Adhesive bonding using thick polymer film of SU-8 photoresist for wafer level package |
Na, Kyoung-Hwan
(School of Electrical Engineering and Computer Science, Seoul National University)
Kim, Ill-Hwan (School of Electrical Engineering and Computer Science, Seoul National University) Lee, Eun-Sung (School of Electrical Engineering and Computer Science, Seoul National University) Kim, Hyeon-Cheol (School of Electrical Engineering and Computer Science, Seoul National University) Chun, Kuk-Jin (School of Electrical Engineering and Computer Science, Seoul National University) |
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