• Proceedings of the KIEE Conference
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• 2001.07d
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• pp.2039-2041
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• 2001

According to the deregulation of governments in the world, the power industries of United State and European nations are proceeding remote meter reading and remote load control. But the core technology of multifunctional electronic meter implemented by programmable one-chip IC, which can be the right answer of ail the power industy's efforts is now still under development in the advanced countries. Implementation of smallest size, lowest price three-phase meter with features which enable distribution automation such as bidirectional communication. The three phase metering IC and meter can be used as metering, automatic meter reading and transformer monitoring. Prepayment billing system.

• Journal of the Semiconductor & Display Technology
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• v.17 no.4
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• pp.86-90
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• 2018

Standards related to express the non-flatness of a wafer are reviewed and discussed, for example, bow, warp, and sori. Novel wafer warpage measurement method is proposed for 3D stacked IC application. The new way measures heat transfer from a heater to a wafer, which is a function of the contact area between these two surfaces and in turn, this contact area depends on the wafer warpage. Measurement options such as heating from room temperature and cooling from high temperature were experimentally examined. The heating method was found to be sensitive to environmental conditions. The cooling technique showed more robust and repeatable results and the further investigation for the optimal cooling condition is underway.

• Journal of the Korean Society of Safety
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• v.22 no.5
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• pp.27-32
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• 2007

We investigated the damage of the TTL ICs which manufactured five different technologies by artificial microwave. The artificial microwave was rated at a microwave output from 0 to 1000W, at a frequency of 2.45GHz. The microwave power was extracted into a standard rectangular waveguide(WR-340) and TTL ICs were located into the waveguide. TTL ICs were damaged two types. One is breakdown which means no physical damage is done to the system and after a reset the system is going back into function. The other is destruction which means a physical damage of the system so that the system will not recover without a hardware repair. TTL SN74S08N and SN74ALS08N devices get a breakdown and destruction occurred but TTL SN74LS08N, SN74AS08N and 74F08N devices get a destruction occurred. Also destructed TTL ICs were removed their surface and a chip conditions were analyzed by SEM. The SEM analysis of the damaged devices showed onchipwire and bondwire destruction like melting due to thermal effect. The tested results expect to be applied to the fundamental data which interprets the combination mechanism of the semiconductors from artificial microwave environment.

• Journal of Radiation Protection and Research
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• v.12 no.1
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• pp.12-25
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• 1987

A basic multichannel analyser (MCA) system have been designed and constructed with the successive approximation type ADC (Analog to Digital Converter). Linear Gate, window, and palse stretcher consist of mainly linear and logic IC's, and are properly combined together to achieve short dead time and good linearity of the system. ADC 1211 (analysing time: $120{\mu}sec$) and S-RAM (static random acess memory) 6264 are used in ADC module. Two 6264 memories are connected in parallel in order to-provide enough counting capacity ($2^{16}-1$). Interfaced microcomputer Apple II controls this system and analizes the counted data. The system is tested by input pulses between 0V to 10V from oscillator.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.21 no.10
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• pp.1-7
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• 2020

In recent years, as LED display systems are actively spread, study on effective control methods for an LED driver for driving the systems has been in progress. The most representative among them is the uniform brightness control method for the LED driver channel. In this paper, we propose an LED driver IC for BLU with current compensation and system protection functions to minimize channel luminance deviation. It is designed for current accuracy within ±3% between channels and a channel current of 150 mA. In order to satisfy the design specifications, the channel amplifier offset was canceled out by a chopping operation using a channel-driving PWM signal. Also, a pre-charge function was implemented to minimize the fast operation speed and luminance deviation between channels. LED error (open, short), switch TR short detection, and operating temperature protection circuits were designed to protect the IC and BLU systems. The proposed IC was fabricated using a Magnachip 0.35-um CMOS process and verified using Cadence and Synopsys' Design Tool. The fabricated LED driver IC has current accuracy within ±1.5% between channels and 150-mA channel output characteristics. The error detection circuits were verified by a test board.

• The Magazine of the IEIE
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• v.3 no.3
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• pp.28-37
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• 1976

• The Magazine of the IEIE
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• v.25 no.5
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• pp.22-30
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• 1998

• Journal of the Microelectronics and Packaging Society
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• v.21 no.3
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• pp.63-66
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• 2014

In this study, we investigated the effects of Cu TSV on the thermal management of 3D stacked IC. Combination of backside point-heating and IR microscopic measurement of the front-side temperature showed evolution of hot spots in thin Si wafers, implying 3D stacked IC is vulnerable to thermal interference between stacked layers. Cu TSV was found to be an effective heat path, resulting in larger high temperature area in TSV wafer than bare Si wafer, and could be used as an efficient thermal via in the thermal management of 3D stacked IC.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.35 no.5A
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• pp.496-503
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• 2010

The implementation of a RF transceiver for WRAN(Wireless Regional Area Network) system based on IEEE 802.22 standard using Cognitive Radio technology is presented in this paper. A CMOS RF transceiver IC for WRAN system operates in VHF/UHF(54~862MHz) broadband, and employs dual-path direct-conversion configuration and the in-band harmonic distortions are effectively suppressed by exploiting the dual-path direct conversion architecture. For 64QAM(3/4 coding rate) OFDM signal, an EVM of <-31.4dB(2.7%) has been achieved at 10dBm off-chip PA output power and the total chip area with pads is 12.95 mm2. The experimental results show that the proposed CMOS RF transceiver IC has perfect performance for WRAN system based on TDD(Time Division Duplex) mode.

• Journal of Auto-vehicle Safety Association
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• v.8 no.4
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• pp.12-17
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• 2016

NHTSA (National Highway Traffic Safety Administration) has offered consumers the vehicle safety information on their car since 1978. NHTSA believes that they contribute auto makers to develop safer vehicle for customers, which will result in even lower numbers of deaths and injuries resulting from motor vehicle crashes. NHTSA has been studied why people are still dying in frontal test despite of the use of many restraints system and they understand that current test does not reflect real world crash data such as oblique and corner impact test. As a result, NHTSA announced that a new test method will be introduced to use of enhanced biofidelic dummy and new crash avoidance technology evaluation from 2019. New and refined injury criteria will be applied to Head / Neck / Chest / Lower Leg. BrIC(Brain Injury Criterion)value in NHTSA test results using THOR dummy from 2014 to 2015 was average 0.91 and 1.24 in driver and passenger dummies. IIHS 64kph SOF test is the most likely to new frontal oblique test in an aspect of offset impact which is being studied by NHTSA. In this paper, we focused on head injury, especially brain injury - BrIC and conducted IIHS 64kph SOF (Small Offset Front) test with Hybrid III dummy to evaluate the injury for BrIC. Based on the test results, these data can be predicted BrIC level and US NCAP rating with current vehicle.