• 제목/요약/키워드: SiC (Silicon Carbide) MOSFET

검색결과 28건 처리시간 0.023초

Implementation and Evaluation of Interleaved Boundary Conduction Mode Boost PFC Converter with Wide Band-Gap Switching Devices

  • Jang, Jinhaeng;Pidaparthy, Syam Kumar;Choi, Byungcho
    • Journal of Power Electronics
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    • 제18권4호
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    • pp.985-996
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    • 2018
  • The implementation and performance evaluation of an interleaved boundary conduction mode (BCM) boost power factor correction (PFC) converter is presented in this paper by employing three wide band-gap switching devices: a super junction silicon (Si) MOSFET, a silicon carbide (SiC) MOSFET and a gallium nitride (GaN) high electron mobility transistor (HEMT). The practical considerations for adopting wide band-gap switching devices to BCM boost PFC converters are also addressed. These considerations include the gate drive circuit design and the PCB layout technique for the reliable and efficient operation of a GaN HEMT. In this paper it will be shown that the GaN HEMT exhibits the superior switching characteristics and pronounces its merits at high-frequency operations. The efficiency improvement with the GaN HEMT and its application potentials for high power density/low profile BCM boost PFC converters are demonstrated.

고전압 4H-SiC DiMOSFET 제작을 위한 최적화 simulation (Optimization simulation for High Voltage 4H-SiC DiMOSFET fabrication)

  • 김상철;방욱;김남균;김은동
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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    • pp.353-356
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    • 2004
  • This paper discribes the analysis of the I-V characteristics of 4H-SiC DiMOSFET with single epi-layer Silicon Carbide has been around for over a century. However, only in the past two to three decades has its semiconducting properties been sufficently studied and applied, especially for high-power and high frequency devices. We present a numerical simulation-based optimization of DiMOSFET using the general-purpose device simulator MINIMIS-NT. For simulation, a loin thick drift layer with doping concentration of $5{\times}10^{15}/cm^3$ was chosen for 1000V blocking voltage design. The simulation results were used to calculate Baliga's figure of Merit (BFOM) as the criterion structure optimization and comparison.

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Single-phase Resonant Inverter using SiC Power Modules for a Compact High-Voltage Capacitive Coupled Plasma Power Supply

  • Tu, Vo Nguyen Qui;Choi, Hyunchul;Kim, Youngwoo;Lee, Changhee;Yoo, Hyoyol
    • 전력전자학회:학술대회논문집
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    • 전력전자학회 2014년도 추계학술대회 논문집
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    • pp.85-86
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    • 2014
  • The paper presents a power supply of atmospheric-pressure plasma reactor based on SiC (Silicon Carbide) MOSFET resonant inverter. Thanks to the capacitive characteristic of capacitive coupling plasma reactor type, the LC series resonant inverter had been applied to take advantages of this topology with the implementation of SiC MOSFET power modules as switching power devices. Designation of gate driver for SiC MOSFET had been introduced by this paper. The 5kVp, 5kW power supply had also been verified by experimental results.

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Influence of Parasitic Parameters on Switching Characteristics and Layout Design Considerations of SiC MOSFETs

  • Qin, Haihong;Ma, Ceyu;Zhu, Ziyue;Yan, Yangguang
    • Journal of Power Electronics
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    • 제18권4호
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    • pp.1255-1267
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    • 2018
  • Parasitic parameters have a larger influence on Silicon Carbide (SiC) devices with an increase of the switching frequency. This limits full utilization of the performance advantages of the low switching losses in high frequency applications. By combining a theoretical analysis with a experimental parametric study, a mathematic model considering the parasitic inductance and parasitic capacitance is developed for the basic switching circuit of a SiC MOSFET. The main factors affecting the switching characteristics are explored. Moreover, a fast-switching double pulse test platform is built to measure the individual influences of each parasitic parameters on the switching characteristics. In addition, guidelines are revealed through experimental results. Due to the limits of the practical layout in the high-speed switching circuits of SiC devices, the matching relations are developed and an optimized layout design method for the parasitic inductance is proposed under a constant length of the switching loop. The design criteria are concluded based on the impact of the parasitic parameters. This provides guidelines for layout design considerations of SiC-based high-speed switching circuits.

Current Spreading Layer와 에피 영역 도핑 농도에 따른 4H-SiC Vertical MOSFET 항복 전압 최적화 (Optimization of 4H-SiC Vertical MOSFET by Current Spreading Layer and Doping Level of Epilayer)

  • 안정준;문경숙;구상모
    • 한국전기전자재료학회논문지
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    • 제23권10호
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    • pp.767-770
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    • 2010
  • In this work, we investigated the static characteristics of 4H-SiC vertical metal-oxidesemiconductor field effect transistors (VMOSFETs) by adjusting the doping level of n-epilayer and the effect of a current spreading layer (CSL), which was inserted below the p-base region with highly doped n+ state ($5{\times}10^{17}cm^{-3}$). The structure of SiC VMOSFET was designed by using a 2-dimensional device simulator (ATLAS, Silvaco Inc.). By varying the n-epilayer doping concentration from $1{\times}10^{16}cm^{-3}$ to $1{\times}10^{17}cm^{-3}$, we investigated the static characteristics of SiC VMOSFETs such as blocking voltages and on-resistances. We found that CSL helps distribute the electron flow more uniformly, minimizing current crowding at the top of the drift region and reducing the drift layer resistance. For that reason, silicon carbide VMOSFET structures of highly intensified blocking voltages with good figures of merit can be achieved by adjusting CSL and doping level of n-epilayer.

배전용 반도체 변압기 구현을 위한 SiC MOSFET 기반 전력변환회로 단위모듈 설계에 관한 연구 (Design and Implementation of a Power Conversion Module for Solid State Transformers using SiC MOSFET Devices)

  • 임정우;조영훈
    • 전력전자학회논문지
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    • 제22권2호
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    • pp.109-117
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    • 2017
  • This paper describes the design and implementation of a unit module for a 10 kVA class 13.2 kV/220 V unidirectional solid-state transformer (SST) with silicon-carbide metal-oxide-semiconductor field-effect transistors. The proposed module consists of an active-front-end (AFE) converter to interface 1320 V AC voltage source to 2500 V DC link and an isolated resonant DC-DC converter for 500 V low-voltage DC output. The design approaches of the AFE and the isolated resonant DC-DC converters are addressed. The control structures of the converters are described as well. The experiments for the converters are performed, and results verify that the proposed unit module can be successfully adopted for the entire SST operation.

전기자동차 파워 인버터용 전력반도체 소자의 발전: SiC 및 GaN (Advances in Power Semiconductor Devices for Automotive Power Inverters: SiC and GaN)

  • 김동진;방정환;김민수
    • 마이크로전자및패키징학회지
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    • 제30권2호
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    • pp.43-51
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    • 2023
  • 본 논문에서는 전기차 전력변환 시스템의 근간이 되는 전력반도체 소자의 발전 방향과 차세대 전력반도체 소자인 wide bandgap (WBG)의 특징에 관해 소개하고자 한다. 현재까지의 주류인 Si insulated gate bipolar transistor (IGBT)의 특징에 관해 소개하고, 제조사 별 Si IGBT 개발 방향에 대해 다루었다. 또한 대표적인 WBG 전력반도체 소자인 SiC metal-oxide-semiconductor field-effect transistor (MOSFET)이 가지는 특징을 고찰하여 종래의 Si IGBT 소자 대비 SiC MOSFET이 가지는 효용 및 필요성에 대해 서술하였다. 또한 현 시점에서의 GaN 전력반도체 소자가 가지는 한계 및 그로 인해 전기자동차용 전력변환모듈 용으로 사용하기에 이슈인 점을 서술하였다.

계통 연계형 Hybrid Active NPC 인버터의 SiC MOSFET 오버슈트 전압 저감 (Reducing Overshoot Voltage of SiC MOSFET in Grid-Connected Hybrid Active NPC Inverters)

  • 이덕호;김예지;김석민;이교범
    • 전력전자학회논문지
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    • 제24권6호
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    • pp.459-462
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    • 2019
  • This work presents methods for reducing overshoot voltages across the drain-source of silicon carbide (SiC) MOSFETs in grid-connected hybrid active neutral-point-clamped (ANPC) inverters. Compared with 3-level NPC-type inverter, the hybrid ANPC inverter can realize the high efficiency. However, SiC MOSFETs conduct its switching operation at high frequencies, which cause high overshoot voltages in such devices. These overshoot voltages should be reduced because they may damage switching devices and result in electromagnetic interference (EMI). Two major strategies are used to reduce the overshoot voltages, namely, adjusting the gate resistor and using a snubber capacitor. In this paper, advantages and disadvantages of these methods will be discussed. The effectiveness of these strategies is verified by experimental results.

4H-SiC DMOSFETs의 계면 전하 밀도에 따른 스위칭 특성 분석 (Effect of Interface Charges on the Transient Characteristics of 4H-SiC DMOSFETs)

  • 강민석;문경숙;구상모
    • 한국전기전자재료학회논문지
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    • 제23권6호
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    • pp.436-439
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    • 2010
  • SiC power device possesses attractive features, such as high breakdown voltage, high-speed switching capability, and high temperature operation. In general, device design has a significant effect on the switching characteristics. In this work, we report the effect of the interface states ($Q_f$) on the transient characteristics of SiC DMOSFETs. The key design parameters for SiC DMOSFETs have been optimized by using a physics-based two-dimensional (2-D) mixed device and circuit simulator by Silvaco Inc. When the $SiO_2$/SiC interface charge decreases, power losses and switching time also decrease, primarily due to the lowered channel mobilities. High density interface states can result in increased carrier trapping, or more recombination centers or scattering sites. Therefore, the quality of $SiO_2$/SiC interfaces has a important effect on both the static and transient properties of SiC MOSFET devices.

Mixde-mode simulation을 이용한 4H-SiC DMOSFETs의 계면상태에서 포획된 전하에 따른 transient 특성 분석 (Mixed-mode simulation of transient characteristics of 4H-SiC DMOSFETs - Impact off the interface changes)

  • 강민석;최창용;방욱;김상철;김남균;구상모
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 추계학술대회 논문집
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    • pp.55-55
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    • 2009
  • Silicon Carbide (SiC) is a material with a wide bandgap (3.26eV), a high critical electric field (~2.3MV/cm), a and a high bulk electron mobility (${\sim}900cm^2/Vs$). These electronic properties allow high breakdown voltage, high frequency, and high temperature operation compared to Silicon devices. Although various SiC DMOSFET structures have been reported so far for optimizing performances. the effect of channel dimension on the switching performance of SiC DMOSFETs has not been extensively examined. In this paper, we report the effect of the interface states ($Q_s$) on the transient characteristics of SiC DMOSFETs. The key design parameters for SiC DMOSFETs have been optimized and a physics-based two-dimensional (2-D) mixed device and circuit simulator by Silvaco Inc. has been used to understand the relationship with the switching characteristics. To investigate transient characteristic of the device, mixed-mode simulation has been performed, where the solution of the basic transport equations for the 2-D device structures is directly embedded into the solution procedure for the circuit equations. The result is a low-loss transient characteristic at low $Q_s$. Based on the simulation results, the DMOSFETs exhibit the turn-on time of 10ns at short channel and 9ns at without the interface charges. By reducing $SiO_2/SiC$ interface charge, power losses and switching time also decreases, primarily due to the lowered channel mobilities. As high density interface states can result in increased carrier trapping, or recombination centers or scattering sites. Therefore, the quality of $SiO_2/SiC$ interfaces is important for both static and transient properties of SiC MOSFET devices.

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