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Novel Wafer Warpage Measurement Method for 3D Stacked IC  

Kim, Sungdong (Dept. of Mechanical System Design Engineering, Seoul National University of Science and Technology)
Jung, Juhwan (DB Hitek)
Publication Information
Journal of the Semiconductor & Display Technology / v.17, no.4, 2018 , pp. 86-90 More about this Journal
Abstract
Standards related to express the non-flatness of a wafer are reviewed and discussed, for example, bow, warp, and sori. Novel wafer warpage measurement method is proposed for 3D stacked IC application. The new way measures heat transfer from a heater to a wafer, which is a function of the contact area between these two surfaces and in turn, this contact area depends on the wafer warpage. Measurement options such as heating from room temperature and cooling from high temperature were experimentally examined. The heating method was found to be sensitive to environmental conditions. The cooling technique showed more robust and repeatable results and the further investigation for the optimal cooling condition is underway.
Keywords
3D Stacked IC; Warpage; Sori; Bow; Thermal Contact;
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Times Cited By KSCI : 2  (Citation Analysis)
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