• Proceedings of the KSME Conference
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• 2004.11a
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• pp.61-66
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• 2004

Fracture toughness database system was developed with Visual Foxpro 6.0 and operates in MS Windows environment. The database system contains 10,278 sets of $K_{IC}$ data, 7,046 sets of $K_{C}$ data, 784 sets of $J_{IC}$ data, 571 sets of CTOD data, 62 sets of $K_{a}$ data and 26 sets of $K_{Id}$ data. The data were collected from JSMS(Society of Material Science, Japan) fracture toughness data book and USAF(United States Air Force) crack growth database. In addition, the database was applied to predicting $K_{IC}$ from tensile material properties using artificial neural networks.

• Journal of Astronomy and Space Sciences
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• v.33 no.2
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• pp.93-99
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• 2016

A redback system is a binary system composed of a pulsar and a main sequence star. The inverse Compton (IC) scattering between the stellar soft photons and the relativistic pulsar wind will generate orbital-modulating GeV photons. We look for these IC emissions from redback systems. A multi-wavelength observation of an unassociated gamma-ray source, 3FGL J2039.6-5618, by Salvetti et al. (2015) detected an orbital modulation with a period of 0.2 days in both X-ray and optical cases. They suggested 3FGL J2039.6-5618 to be a new redback candidate. We analyzed the gamma-ray emission of 3FGL J2039.6-5618 using the data from the Fermi large area telescope (Fermi-LAT) and obtained the spectrum in different orbital phases. We propose that the spectrum has orbital dependency and estimate the characteristic energy of the IC emission from the stellar-pulsar wind interaction.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.5
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• pp.203-211
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• 1996

This paper describes CAD tools for the construction of image database in IC chip analysis CAD system. For IC chip analysis by high-resolution microscopy, the image database is essential to manage more than several thousand images. But manual database construction is error-prone and time-consuming. In order to solve this problem, we develop a set of CAD toos that include image grabber to capture chip images, image editor to make the whole chip image database from the grabbed images, and image divider to reconstruct the database that consists of evenly overlapped images for efficient region search. we also develop an interactive pattern matching method for user-friendly image editing, and a heuristic region search method for fast image division. The tools are developed with a high-performance graphic hardware with JPEG image comparession chip to process the huge color image data. The tools are under the field test and experimental resutls show that the database construction time can be redcued in 1/3 compared to manual database construction.

• Carbon letters
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• v.14 no.1
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• pp.58-61
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• 2013

In this work, the effect of catalysts on the mechanical properties of carbon fibers-reinforced epoxy matrix composites cured by cationic latent thermal catalysts, i.e., N-benzylpyrazinium hexafluoroantimonate (BPH) was studied. Differential scanning calorimetry was executed for thermal characterization of the epoxy matrix system. Mechanical interfacial properties of the composites were studied by interlaminar shear strength (ILSS), critical stress intensity factor ($K_{IC}$), and specific fracture energy ($G_{IC}$). As a result, the conversion of neat epoxy matrix cured by BPH was higher than that of one cured by diaminodiphenyl methane (DDM). The ILSS, $K_{IC}$, $G_{IC}$, and impact strength of the composites cured by BPH were also superior to those of the composites cured by DDM. This was probably the consequence of the effect of the substituted benzene group of BPH catalyst, resulting in an increase in the cross-link density and structural stability of the composites studied.

• Transactions on Electrical and Electronic Materials
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• v.14 no.6
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• pp.304-307
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• 2013

Reverse engineering of semiconductor devices utilizes delayering processes, in order to identify how the interconnection lines are stacked over transistor gates. Cu metal has been used in recent fabrication technologies, and de-processes becomes more difficult with the shrinking device dimensions. In this article, reverse engineering technologies to reveal the Cu interconnection lines and Cu via-plugs embedded in dielectric layers are investigated. Stacked dielectric layers are removed by $CF_4$ plasma etching, then the exposed planar Cu metal lines and via-plugs are selectively delineated by wet chemical solution, instead of the commonly used plasma-based dry etch. As a result, we have been successful in extracting the layouts of multiple layers within a system IC, and this technique can be applicable to other logic IC, analog IC, and CMOS IC, etc.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2001.05a
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• pp.27-33
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• 2001

Linear harmonic analysis is a convenient and generally accurate method to use for the acoustic analysis of intake and exhaust silencers for IC engines. The major uncertainty in this form of modelling is the characterisation of the source, which is inherently nonlinear and time-variant. Experimental methods are generally used to determine the source characteristics, and in particular the indirect method is most suitable for an IC-engine source. With reference to an idealised linear time-variant source, it is found that the characteristics of a time-variant source as determined by the indirect method have no physical relevance. The direct method of experimental measurement appears to have some advantage over the indirect method, although in practice it is difficult to apply to an IC engine source. Again, an idealised linear time-variant source can be used to indicate that the characteristics of a time-variant source as determined by the direct method also have no physical relevance. Strangely, these meaningless measured source properties can nevertheless be used to accurately predict the radiated noise from an IC engine and silencer system.

• Journal of the Korean Institute of Telematics and Electronics
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• v.24 no.6
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• pp.1068-1073
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• 1987

Traditional circuit partitioning algorithm using the cluster development method, which is suitable for such applications as single chip floor planning or multiple layer PCB system placement, where the clusters are formed so that inter-cluster nets are localized within the I/O connector pins, may not be appropriate for the functiona block placement in truly 3-D electronic modules. 3-D hybrid IC is one such example where the inter-layer routing as well as the intra-layer routing can be maximally incorporated to reduce the overall circuit size, cooling requirements and to improve the speed performance. In this paper, we propose a new algorithm called MBE(Minimum Box Embedding) for the layer assignment of each functional block in 3-D hybrid IC design. The sequence of MBE is as follows` i) force-directed relaxation in 3-D space, ii) exhaustive search for the optimal orientation of the slicing plane and iii) layer assignment. The algorithm is first explaines for a 2-D reduced problem, and then extended for 3-D applications. An example result for a circuit consisting of 80 blocks has been shown.

• Proceedings of the KIEE Conference
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• 2002.11c
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• pp.481-484
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• 2002

In recent, the contactless IC card is widely used in traffic, access control system and so forth. And its use becomes a general tendency more and more because of the development of RF technology and improvement of requirement for user convenience. This paper describes the hardware module to process contactless protocol for implementation contactless IC card. And the hardware module consists of specific digital logic circuits that analyze digital signal from analog circuit and then generate data & status signal for CPU, and that convert the data from CPU into digital signal for analog circuit.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 2008.10a
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• pp.105-107
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• 2008

LED driver is important for reliable LED lighting system. A variety of ICs for LED driver are supplied by almost all semiconductor company The types and performances are too diverse to collect proper IC and use efficiently. This paper classifies driver IC according to the usage for each application area and the circuit topology. Finally, the paper shows several representative ICs for main applications with notice of important performance.

• Proceedings of the KIEE Conference
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• 2001.07d
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• pp.2039-2041
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• 2001

According to the deregulation of governments in the world, the power industries of United State and European nations are proceeding remote meter reading and remote load control. But the core technology of multifunctional electronic meter implemented by programmable one-chip IC, which can be the right answer of ail the power industy's efforts is now still under development in the advanced countries. Implementation of smallest size, lowest price three-phase meter with features which enable distribution automation such as bidirectional communication. The three phase metering IC and meter can be used as metering, automatic meter reading and transformer monitoring. Prepayment billing system.