• Title/Summary/Keyword: Substrate thickness

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Synthesis of Silica Aerogel and Thin Film Coating at Ambient (상입하에서의 실리카 에어로겔의 합성 및 박막코팅(I))

  • 양희선;최세영
    • Journal of the Korean Ceramic Society
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    • v.34 no.2
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    • pp.188-194
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    • 1997
  • Wet gel with surface modification by TMCS was redispersed in EtOH and redispersed silica sol for coat-ing was prepared. After spin coating of redispersed sol was conducted on silicon substrate, processes of drying(8$0^{\circ}C$) and heat treatment(>25$0^{\circ}C$) were, followed at ambient pressure. The influence of heat treat-ment of properties of film was observed, changing temperature at heat treatment. The optimum redisp-ersion condition for stable silica sol was wet gel:EtOH=1g:110$m\ell$ and the concentration and viscosity of redispersed silica sol with average particle size of 30nm were 0.11 M, 2.0-2.2 cP respectively. Crack-free thin film with the refractive index of 1.14 and thickness of 400 nm was obtained through drying at 8$0^{\circ}C$ and subsequent heat treatment at 45$0^{\circ}C$ for 2 hrs respectively after spin coating of 1500rpm, 10 times.

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Crystallization and Electrical Properties of SBM Thin Films by IBSD Process (IBSD법에 의한 SBN60 강유전체 박막의 배향 및 전기적 특성)

  • Jeong, Seong-Won;Jang, Jae-Hoon;Lee, Hee-Young
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2004.07b
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    • pp.869-873
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    • 2004
  • [ $Sr_xBa_{1-x}Nb_2O_6$ ] (SBN, $0.25{\leq}x{\leq}0.75$) ceramic is a ferroelectric material with tetragonal tungsten bronze (TTB) type structure, which has a high pyroelectric coefficient, piezoelectric, and a photo refractive properties. In this study, SBN60(x=0.6) thin film was manufactured by ion beam sputtering technique. Using the prepared SBN60 target in $Ar/O_2$ atmosphere as-deposited SBN60 thin film on Pt(100)/$TiO_2/SiO_2/Si$ substrate crystallization and orientation behavior as well as electric properties of SBN60 thin film were examined. SBN60 deposition up to $3000{\AA}$ in thickness, SBN60 thin film was heat-treated at $650^{\circ}C{\sim}800^{\circ}C$. The orientation was shown primarily along (001) plane from XRD pattern where working pressure was $4.3{\times}10^{-4}$ torr. The deposited layer was uniform, preferred orientatin and crystallization behavior resulted in the change of $O_2$ ratio was observed. In electric propertie of Pt/SBN60/Pt thin film capacitor remnant polarization (2Pr) value was $10{\mu}C/cm^2$, the coercive filed (Ec) 50 kV/cm, and the dielectric constant 615, respectively.

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Fabrication of Ceramic 3D Integration Technology for Ink-jet Printing (Ink-jet Printing을 이용한 3D-Integration 구현)

  • Hwang, Myung-Sung;Kim, Ji-Hoon;Kim, Hyo-Tae;Yoon, Young-Joon;Kim, Jong-Hee;Moon, Joo-Ho
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2010.06a
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    • pp.332-332
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    • 2010
  • We have successfully demonstrated the inkjet printing method to create $Al_2O_3$ films withouWe have successfully demonstrated the inkjet printing method to create $Al_2O_3$ films without a high temperature sintering process. In order to remove the coffee ring effect in the ink drop, we have introduced a co-solvent system in order to create Marangoni flow in the ink drop, which leads to the dense packing of ceramic powders on the substrate during inkjet process. The packing density of the Inkjet-printed $Al_2O_3$ films is around 60% (max. 70%) which is very high compared to the value obtained from the same material films by other conventional methods such as film casting, dip coating process, etc. The voids inside the films (which are around 40% of the entire film volume) are filled with the polymer resin (Cyanate ester) by the infiltration process. This resin infiltration is also implemented by the inkjet printing process right after the Ah03 film ink-jetting process. The microstructures of the printed $Al_2O_3$ films are investigated by Scanning Electron Microscope (SEM) to understand the degree of packing density in the printed films. The inkjet-printed $Al_2O_3$ films have been characterized to investigate its thickness and roughness. Quality factor of the printed $Al_2O_3$ film is also measured to be over 300 at 1MHz.

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Preparation and Evaluation of the Properties of Al-doped Zinc Oxide (AZO) Films Deposition by Rapid Thermal Annealing (급속 열처리 방법에 의한 Al-doped Zinc Oxide (AZO) Films의 제조 및 특성 평가)

  • Kim, Sung-Jin;Choi, Kyoon;Choi, Se-Young
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.25 no.7
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    • pp.543-551
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    • 2012
  • In this study, transparent conducting Al-doped Zinc Oxide (AZO) films with a thickness of 150 nm were prepared on corning glass substrate by the RF magnetron sputtering with using a Al-doped zinc oxide (AZO), ($Al_2O_3$: 2 wt%) target at room temperature. This study investigated the effect of rapid thermal annealing temperature and oxygen ambient on structural, electrical and optical properties of Al-doped zinc oxide (AZO) thin films. The films were annealed at temperatures ranging from 400 to $700^{\circ}C$ by using Rapid thermal equipment in oxygen ambient. The effect of RTA treatment on the structural properties were studied by x-ray diffraction and atomic force microscopy. It is observed that the Al-doped zinc oxide (AZO) thin film annealed at $500^{\circ}C$ at 5 minute oxygen ambient gas reveals the strongest XRD emission intensity and narrowest full width at half maximum among the temperature studied. The enhanced UV emission from the film annealed at $500^{\circ}C$ at 5 minute oxygen ambient gas is attributed to the improved crystalline quality of Al-doped zinc oxide (AZO) thin film due to the effective relaxation of residual compressive stress and achieving maximum grain size.

Fabrication and Electrical Properties of Al2O3/GaN MIS Structures using Remote Plasma Atomic Layer Deposition (원격 플라즈마 원자층 증착법을 이용한 Al2O3/GaN MIS 구조의 제작 및 전기적 특성)

  • Yun, Hyeong-Seon;Kim, Hyun-Jun;Lee, Woo-Seok;Kwak, No-Won;Kim, Ka-Lam;Kim, Kwang-Ho
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.22 no.4
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    • pp.350-354
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    • 2009
  • $Al_{2}O_{3}$ thin films were deposited on GaN(0001) by using a Remote Plasma Atomic Layer Deposition(RPALD) technique with a trimethylaluminum(TMA) precursor and oxygen radicals in the temperature range of $25{\sim}500^{\circ}C$. The growth rate per cycle was varied with the substrate temperature from $1.8{\AA}$/cycle at $25^{\circ}C$ to $0.8{\AA}$/cycle at $500^{\circ}C$. The chemical structure of the $Al_{2}O_{3}$ thin films was studied using X-ray photoelectron spectroscopy(XPS). The electrical properties of $Al_{2}O_{3}$/GaN Metal-Insulator-Semiconductor (MIS) capacitor grown at a $300^{\circ}C$ process temperature were excellent, a low electrical leakage current density(${\sim}10^{-10}A/cm^2$ at 1 MV) at room temperature and a high dielectric constant of about 7.2 with a thinner oxide thickness of 12 nm. The interface trap density($D_{it}$) was estimated using a high-frequency C-V method measured at $300^{\circ}C$. These results show that the RPALD technique is an excellent choice for depositing high-quality $Al_{2}O_{3}$ as a Sate dielectric in GaN-based devices.

MOCVD를 이용한 $BiSbTe_3$ 박막성장 및 열전소자 제작

  • Kwon, Sung-Do;Yoon, Seok-Jin;Ju, Byeong-Kwon;Kim, Jin-Sang
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.11a
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    • pp.425-425
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    • 2008
  • Bismuth-antimony-telluride based thermoelectric thin film materials were prepared by metal organic vapor phase deposition using trimethylbismuth, triethylantimony and diisopropyltelluride as metal organic sources. A planar type thermoelectric device has been fabricated using p-type $Bi_{0.4}Sb_{1.6}Te_3$ and n-type $Bi_2Te_3$ thin films. Firstly, the p-type thermoelectric element was patterned after growth of $4{\mu}m$ thickness of $Bi_{0.4}Sb_{1.6}Te_3$ layer. Again n-type $Bi_2Te_3$ film was grown onto the patterned p-type thermoelectric film and n-type strips are formed by using selective chemical etchant for $Bi_2Te_3$. The top electrical connector was formed by thermally deposited metal film. The generator consists of 20 pairs of p- and n-type legs. We demonstrate complex structures of different conduction types of thermoelectric element on same substrate by two separate runs of MOCVD with etch-stop layer and selective etchant for n-type thermoelectric material. Device performance was evaluated on a number of thermoelectric devices. To demonstrate power generation, one side of the device was heated by heating block and the voltage output was measured. The highest estimated power of 1.3mW is obtained at the temperature difference of 45K. We provide a promising approach for fabricating thin film thermoelectric generators by using MOCVD grown thermoelectric materials which can employ nanostructures for high thermoelectric properties.

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The study of the characteristic of n-ZnO:In/p-Si(111) heterostructure using Pulsed Laser Deposition (PLD법으로 증착된 n-ZnO:In/p-Si(111) 이종접합구조의 특성연구)

  • Jang, B.L.;Lee, J.Y.;Lee, J.H.;Kim, J.J.;Kim, H.S.;Lee, D.W.;Lee, W.J.;Cho, H.K.;Lee, H.S.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.11a
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    • pp.355-356
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    • 2008
  • In this work, ZnO films doped with different contents of Indium (0.1at.%, 0.3at.%, 0.6at.%, respectively) were deposited on Si (111) substrate that has 1~20 $\Omega$cm by pulsed laser deposition (PLD) at $600^{\circ}C$ for 30min. The thickness of the films are about 250 nm. The structural, optical and electrical properties of the films were investigated using X-ray Diffraction (XRD), Atomic force microscope (AFM), Photoluminescence (PL) and Hall measurement. It has been found that RMS of the films is decreased and grain size is increased with increasing the contents of doped Indium. The results of the Photoluminescence properties were indicated that the films have UV emission about 380nm and shows a little red shitf with increasing contents of doped indium. The result of the Hall measurement shows that the concentration and resisitivity in doped ZnO are as changing as one order, respectively ${\sim}10^{18}/cm^2$, ${\sim}10^{-2}cm{\Omega}cm$.

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Development of Pressure Sensor on Polymer Substrate for Real-time Pulse and Blood Pressure Measurements (실시간 맥박 및 혈압 측정을 위한 폴리머 기판 압력센서 개발)

  • Kim, Jin-Tae;Kim, Sung Il;Joung, Yeun-Ho
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.26 no.9
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    • pp.669-676
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    • 2013
  • In this study, we introduce a polymer(polyimide) based pressure sensor to measure real-time heart beat and blood pressure. The sensor have been designed with consideration of skin compatibility of material, cost effectiveness, manufacturability and wireless detection. The designed sensor was composed of inductor coils and an air-gap capacitor which generate self-resonant frequency when electrical source is applied on the system. The sensor was obtained with metalization, etching, photolithography, polymer adhesive bonding and laser cutting. The fabricated sensor was shaped in circular type with 10mm diameter and 0.45 mm thickness to fit radial artery. Resonant frequencies of the fabricated sensors were in the range of 91~96 MHz on 760 mmHg pressurized environment. Also the sensor has good linearity without any pressure-frequency hysteresis. Sensitivity of the sensor was 145.5 kHz/mmHg and accuracy was less than 2 mmHg. Real-time heart beat measurement was executed with a developed hand-held measurement system. Possibility of real-time blood pressure measurement was showed with simulated artery system. After installation of the sensor on skin above radial artery, simple real blood pressure measurement was performed with 64 mmHg blood pressure variation.

A Study on Control System of Multi Layer Sputtering Equipment (다층 박막 스퍼터링 장비의 제어시스템에 관한 연구)

  • Lee, Sun-Jong;Yoo, Heung-Ryol;Son, Yung-Deug
    • Journal of IKEEE
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    • v.22 no.2
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    • pp.302-308
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    • 2018
  • Multi-Layer Sputtering is aim to develop desired thickness thin film multi-layer with different materials. The multi-layer thin film deposition process occupies a relatively large portion in the process time, because the main reason is that it takes much time to move the substrate to be deposited and to make the chamber into a high vacuum state compared to the process time. Most of semiconductor and display industries sputter a single substance in one chamber and move boards through multi-continuous robots to another chamber to sputter other materials. This will inevitably require multiple chambers, vacuum pumps, and multi-contamination robots within the process facility. To solve these problems, this paper proposes a control system for multi-layer thin film sputtering devices that deposit different materials within a single vacuum chamber and is applied in TFT process. The manufacture and experiment of the control system proved its validity.

Development of Active thin Film Optical Waveguide $C^{2+}$ -ion Sensor (능동형 박막 광도파로 칼슘 이온 센서의 개발)

  • Lee, Su-Mi;Gang, Sin-Won
    • Journal of the Institute of Electronics Engineers of Korea SC
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    • v.37 no.4
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    • pp.49-54
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    • 2000
  • A new functional organic thin film optical waveguide ion sensor is designed, which can select a specific ion, i.e., $Ca^{2+}$ -ion. The sensing membrane was composed of PVC-PVAC-PVA copolymer matrix based on anionic cation-selective chromoionophor(ETH5294), neutral ionophore(K23El), anionic site and plasticizer and it was coated on the etched glass substrate as embeded type optical waveguide itself. The sensor sensitivity dependence on waveguide length and thickness, contence of chromoionophore, and each mode was investigated. And this sensor could detect $Ca^{2+}$ ion in concentrations ranging from 1$\times$10­6~1M(with 0.05M tris-HCI buffer solution of pH7.4) by measuring the absorbance change at 514nm of light. Utilizing thin film membrane, the fast response time and high sensitivity are obtained. Also, it is expected that this sensor can be applied to various biochemical important ions.ons.

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