• 한국진공학회지
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• 제14권1호
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• pp.29-34
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• 2005

실리콘-게르마늄 바이시모스(SiGe BiCMOS) 소자 제작시 발생하는 실리콘-게르마늄 이종접합 바이폴라 트랜지스터(SiGe HBT) 열화 현상에 대하여 고찰하였다. 독립적으로 제작된 소자에 비해 SiGe BiCMOS 공정에서의 SiGe HBT소자는 얼리 전압(Early voltage), 콜렉터-에미터 항복전압 및 전류이득등의 DC특성이 열화되고 상당한 크기의 베이스 누설전류가 존재한다는 것을 알 수 있었다. 또한 AC 특성인 차단주파수(f/sub T/) 및 최대 진동주파수(f/sub max/)도 1/2이하로 현저하게 저하되는 것을 확인하였다. 이는 고온의 소오스-드레인 열처리에 의한 붕소의 농도분포 변화가 에미터-베이스 및 콜렉터-베이스 접합 위치에 변화를 주고, 결국 실리콘-게르마늄 내에서의 접합 형성이 이루어지지 않아 전류 이득이 감소하고 기생 장벽이 형성되어서 발생한 현상이다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 하계학술대회 논문집
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• pp.55-58
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• 2000

SiGe heterojuction bipolar transistors (HBT) have been studied and applied for advanced high speed integrated circuits. Device characteristics of SiGe HBT depending on the Ge profile of the transistor base region have been analysed using a device simulator, ATLAS/BLAZE. The models and parameters have been calibrated to the measured characteristics of the device, having a trapeziodal base profile, including the cut-off frequency of 45GHz and the dc current gain of 200. The Ge concentration which increases linearly, exponentially, or root-functionally from the emitter-base junction to the base-collector junction, has been tried to find out the influence on the device characteristics. The cut-off frequency and gain rather strongly depends on the exponential and root-functional Ge base profiles, respectively.

• 한국산학기술학회:학술대회논문집
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• 한국산학기술학회 2004년도 춘계학술대회
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• pp.172-175
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• 2004

This paper analyzes the effects of Ge profiles shape of SiGe heterojunction bipolar transistors (HBT's) for high frequency application. Device simulations using ATLAS/BLAZE for the SiGe HBT with trapezoidal or triangular Ge profile are carried out to optimize the device performance. An HBT with $15\%$ triangular Ge profile shows higher cut-off frequency and DC current gain than that with $19\%$ trapezoidal Ge profile. The cut-off frequency and DC gain are increased from 42GHz to 84GHz and from 200 to 600, respectively. The SiGe HBT has been fabricated using a production CVD reactor.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2000년도 하계학술대회 논문집 C
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• pp.1803-1805
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• 2000

This paper analyzes the effects of Ge profiles shape of SiGe heterojunction bipolar transistors (HBT's) for high frequency application. Device simulations using ATLAS/BLAZE for the SiGe HBT with trapezoidal or triangular Ge profile are carried out to optimize the device performance. An HBT with 15% triangular Ge profile shows higher cut-off frequency and DC current gain than that with 19% trapezoidal Ge profile. The cut-off frequency and BC gain are increased from 42GHz to 84GHz and from 200 to 600, respectively.

• 한국통신학회논문지
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• 제28권8A호
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• pp.650-656
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• 2003

In 1995, a group of representatives from the integrated circuits and computer-aided design industries presented a industry standard bipolar model called the VBIC model. The VBIC model includes the improved Early effect, quasi-saturation, substrate parasitic, avalanche multiplication, and self-heating which are not available in the conventional SGP model. This paper applies VBIC model for SiGe HBT device and develops an accurate and efficient methodology to extract all the DC and AC parameters of the VBIC model for SiGe HBT device at room temperature. Simulated results by the extracted VBIC model parameter are compared with the measurement data and show very good agreement in both DC and s-parameters prediction.

• 한국전자파학회논문지
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• 제13권8호
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• pp.764-768
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• 2002

본 논문에서는 (주)타키오닉스의 SiGe HBT 공정을 이용하여 double balanced Gilbert cell down conversion MMIC mixer를 구현한 결과를 제시하고, 이를 통해 RFIC 설계용 SiGe HBT 파운드리의 정확성과 신뢰성을 평가하였다. 제작된 Mixer는 3 V 동작 전압에서 10 mA의 전류를 소모하며, 2 GHz의 주파수 대역에서 17 dB의 Conversion Gain과 9.8 dB NF, -4.2 dBm Output 1 dB Compression Point, -27 dEc의 RF-IF Isolation의 특성을 나타내었으며 우수한 50 $\Omega$ 입. 출력 정합 특성을 갖는다. 시뮬레이션 결과와 측정결과는 거의 유사한 특성을 가지며, 이를 통해 SiGe HBT 모델 라이브러리의 정확성과 공정의 재현성을 검증할 수 있었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1996년도 추계학술대회 논문집
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• pp.26-28
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• 1996

A high power SiGe HBT has been fabricated using APCVD(Atmospheric Pressure Chemical Vapor Deposition) and its perfermanoe has been analysed. The composition of Ge in the SiGe base was graded from 0% at the emitter-base junction to 20% at the base-collector junction. As a base electrode, titanium disilicide(TiSi$_2$) was used to reduce the extrinsic base resistance. The SiGe HBT with an emitter area of 2$\times$8${\mu}{\textrm}{m}$$^2$typically has a cutoff frequency(f$_{T}$) of 7.0GHz and a maximun oscillation frequency(f$_{max}$) of 16.1GHz with a pad de-embedding. The packaged high power SiGe HBT with an emitter area of 2xBx80${\mu}{\textrm}{m}$$^2$typically shows a cutoff frequency of 4.7GHz and a maximun oscillation frequency of 7.1GHz at Ic of 115mA.A.A.

• 한국전기전자재료학회논문지
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• 제17권9호
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• pp.916-923
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• 2004

In this paper, the strained Si$_{0.9}$Ge$_{0.1}$ epitaxial layers grown by a reduced pressure chemical vapor deposition (RPCVD) on Si (100) were characterized by Rutherford backscattering spectrometery (RBS) for the fabrication of an SiGe heterojunction bipolar transistor(HBT). RBS spectra of the ${Si}_0.9{Ge}_0.1$epitaxial layers grown on the Si substrates which were implanted with the phosphorus (P) ion and annealed at a temperature between $850^{\circ}C$ - $1000^{\circ}C$ for 30min were analyzed to investigate the post thermal annealing effect on the grown${Si}_0.9{Ge}_0.1$epitaxial layer quality. Although a damage of the substrates by P ion-implantation might be cause of the increase of RBS yield ratios, but any defects such as dislocation or stacking fault in the grown ${Si}_0.9{Ge}_0.1$ epitaxial layer were not found in transmission electron microscope (TEM) photographs. The post high temperature rapid thermal annealing (RTA) effects on the crystalline quality of the ${Si}_0.9{Ge}_0.1$ epitaxial layers were also analyzed by RBS. The changes in the RBS yield ratios were negligible for RTA a temperature between $900^{\circ}C$ - $1000^{\circ}C$for 20 sec, or $950^{\circ}C$for 20 sec - 60 sec. A SiGe HBT array shows a good Gummel characteristics with post RTA at $950^{\circ}C$ for 20 sec.sec.sec.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1997년도 춘계학술대회 논문집
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• pp.236-238
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• 1997

A cellular power amplifier using an APCVD(Atmospheric Pressure Chemical Vapor Deposition)-grown SiGe base HBT of ETRI has been designed with a linear simulation CAD. The Si/SiGe HBT with an emitter area of 2$\times$8${\mu}{\textrm}{m}$$^2$typically has a cutoff frequency(f$_{T}$) of 7.0 GHz and a maximum oscillation frequency(f$_{max}$) of 16.1 GHz with a pad de-embedding A packaged power Si/SiGe HBT with an emitter area of 2$\times$8$\times$80${\mu}{\textrm}{m}$$^2$typically shows a f$_{T}$ of 4.7 GHz and a f$_{max}$ of 7.1 GHz at a collector current (Ic) of 115 mA. The power amplifier exhibits a Forward transmission coefficient(S21) of 13.5 dB, an input and an output reflection coefficients of -42 dB and -45 dB respectively. Up to now the III-V compound semiconductor devices hale dominated microwave applications, however a rapid progress in Si-based technology make the advent of the Si/SiGe HBT which is promising in low to even higher microwave range because of lower cost and relatively higher reproducibility of a Si-based process.ess.ess.

• 한국산학기술학회논문지
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• 제5권4호
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• pp.367-370
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• 2004

초고속 RF IC의 핵심소자인 SiGe 에피텍시층을 가진 이종양극트란지스터(hetero junction bipolar transistor: HBT)를 0.35㎛급 Si-Ge BiCMOS공정으로 제작하였다. 낮은 VBE영역에서의 current gain의 선형성을 향상시키기 위하여 SiGe에피텍시층의 결함밀도를 감소시킬 수 있는 캐핑실리콘의 두께와 EDR온도의 최적화 공정조건을 알아보았다. 캐핑 실리콘의 두께를 200Å과 300Å으로 나누고 초고속 무선통신에서 요구되는 낮은 노이즈를 위한 EDR(Emitter Drive-in RTA)의 온도와 시간을 900-1000℃, 0-30 sec로 각각 변화시키면서 최적조건을 확인하였다. 실험범위 내에서의 최적공정조건은 300Å의 capping 실리콘과 975℃-30sec의 EDR 조건을 확인하였다.