs and radars, inevitably generate a large amount of heat, which is the main cause of shortening lifespan, deterioration in performance, and failure of electronic devices. The embedded IC process can be a solution; however, when applied to large-area substrates (larger than 8 in), there is a limit owing to the difficulty in the process after wafer thinning. In this study, an 8-in wafer-level high-power electronic package based on the embedded IC process was implemented with temporary bonding and debonding technology using double-sided thermal release tape. Good heat-dissipation characteristics were demonstrated both theoretically and experimentally. These findings will advance the commercialization of high-power electronic packaging.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.5
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• pp.2113-2120
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• 2013

In this study, an efficient machine vision based inspection system is developed for the in-line measurement of phosphor resin dispensing shapes on LED chip package. Since the phosphor resin (target material) has semitransparent characteristics, illuminated light beam is reflected from the bottom of the chip as well as from the surface. Since such phenomenon can deteriorate inspection reliability, a white LED and a 635nm laser slit beams are experimentally tested to decide suitable illumination optics. Also, specular and diffuse reflection methods are tested to decide suitable optical triangulation. As a result, it can be known that the combination of a white slit beam source and specular reflection method show the best inspection results. The Catmull-Rom spline interpolation is applied to the obtained data to form smoother surface. From the results, it can be conclude that the developed system can be sucessfully applied to the in-line inspection of LED chip packaging process.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.11a
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• pp.588-592
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• 1996

In this paper, we have constructed an expert system for semiconductor chip encapsulation which combines a knowledge-based system with CAE software. The knowledge-base module includes heuristic and pre-analysis knowledge for evaluation and redesign. Evaluation of the initial design and generation of redesign recommendations can be developed from the rules as applied to a given chip Package. The CAE programs can be used for simulating the filling and packing stage of encapsulation process. The expert system is a new tool which enables package design or process conditions with high yields and high productivity.

• International Journal of Fuzzy Logic and Intelligent Systems
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• v.16 no.3
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• pp.216-223
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• 2016

This paper proposes a new controller design method for a fork-type lifter (FTL) of a transportation mobile robot. The transportation robot needs to pick up a package from a stack on a storage shelf and move on by a planned path in a logistics center environment. The position of the storage shelf is recognized by reading a QR code on the floor, and using this position, the robot can move to reach the storage shelf and pick up the package. PID controllers and an adaptive controller are designed to control the velocity of two wheels and the position of the FTL. An adaptive controller for the lifter is designed to elevate up and down on a slideway to the correct height position of the package on the stack of the storage shelf. The simulation results show that the PID controllers can respond smoothly to the desired angular velocity and the adaptive controller can adapt quickly and correctly to the desired height.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.31-35
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• 2013

TSOP(Thin Small Outline Package) is the IC package using lead frame, which is the type of low cost package for white electronics, auto mobile, desktop PC, and so on. Its performance is not excellent compared to BGA or flip-chip CSP, but it has been used mostly because of low price of TSOP package. However, it has been issued in TSOP package that thermal deflection of lead frame occurs frequently during molding process and Au wire between semiconductor die and pad is debonded. It has been required to solve this problem through substituting materials with low CTE and improving structure of lead frame. We focused on developing the lead frame structure having thermal stability, which was carried out by numerical analysis in this study. Thermal deflection of lead frame in TSOP package was simulated with positions of anti-deflection adhesives, which was ranging 198 um~366 um from semiconductor die. It was definitely understood that thermal deflection of TSOP package with anti-deflection adhesives was improved as 30.738 um in the case of inside(198 um), which was compared to that of the conventional TSOP package. This result is caused by that the anti-deflection adhesives is contributed to restrict thermal expansion of lead frame. Therefore, it is expected that the anti-deflection adhesives can be applied to lead frame packages and enhance their thermal deflection without any change of substitutive materials with low CTE.

• Journal of Sensor Science and Technology
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• v.16 no.5
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• pp.325-330
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• 2007

For the application to optic devices, wafer level package including spacer with particular thickness according to optical design could be required. In these cases, the uniformity of spacer thickness is important for bonding strength and optical performance. Packaging process has to be performed at low temperature in order to prevent damage to devices fabricated before packaging. And if photosensitive material is used as spacer layer, size and shape of pattern and thickness of spacer can be easily controlled. This paper presents polymer bonding using thick, uniform and patterned spacing layer of SU-8 2100 photoresist for wafer level package. SU-8, negative photoresist, can be coated uniformly by spin coater and it is cured at $95^{\circ}C$ and bonded well near the temperature. It can be bonded to silicon well, patterned with high aspect ratio and easy to form thick layer due to its high viscosity. It is also mechanically strong, chemically resistive and thermally stable. But adhesion of SU-8 to glass is poor, and in the case of forming thick layer, SU-8 layer leans from the perpendicular due to imbalance to gravity. To solve leaning problem, the wafer rotating system was introduced. Imbalance to gravity of thick layer was cancelled out through rotating wafer during curing time. And depositing additional layer of gold onto glass could improve adhesion strength of SU-8 to glass. Conclusively, we established the coating condition for forming patterned SU-8 layer with $400{\mu}m$ of thickness and 3.25 % of uniformity through single coating. Also we improved tensile strength from hundreds kPa to maximum 9.43 MPa through depositing gold layer onto glass substrate.

• Journal of the Korea Convergence Society
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• v.13 no.4
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• pp.271-278
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• 2022

Carbonated drinks are a kind of drink that is popular in our daily lives and are sold mainly among young people. There are many brands of carbonated drinks currently on sale, and most of them emphasize the distinction of texture, and brand images and packages have further commercialized package design as a whole. It is necessary to increase the emotional experience of soda package design, which can increase the added value of the brand. Sensibility is the most common psychological experience in humans and is the subjective experience and feeling of things. By combining the emotional experience with the package design of carbonated drinks, it provides more emotional user experience while purchasing carbonated drinks, realizing diversification of product package designs and satisfying consumers' emotional needs. This paper first examines the package design of carbonated drinks, I hope it will be an implication if you increase the emotional experience of soda package design.

• IE interfaces
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• v.13 no.3
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• pp.539-547
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• 2000

An architecture of a Web-based Decision Support system for mathematical analysis is presented. Front-end modules provide web-client GUI environment for mathematical analysis. The networking architecture is built upon client/server system by Java socket and accesses database by JDBC in WWW. Back-end modules provide decision supporting service and data management for mathematical programming analysis. In the back-end any analysis tools, such as mathematical optimizer, simulation package, or statistics package can be used. As an application example for this implementation, optimal facility replacement decision problem is selected. In the implementation the optimal facility replacement decision problem is formulated as a shortest path problem. It uses Oracle DB and CPLEX package as the mathematical optimizer. While ORAWeb is designed and implemented on the optimal facility replacement problem, it can easily be extended to any decision supporting problems that would require mathematical optimization process.

• Journal of the Korean Graphic Arts Communication Society
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• v.23 no.1
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• pp.53-63
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• 2005

The quality of the print can be specified through the quality of the coloring, the reproduction of fine structures and the range of tone values. Also, package printed quality are controlled by this points. In this paper, densitometry method was used for printed quality. By densitometry we can get the print density and the parameters of each conditions that characterize halftone printing, such as dot gain and relative printing contrast. Also, we have proposed the optimizes range of the parameters such as density, dot gain etc. to the package printed printability control.