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http://dx.doi.org/10.6117/kmeps.2014.21.3.063

The Effects of Cu TSV on the Thermal Conduction in 3D Stacked IC  

Ma, Junsung (Graduate School of NID Fusion Technology, Seoul National University of Science and Technology)
Kim, Sarah Eunkyung (Graduate School of NID Fusion Technology, Seoul National University of Science and Technology)
Kim, Sungdong (Dept. of Mechanical System Design Eng., Seoul National University of Science and Technology)
Publication Information
Journal of the Microelectronics and Packaging Society / v.21, no.3, 2014 , pp. 63-66 More about this Journal
Abstract
In this study, we investigated the effects of Cu TSV on the thermal management of 3D stacked IC. Combination of backside point-heating and IR microscopic measurement of the front-side temperature showed evolution of hot spots in thin Si wafers, implying 3D stacked IC is vulnerable to thermal interference between stacked layers. Cu TSV was found to be an effective heat path, resulting in larger high temperature area in TSV wafer than bare Si wafer, and could be used as an efficient thermal via in the thermal management of 3D stacked IC.
Keywords
thermal via; 3D stacked IC; Cu TSV; thermal management;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
연도 인용수 순위
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