• Proceedings of the Korean Magnestics Society Conference
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• 1995.10a
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• pp.30-31
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• 1995

• Journal of the Korean Vacuum Society
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• v.8 no.4A
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• pp.461-464
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• 1999

Planar type thin film inductors have a potential for the application of miniaturized DC-DC converters. For those high current applications, the magnetic film with high current capability is required. The current capability of magnetic films is mainly determined from high saturation magnetization (4$\piM_s$) as well as large anisotropy field $(H_k)$. We fabricated a double rectangular spiral thin film inductor which consist of magnetic layer, coil and insulator. Highest inductance values as well as best frequency characteristics can be obtained from 5 MHz and quality factor exhibit about 7.

• Journal of information and communication convergence engineering
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• v.4 no.2
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• pp.88-91
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• 2006

In this paper, a novel physical structure for planar spiral inductors is proposed. The spiral inductors were designed and fabricated on multi-layered substrate Bragg-reflector/silicon (BR/Si) wafer. The impacts of multi-layered structure substrate and pattern on characteristics of inductor were studied. Experimental results show that the inductor embedded on Bragg reflector/silicon substrate can achieve the best improvement. At 0.4-1.6 GHz, the Bragg reflector seems to significantly increase the S11-parameter of the inductor.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.57 no.12
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• pp.2269-2275
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• 2008

This paper examined the simulation results after applying not only spiral inductor's 3D EM simulation but also de-embedding technique to reduce the pad's RF effects. When calculating standard deviation with measurement results not only the gain at 0.5GHz${\sim}$4GHz but also noise figure at 1.8GHz${\sim}$4GHz, the simulation results includes de-embedded inductor' model improved gain deviation by 0.171 and noise figure deviation by 0.151 than the results from simulation with foundry inductor equivalent circuit models.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.52 no.1
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• pp.6-11
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• 2003

The multi layer spiral inductors, which enhance the quality factor Q of an inductor fabricated on the silicon substrate, has been designed using a TSMC CMOS 0.2sum 1-poly 5-metal layer technology. To investigate the performance of the designed inductors, a 2.5-dimensional field simulation tool(Momentum) is used. The simulation results show that the quality factor Q of the 5-metal inductor is improved 1.8 times over that of a convention31 spiral inductor at 2GHz for wireless LAN applications.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2006.05a
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• pp.255-258
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• 2006

In this paper, a novel physical structure for planar spiral inductors is proposed. The spiral inductors were designed and fabricated on multi-layered substrate Bragg-reflector/silicon (BR/Si) wafer. The impacts of multi-layered structure substrate and pattern on characteristics of inductor were studied. Experimental results show that the inductor embedded on Bragg reflector/silicon substrate can achieve the best improvement. At 0.4-1.6 GHz, the Bragg reflector seems to significantly increase the $S_{11}-parameter$ of the inductor.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.12 no.2
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• pp.142-149
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• 2019

The coils to transmit the electric energy are necessary to charge an electric vehicle wirelessly. There are several types of coils, from basic circular coils to DD-type coils for enhancing the coupling effect between two coils. However, DD-type coils with a good coupling effect between coils have a disadvantage in use because of the structure complexity of the power conversion device of transmitting and receiving side. In this paper, we propose a method to calculate the inductance value and to design the size of the spiral inductor which is convenient to fabricate when the power is transmitted wirelessly by using two coils in free space. Since the bifurcation phenomenon occurs when the XLm value is similar to the load resistance value in the resonator the XLm value was selected to be equal to the minimum load resistance value to minimize this phenomenon, and the inductance value required for the resonator was calculated. In order to realize the calculated inductance value by the spiral inductor, the relationship between the inductance value and the size, the number of turns, the total coil length of a spiral inductor was investigated. In addition, the change of coupling coefficient k according to the horizontal separation of two coils was examined and an appropriate inductor was selected.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.272-273
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• 2007

This paper presents the characteristic of rectangular and octagonal spiral inductor using PGS(Patterned Ground Shield). We investigated variation of inductance and Q-factor with changing of turn number at fixed width, spacing and inner diameter. We confirmed that characteristic of inductance and Q-factor be appled PGS in rectangular and octagonal types spiral inductor by EM simulation tool. Inductance decreased irrespective of structure but Q-factor increased. When PGS not exist, Q-factor of Inductor is analogous at classification frequency but, rectangular is a few larger then octagonal in small turn number. The other side, When PGS is inserted, we confirmed that octagonal lager then rectangular in many turn number. Q-factor is improved in case of octagonal structure and small turn number by PGS effect.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.2
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• pp.138-143
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• 2003

A double spiral thin-film inductor with a NiFe magnetic core is integrated with DC-DC converter IC. The NiFe core is deposited on a polyimide film as the thinckness of NiFe is 2.5~3.5 ${\mu}$m. Then, copper conductor line is deposited on the NiFe core with double spiral structure. Process integration is performed by sequential processes of etching the polyimide film deposited both top and bottom of the NiFe core and electroplation copper conductor line from exposed metal pad of the DC-DC converter IC. Process integration is simplified by elimination planarization process for top core because the proposed thin-film inductor has a bottom NiFe core only. Inductor of the fabricated monolithic DC-DC converter IC is 0.53 ${\mu}$H when the area of converter IC and thin-film inductor are 5X5$\textrm{mm}^2$ and 3.5X2.5$\textrm{mm}^2$, respectively. The efficiency is 72% when input voltage and output voltage are 3.5 V and 6 V, respectively at the operation frequency of 8 MHz.

• Proceedings of the KIPE Conference
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• 2017.11a
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• pp.135-136
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• 2017

In this paper, a spiral inductor is designed and its inductance is calculated by the expended Grover method. To verify this, a rectangular planar inductor is printed by inkjet printer using conductive ink and the calculated inductance value is compared with its measured value.