• Journal of the Korean institute of surface engineering
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• v.29 no.5
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• pp.519-524
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• 1996

We synthesized semiconducting Sn-doped diamondlike carbon films by rf plasma-enhanced chemical vapor deposition using an organotin compound as a dopung gas source. XPS quan-titative analysis for the deposited films after 60 s argon ion etching revealed that Sn concen-tration increased with the partial pressure of the organotin compound in the reactant gas. In C 1s spectra, there was a component due to C-Su bond which had a negative chemical shift. C 1s spectra also indicated that the deposited films were relatively $sp^2$ rich. The chemical shift of the Sn-C bond in Sn $3d_{5/2}$ spectra was about +1.7 eV. The electrical resistivity and the optical transmittance were also investigated.

• Journal of Integrative Natural Science
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• v.9 no.4
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• pp.223-227
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• 2016

The Zn, Sn, and ZnSn thin films were deposited on Si(100) substrate using radio frequency (RF) magnetron co-sputtering method. A surface profiler and X-ray photoelectron spectroscopy (XPS) were used to investigate the Zn, Sn, and ZnSn thin films. Thickness of the thin films was measured by a surface profiler. The deposition rates of pure Zn and Sn thin films were calculated with thickness and sputtering time for optimization. From the survey XPS spectra, we could conclude that the thin films were successfully deposited on Si(100) substrate. The chemical environment of the Zn and Sn was monitored with high resolution XPS spectra in the binding energy regions of Zn 2p, Sn 3d, O 1s, and C 1s.

• Korean Journal of Metals and Materials
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• v.49 no.4
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• pp.329-333
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• 2011

To develop wide-band noise absorbers with a special design for low-frequency performance, this study proposes a tin oxide (Sn-O) thin films as the noise absorbing materials in a microstrip line. Sn-O thin films were deposited on polyimide film substrates by reactive sputtering of the Sn target under flowing $O_{2}$ gas, exhibiting a wide variation of surface resistance (in the range of $10^{0}-10^{5}{\Omega}$) depending on the oxygen partial pressure during deposition. The microstrip line with characteristic impedance of $50\Omega$ was used for the measurement of noise absorption by the Sn-O films. The reflection parameter $(S_{11})$ increased with a decrease of surface resistance due to an impedance mismatch at the boundary between the film and the microstrip line. Meanwhile, the transmission parameter $(S_{21})$ diminished with a decrease of surface resistance resulting from an Ohmic loss of the Sn-O films. The maximum noise absorption predicted at an optimum surface resistance of the Sn-O films was about $150{\Omega}$. For this film, greater power absorption is predicted in the lower frequency region (about 70% at 1 GHz) than in conventional magnetic sheets of high magnetic loss, indicating that Ohmic loss is the predominant loss parameter for the conduction noise absorption in the low frequency band.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.4 s.37
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• pp.307-313
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• 2005

Electromigration behavior in the Sn96.5Ag3.0Cu0.5 solder lines was investigated and compared Sn96.5Ag3.0Cu0.5 with eutectic SnPb. Measurements were made for relevant parameters for electromigration of the solder, such as drift velocity, threshold current density, activation energy, as well as the product of diffusivity and effective charge number (DZ$\ast$). The threshold current density were measured to be $2.38{\times}10^4A/cm^2$ at $140^{\circ}C$ and the value represented the maximum current density which the SnAgCu solder can carry without electromigration damage at the stressing temperatures. The electromigration energy was measured to 0.56 eV in the temperature range of $110-160^{\circ}C$. The measured products of diffusivity and the effective charge number, DZ$\ast$ were $3.12{\times}10^{-10} cm^2/s$ at $110^{\circ}C$, $4.66{\times}10^{-10} cm^2/s$ at $125^{\circ}C$, $8.76{\times}10^{-10} cm^2/s$ at $140^{\circ}C$, $2.14{\times}10^{-9}cm^2/s$ at $160^{\circ}C$ SnPb solder existed incubation stage, while SnAgCu did not have incubation stage. It was thought that the diffusion mechanism of SnAgCu was different from that of SnPb.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.4
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• pp.23-28
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• 2009

We investigated the wafer-level MEMS capping process for which cavity formation in Si wafer was not required. Ni caps were formed by electrodeposition on 4" Si wafer and Ni rims of the Ni caps were bonded to the Cu rims of bottom Si wafer by using epoxy. Then, top Si wafer was debonded from the Ni cap structures by using SnBi layer of low melting temperature. As-evaporated SnBi layer was composed of double layers of Bi and Sn due to the large difference in vapor pressures of Bi and Sn. With keeping the as-evaporated SnBi layer at $150^{\circ}C$ for more than 15 sec, SnBi alloy composed of eutectic phase and Bi-rich $\beta$ phase was formed by interdiffusion of Sn and Bi. Debonding between top Si wafer and Ni cap structures was accomplished by melting of the SnBi layer at $150^{\circ}C$.

• The korean journal of orthodontics
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• v.12 no.1
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• pp.21-26
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• 1982

This study was undertaken to document relations between facial skeletal pattern and dental occlusion. The data in .this study were collected from pretreatment cephalometric radiographs and study models of patients' records present in the files of Orthodontic Department, Seoul National University Hospital. Patients were selected on the basis of a mandibular plane-sella nasion angle equal to or greater than $38^{\circ}$ (high SN-MP angle) or equal to or less than $26^{\circ}$ (low SN-MP angle). Patients in the mixed dentition and with missing permanent teeth were excluded for ease of assessing tooth size / arch circumference relationships and then 30 high SN-MP and 11 low SN-MP patients were selected among them. The mean age of these two groups of patients was high SN-MP, $12.8{\pm}1.23$ years and low SN-MP, $13.0{\pm}1.48$ years. The following conclusions were obtained. 1. In the maxilla and mandible the mean tooth size of high SN-MP patients was nearlly identical to the low SN-MP patients. 2. The mean maxillary arch circumference was increased in low SN-MP group compared with high SN-MP group and a smilar, but smaller, mean increase was present in mandible. 3. The difference between the mean maxillary circumference required and the mean maillary circumference present ranged from -4.8mm in the high SN-MP group to -1.3mm in the low SN-MP group. A small range of means occurred in the mandible (high SN-MP: -4.0mm to low SN-MP: -1.8mm). 4. In the maxilla and mandible the mean arch length was nearly identical in the high and low SN-MP groups. 5. The mean incisor inclination was increased as the SN-MP angle decreased in the maxilla and mandible. 6. The men distance of the maxillary first molar from anterior border of the pterygomaxillary fissure was nearly similar between high and low groups. 7. The mean mandibular intermolar width was increased from high SN-MP to low SN-MP patients.

• Polymer(Korea)
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• v.34 no.6
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• pp.588-593
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• 2010

New seven acrylic monomers with covalently bonded silicon, germanium, and tin were prepared for high refractive index materials. The monomers were copolymerized with a cross-linkable comonomer (Trimer) to prepare UV-films for optical characterization. The refractive index of the copolymers increased in proportion to the monomer content and extrapolated to determine that of homopolymer. $Ph_3Si$, $Ph_3Ge$, and $Ph_3Sn$ groups contributed to increase the refractive index of acrylic polymer, in which $Ph_3Sn$ was more effective than $Ph_3Ge$. The index increment confidently occurred with $Bu_3Sn$ attachment in comparison with aliphatic acrylic polymers. $Ph_3SnS$-attached acrylate polymer showed a refractive index of 1.671 at 589 nm. The index change was similarly observed at various different wavelengths (656, 830, 1310, and 1550 nm).

• Korean Journal of Materials Research
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• v.18 no.2
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• pp.69-72
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• 2008

A sensor element array for combinatorial solution deposition research was fabricated using LTCC (Low-temperature Co-fired Ceramics). The designed LTCC was co-fired at $800^{\circ}C$ for 1 hour after lamination at $70^{\circ}C$ under 3000 psi for 30 minutes. $SnO_2$ sol was prepared by a hydrothermal method at $200^{\circ}C$ for 3 hours. Tin chloride and ammonium carbonate were used as raw materials and the ammonia solution was added to a Teflon jar. 20 droplets of $SnO_2$ sol were deposited onto a LTCC sensor element and this was heat treated at $600^{\circ}C$ for 5 hours. The gas sensitivity ($S\;=\;R_a/R_g$) values of the $SnO_2$ sensor and 0.04 wt% Pd-added $SnO_2$ sensor were measured. The 0.04 wt% Pd-added $SnO_2$ sensor showed higher sensitivity (S = 8.1) compared to the $SnO_2$ sensor (S = 5.95) to 200 ppm $CH_3COCH_3$ at $400^{\circ}C$.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.8
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• pp.622-626
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• 2010

Cu doped $SnO_2$ thick films for gas sensors were fabricated by screen printing method on alumina substrates and annealed at $500^{\circ}C$ in air, respectively. Structural properties of $SnO_2$ by X-ray diffraction showed (110), (101) and (211) dominant tetragonal phase. The effects of catalyst Cu in $SnO_2$-based gas sensors were investigated. Sensitivity of $SnO_2$:Cu sensors to 2,000 ppm $CO_2$ gas and 50 ppm $H_2S$ gas was investigated for various Cu concentration. The highest sensitivity to $CO_2$ gas and $H_2S$ gas of Cu doped $SnO_2$ gas sensors was observed at the 8 wt% and 12 wt% Cu concentration, respectively. The improved sensitivity in the Cu doped $SnO_2$ gas sensors was explained by decrease of electron depletion region in Cu and $SnO_2$ junction, and increase of reactive oxygen and surface area in the $SnO_2$.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.2
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• pp.43-48
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• 2017

Conductive $Sn_xO_y$ thin films were fabricated via RF reactive sputtering using SnO:Sn (80:20 mol%) composite target. The composite target was used to produce a chemically stable composition of $Sn_xO_y$ thin film while controlling structural defects by chemical reaction between tin and oxygen. During sputtering pressure, RF power, and substrate temperature were fixed, and oxygen partial pressure was varied from 0% to 12%. Annealing process was carried out at $300^{\circ}C$ for 1 hour in vacuum. Except $P_{O2}=0%$ sample, all samples showed the transmittance of 80~90% and amorphous phase before and after annealing. Electrically stable p-type $Sn_xO_y$ thin film with high transmittance was only obtained from the oxygen partial pressure at 12%. The carrier concentration and mobility for the $P_{O2}=12%$ were $6.36{\times}10^{18}cm^{-3}$ and $1.02cm^2V^{-1}s^{-1}$ respectively after annealing.