Wafer Level Package Design Optimization Using FEM
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Ko, Hyun-Jun
(Graduate School of NID Fusion Technology, Seoul National University of Science Technology)
Lim, Seung-Yong (Graduate School of NID Fusion Technology, Seoul National University of Science Technology) Kim, Hee-Tea (School of Mechanical Design and Automation Engineering, Seoul National University of Science Technology) Kim, Jong-Hyeong (School of Mechanical Design and Automation Engineering, Seoul National University of Science Technology) Kim, Ok-Rae (Korea Institute of Industrial Technology) |
1 | Harendt, C., Graf G., Hofflinger, B., Penteker, J. E., 1992, Silicon fusion bonding and its characterization, Micromech Microeng. 2 113-116. DOI ScienceOn |
2 | Niklaus, F., Enoksson, P., Griss, P., Kalvesten, E., Stemme, G., 2001, Low-temperature wafer-level transfer bonding, J. Microelectromech. Syst. 12 525-531. |
3 | Rogers, T., Kowal, J., 1995, Selection of glass anodic bonding conditions and material compatibility for silicon-glass capacitive sensors, Sens Actuators A 46-47 113-120. |
4 | Wiemer Maik, Jia Chenping, Toepper Michael, Hauck Karin., 2006, Wafer bonding with BCB and SU-8 for MEMS Packaging, Electronics system integration technology conference 1401-1405. |
5 | Jeon Insu, Kang K. J., Im, S. Y., 2008, Stress intensities at the triple junction of a multi level thin-film package, Microelectronics Reliavility 48 749-756. DOI |
6 | Bilenberg, B., Nielsen, T., 2004, PMMA to SU-8 bonding for polymer based lab-on-a-chip system with integrated opics, Journal of Micromechanics and Microengineering 14 814-818. DOI |
7 | Pan C. T., Cheng, P. J., 2005, Intermediate wafer level bonding and interface behavior, Microelectronics Reliablility 45 657-663. DOI |
8 | Conradie, E. H., Moore, D. F., 2002, SU-8 thick photoresist processing as a functional material for MEMS applications, Journal of Micromechanics and Microengineering 12 368-37. DOI |
9 | Park, J.-H., Koo, Y.-M., Kim, E.-k., Kim., G.-S., 2009, A reliability and warpage of wafer level bonding for CIS device using polymer, Journal of the Microeletronics & Packaging Society 16:1 27-31. 과학기술학회마을 |
10 | Kim, S. K., Kim, J.-Y., Jung, H.-D., Kim, J. H., 2009, Simulation of Thermal Fatigue under Different Mold Compound and Chip Size for Wafer Level Embedded SiP, Journal of the korean Society of Machine Tool Engineers 108-112. |
11 | Song, C.-G., Kim, K.-H., Choa., S.-H., 2011, Warpage Study of Ultra Thin Package Used in Mobile Devices, Journal of the Microeletronics & Packaging Society 29:1 20-24. 과학기술학회마을 DOI |
12 | Schmidt, M. A., 1998, Wafer-to-wafer bonding for microstructure formation, Proc. of the IEEE 86:8 1575-1585. DOI |
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