• ETRI Journal
• /
• 제15권2호
• /
• pp.11-25
• /
• 1993

Interface trap densities at gate oxide/silicon substrate ($SiO_2/Si$) interfaces of metal oxide semiconductor field-effect transistors (MOSFETs) were determined from the substrate bias dependence of the subthreshold slope measurement. This method enables the characterization of interface traps residing in the energy level between the midgap and that corresponding to the strong inversion of small size MOSFET. In consequence of the high accuracy of this method, the energy dependence of the interface trap density can be accurately determined. The application of this technique to a MOSFET showed good agreement with the result obtained through the high-frequency/quasi-static capacitance-voltage (C-V) technique for a MOS capacitor. Furthermore, the effective substrate dopant concentration obtained through this technique also showed good agreement with the result obtained through the body effect measurement.

• ETRI Journal
• /
• 제31권5호
• /
• pp.585-592
• /
• 2009

This paper presents a method for decoding high minimal distance ($d_{min}$) short codes, termed Cortex codes. These codes are systematic block codes of rate 1/2 and can have higher$d_{min}$ than turbo codes. Despite this characteristic, these codes have been impossible to decode with good performance because, to reach high $d_{min}$, several encoding stages are connected through interleavers. This generates a large number of hidden variables and increases the complexity of the scheduling and initialization. However, the structure of the encoder is well suited for analog decoding. A proof-of-concept Cortex decoder for the (8, 4, 4) Hamming code is implemented in subthreshold 0.25-${\mu}m$ CMOS. It outperforms an equivalent LDPC-like decoder by 1 dB at BER=$10^{-5}$ and is 44 percent smaller and consumes 28 percent less energy per decoded bit.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2009년도 하계학술대회 논문집
• /
• pp.101-102
• /
• 2009

SGOI MOSFETs with various Ge mole fractions were fabricated and compared to the SOI MOSFET. SGOI MOSFETs have a lager drain current and higher effective mobility than the SOI MOSFET as increased Ge mole fractions. The lattice constant difference causes lattice mismatch between the SiGe layer and the top-Si layer during the top-Si layer growth. However, SGOI MOSFETs have a lager leakage current at subthreshold region. Also, leakage current at subthreshold region increased with Ge mole fractions. This is attributable to the crystalline defects due to the lattice mismatch between the SiGe layer and the top-Si layer.

• 대한전자공학회:학술대회논문집
• /
• 대한전자공학회 1998년도 추계종합학술대회 논문집
• /
• pp.553-556
• /
• 1998

The 1-D numerical model and its extraction methodology are suggested and these simulation results for the S-swing as a function of back-gate voltage are well matched with the measured. S-swing characteristics are analyzed using PD-SOI devices with enough deeper regions up to substrates. The PD-SOI device doesn't have to be short channel to see the anomalous subthreshold phenomena based on the back gate bias. This results recommend to operate better SOI device performances by controlling the back gate voltages. So SOI performances will be much optimistic with proper control of the back-gate voltage for the already- proven- high- performance (APHP) SOI VLSIs.

• 센서학회지
• /
• 제27권3호
• /
• pp.150-155
• /
• 2018

Three different structures of GaN MOSFETs with trap distributions, trap levels, and densities were simulated, and its results were analyzed. Two of them are Schottky barrier MOSFETs(SB-MOSFETs): one with a p-type GaN body while the other is in the accumulation mode MOSFET with an undoped GaN body and regrown source/drain. The trap levels, distributions and densities were considered based on the measured or calculated properties. For the SB-MOSFET, the interface trap distribution affected the threshold voltage significantly, but had a relatively small influence on the subthreshold swing, while the bulk trap distribution affects the subthreshold swing more.

• Transactions on Electrical and Electronic Materials
• /
• 제12권2호
• /
• pp.43-50
• /
• 2011

Carbon-nanotube metal oxide semiconductor field effect transistor (CN-MOSFET) is a promising future device candidate. The electrical characteristics of 16 nm N-type CN-MOSFETs are explored in this paper. The optimum N-type CN-MOSFET device profiles with different number of tubes are identified for achieving the highest on-state to off-state current ratio ($I_{on}/I_{off}$). The influence of substrate voltage on device performance is also investigated in this paper. Tradeoffs between subthreshold leakage current and overall switch quality are evaluated with different substrate bias voltages. Technology development guidelines for achieving high-speed, low-leakage, area efficient, and manufacturable carbon nanotube integrated circuits are provided.

• 한국전기전자재료학회논문지
• /
• 제27권7호
• /
• pp.433-437
• /
• 2014

Transparent thin film transistors were fabricated on $n^+$-Si wafers coated by $Al_2O_3/SiO_2$. Zinc tin oxide (ZTO) films deposited by rf magnetron sputtering were employed for active layers. The mobility (${\mu}s$), threshold voltage ($V_T$), and subthreshold swing (SS) dependances on ZTO thickness were analyzed. The $V_T$ decreased with increasing ZTO thickness. The ${\mu}s$ raised from $5.1cm^2/Vsec$ to $27.0cm^2/Vsec$ by increasing ZTO thickness from 7 nm to 12 nm, and then decreased with ZTO thickness above 12 nm. The SS was proportional to ZTO thickness.

• 한국정보디스플레이학회:학술대회논문집
• /
• 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권2호
• /
• pp.1288-1291
• /
• 2007

We investigated the effect of Cr thickness on the electrical properties of triisopropylsilyl pentacene organic thin-film transistor (OTFT) employing suspended source-drain electrode. With Cr thickness of 10 nm, the field-effect mobility, on/off ratio and subthreshold slope were $0.017\;cm^2/Vs$, $8.78\;{\times}\;10^3$ and 10 V/decade, respectively. By increasing the Cr thickness to 100 nm, the fieldeffect mobility was increased to $0.032\;cm^2/Vs$, on/off ratio to $1.12{\times}10^5$ and subthreshold slope to 1 V/decade.

• 전자공학회논문지C
• /
• 제35C권2호
• /
• pp.36-47
• /
• 1998

Low power circuit techniques have been developed to realize the highest possible performance of embedded SRAM at 1V power supply with$0.5\mu\textrm{m}$ single threshold CMOS technology in which the unbalance between NMOS and PMOS threshold voltages is utilized to optimize the low power CMOS IC design. To achieve the best trade-off between the transistor drivability and the subthreshold current increase, the ground potential of memory array is raised to suppressthe subthreshold current. The problems of lower cellstability and bit-line dealy increase due to the enhanced array ground potential are evaluated to be controlled within the allowable range by careful circuit design. 160MHz, 128kb embedded SRAM with 3.4ns access time is demonstrated with the power consumption of 14.8mW in active $21.4{mu}W$ in standby mode at 1V power supply.

• JSTS:Journal of Semiconductor Technology and Science
• /
• 제12권1호
• /
• pp.75-87
• /
• 2012

A design paradigm using sequential geometric programming is presented to accurately design CMOS op amps with BSIM3. It is based on new adaptive modeling of transistor parameters through the operating point simulation. This has low modeling cost as well as great simplicity and high accuracy. The short-channel dc, high-frequency small-signal, and short-channel noise models are used to characterize the physical behavior of submicron devices. For low-power and low-voltage design, this paradigm is extended to op amps operating in the subthreshold region. Since the biasing and modeling errors are less than 0.25%, the characteristics of the op amps well match simulation results. In addition, small dependency of design results on initial values indicates that a designed op amp may be close to the global optimum. Finally, the design paradigm is illustrated by optimizing CMOS op amps with accurate transfer function.