• 제목/요약/키워드: Si nano-structure

검색결과 263건 처리시간 0.027초

Dark-field Transmission Electron Microscopy Imaging Technique to Visualize the Local Structure of Two-dimensional Material; Graphene

  • Na, Min Young;Lee, Seung-Mo;Kim, Do Hyang;Chang, Hye Jung
    • Applied Microscopy
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    • 제45권1호
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    • pp.23-31
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    • 2015
  • Dark field (DF) transmission electron microscopy image has become a popular characterization method for two-dimensional material, graphene, since it can visualize grain structure and multilayer islands, and further provide structural information such as crystal orientation relations, defects, etc. unlike other imaging tools. Here we present microstructure of graphene, particularly, using DF imaging. High-angle grain boundary formation wass observed in heat-treated chemical vapor deposition-grown graphene on the Si substrate using patch-quilted DF imaging processing, which is supposed to occur by strain around multilayer islands. Upon the crystal orientation between layers the multilayer islands were categorized into the oriented one and the twisted one, and their local structure were compared. In addition information from each diffraction spot in selected area diffraction pattern was summarized.

나노두께 퍼말로이에서의 계면효과에 의한 자기적 물성 변화 (Evolution of Magnetic Property in Ultra Thin NiFe Films)

  • 정영순;송오성
    • 한국자기학회지
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    • 제14권5호
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    • pp.163-168
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    • 2004
  • 나노 두께의 NiFe의 자기적 특성을 살펴보기 위해 Si(100)/ $SiO_2$(200 nm)/Ta(5 nm)/N $i_{80}$F $e_{20}$(1~15 nm)의 구조를 ICP형 헬리콘 스퍼터로 제작하였다. 제작된 시편의 자기적 물성은 SQUID를 이용하여 $\pm$50 Oe에서의 4.2K와 300K에서 각각의 M-H loop를 측정하여 자기탄성에너지 변화와 보자력을 확인하였다. 또한 SQUID로 4.2K-300K에서의 M-T curve를 통해 온도에 따른 포화자화를 두께에 따라 살펴보았다. TEM을 사용하여 제작된 시편의 각 계면간의 미세구조를 살펴보았다 나노두께의 NiFe는 3 nm 이하에서는 $B_{bulk}$=0, $B_{surf}$=-3${\times}$$10^{-7}$(J/$m^2$)의 자기 탄성계수를 보였으며, 보자력은 급격히 증가하는 것을 확인하였다. 나노 두께의 퍼말로이는 계면효과에 의해서 벌크특성과 다른 자기탄성계수, 보자력, Ms의 변화가 발생하였다. 따라서 나노급 소자를 제작할 때 이러한 변화를 고려하여 설계하여야 하였다.

Corrosion Behavior of Si,Zn and Mn-doped Hydroxyapatite on the PEO-treated Surface

  • Park, Min-Gyu;Choe, Han-Cheol
    • 한국표면공학회:학술대회논문집
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    • 한국표면공학회 2017년도 춘계학술대회 논문집
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    • pp.78-78
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    • 2017
  • Pure Titanium and alloy have been widely used in dental implants and orthopedics due to their excellent mechanical properties, biocompatibility and corrosion resistance. However, due to the biologically inactive nature of Ti metal implants, it cannot bind to the living bone immediately after transplantation into the body. In order to improve the bone bonding ability of titanium implants, many attempts have been made to alter the structure, composition and chemical properties of titanium surfaces, including the deposition of bioactive coatings. The PEO method has the advantages of short experiment time and low cost. These advantages have attracted attention recently. Recently, many metal ions such as silicon, magnesium, zinc, strontium, and manganese have received attention in this field due to their impact on bone regeneration. Silicon (Si) in particular has been found to be essential for normal bone and cartilage growth and development. Zinc (Zn) plays very important roles in bone formation and immune system regulation and promotes bone metabolism and growth. Manganese (Mn) is an essential trace metal found in all tissues and is required for normal amino acid, lipid, protein and carbohydrate metabolism. The objective of this work was research on the corrosion behavior of Si, Zn and Mn-doped hydroxyapatite on the PEO-treated surface. Anodized alloys was prepared at 270V~300V voltage in the solution containig Zn, Si, and Mn ions. Ion release test was carried out using potentidynamic and AC impedance method in 0.9% NaCl solution. The surface characteristics of PEO treated Ti-6Al-4V alloy were investigated using XRD, FE-SEM, AFM and EDS.

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Ultrathin Titania Coating for High-temperature Stable $SiO_2$/Pt Nanocatalysts

  • Reddy, A. Satyanarayana;Kim, S.;Jeong, H.Y.;Jin, S.;Qadir, K.;Jung, K.;Jung, C.H.;Yun, J.Y.;Cheon, J.Y.;Joo, S.H.;Terasaki, O.;Park, Jeong-Young
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2011년도 제41회 하계 정기 학술대회 초록집
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    • pp.217-217
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    • 2011
  • Recently, demand for thermally stable metal nanoparticles suitable for chemical reactions at high temperatures has increased to the point to require a solution to nanoparticle coalescence. Thermal stability of metal nanoparticles can be achieved by adopting core-shell models and encapsulating supported metal nanoparticles with mesoporous oxides [1,2]. However, to understand the role of metal-support interactions on catalytic activity and for surface analysis of complex structures, we developed a novel catalyst design by coating an ultra-thin layer of titania on Pt supported silica ($SiO_2/Pt@TiO_2$). This structure provides higher metal dispersion (~52% Pt/silica), high thermal stability (~600$^{\circ}C$) and maximization of the interaction between Pt and titania. The high thermal stability of $SiO_2/Pt@TiO_2$ enabled the investigation of CO oxidation studies at high temperatures, including ignition behavior, which is otherwise not possible on bare Pt nanoparticles due to sintering [3]. It was found that this hybrid catalyst exhibited a lower activation energy for CO oxidation because of the metal-support interaction. The concept of an ultra-thin active metal oxide coating on supported nanoparticles opens-up new avenues for synthesis of various hybrid nanocatalysts with combinations of different metals and oxides to investigate important model reactions at high-temperatures and in industrial reactions.

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나노급 Ir 삽입 니켈실리사이드의 미세구조 분석 (Microstructure Characterization for Nano-thick Ir-inserted Nickel Silicides)

  • 송오성;윤기정;이태헌;김문제
    • 한국재료학회지
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    • 제17권4호
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    • pp.207-214
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    • 2007
  • We fabricated thermally-evaporated 10 -Ni/(poly)Si and 10 -Ni/1 -Ir/(poly)Si structures to investigate the microstructure of nickel monosilicide at the elevated temperatures required for annealing. Silicides underwent rapid at the temperatures of 300-1200 for 40 seconds. Silicides suitable for the salicide process formed on top of both the single crystal silicon actives and the polycrystalline silicon gates. A four-point tester was used to investigate the sheet resistances. A transmission electron microscope(TEM) and an Auger depth profile scope were employed for the determination of vertical section structure and thickness. Nickel silicides with iridium on single crystal silicon actives and polycrystalline silicon gates shoed low resistance up to 1000 and 800, respectively, while the conventional nickle monosilicide showed low resistance below 700. Through TEM analysis, we confirmed that a uniform, 20 -thick silicide layer formed on the single-crystal silicon substrate for the Ir-inserted case while a non-uniform, agglomerated layer was observed for the conventional nickel silicide. On the polycrystalline silicon substrate, we confirmed that the conventional nickel silicide showed a unique silicon-silicide mixing at the high silicidation temperature of 1000. Auger depth profile analysis also supports the presence of thismixed microstructure. Our result implies that our newly proposed iridium-added NiSi process may widen the thermal process window for the salicide process and be suitable for nano-thick silicides.

나노구조를 응용한 AlN 성장 방법 및 특성 (High Quality AlN Layer Regrown on AlN Nanostructure by Hydride Vapor Phase Epitaxy)

  • 손호기;김진원;임태영;이미재;김진호;전대우;황종희;오해곤;최영준;이혜용
    • 한국전기전자재료학회논문지
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    • 제28권11호
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    • pp.711-714
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    • 2015
  • In this paper, high quality AlN layers were regrown on AlN nanopillar structure with $SiO_2$-dots by HVPE. Surface morphology of AlN layer regrown exhibited flatter than a conventional AlN template. The laterally overgrown AlN regions would consist of a continuous well coalesced layer with lower dislocation density than in the template because of the dislocation blocking and dislocation bending effects. Moreover, result of Raman spectroscopy suggest that the AlN nanopillar structure with $SiO_2$-dots relieves the strain in the AlN layer regrown by HVPE.

HF 습식 식각을 이용한 극자외선 노광 기술용 SiNx (Manufacturing SiNx Extreme Ultraviolet Pellicle with HF Wet Etching Process)

  • 김지은;김정환;홍성철;조한구;안진호
    • 반도체디스플레이기술학회지
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    • 제14권3호
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    • pp.7-11
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    • 2015
  • In order to protect the patterned mask from contamination during lithography process, pellicle has become a critical component for Extreme Ultraviolet (EUV) lithography technology. According to EUV pellicle requirements, the pellicle should have high EUV transmittance and robust mechanical property. In this study, silicon nitride, which is well-known for its remarkable mechanical property, was used as a pellicle membrane material to achieve high EUV transmittance. Since long silicon wet etching process time aggravates notching effect causing stress concentration on the edge or corner of etched structure, the remaining membrane is prone to fracture at the end of etch process. To overcome this notching effect and attain high transmittance, we began preparing a rather thick (200 nm) $SiN_x$ membrane which can be stably manufactured and was thinned into 43 nm thickness with HF wet etching process. The measured EUV transmittance shows similar values to the simulated result. Therefore, the result shows possibilities of HF thinning processes for $SiN_x$ EUV pellicle fabrication.

나노-스케일 전계 효과 트랜지스터 모델링 연구 : FinFET (Modeling of Nano-scale FET(Field Effect Transistor : FinFET))

  • 김기동;권오섭;서지현;원태영
    • 대한전자공학회논문지SD
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    • 제41권6호
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    • pp.1-7
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    • 2004
  • 본 논문에서는 2차원 양자 역학적 모델링 및 시뮬레이션(quantum mechanical modeling and simulation)으로써, 자기정렬 이중게이츠 구조(self-aligned double-gate structure)인 FinFET에 관하여 결합된 푸아송-슈뢰딩거 방정식(coupled Poisson and Schrodinger equations)를 셀프-컨시스턴트(self-consistent)한 방법으로 해석하는 수치적 모델을 제안한다. 시뮬레이션은 게이트 길이(Lg)를 10에서 80nm까지, 실리콘 핀 두께($T_{fin}$)를 10에서 40nm까지 변화시켜가며 시행되었다. 시뮬레이션의 검증을 위한 전류-전압 특성을 실험 결과값과 비교하였으며, 문턱 전압 이하 기울기(subthreshold swing), 문턱 전압 롤-오프(thresholdvoltage roll-off), 그리고 드레인 유기 장벽 감소(drain induced barrier lowering, DIBL)과 같은 파라미터를 추출함으로써 단채널 효과를 줄이기 위한 소자 최적화를 시행하였다. 또한, 고전적 방법과 양자 역학적 방법의 시뮬레이션 결과를 비교함으로써,양자 역학적 해석의 필요성을 확인하였다. 본 연구를 통해서, FinFET과 같은 구조가 단채널 효과를 줄이는데 이상적이며, 나노-스케일 소자 구조를 해석함에 있어 양자 역학적 시뮬레이션이 필수적임을 알 수 있었다.

RF Sputtering의 증착 조건에 따른 HfO2 박막의 Nanocrystal에 의한 Nano-Mechanics 특성 연구 (Nano-mechanical Properties of Nanocrystal of HfO2 Thin Films for Various Oxygen Gas Flows and Annealing Temperatures)

  • 김주영;김수인;이규영;권구은;김민석;엄승현;정현진;조용석;박승호;이창우
    • 한국진공학회지
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    • 제21권5호
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    • pp.273-278
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    • 2012
  • 현재 Hf (Hafnium)을 기반으로한 게이트 유전체의 연구는 여러 분야에서 다양하게 진행되어져 왔다. 이는 기존의 $SiO_2$보다 유전상수 값이 크고, 또한 계속되는 scaling-down 공정에서도 양자역학적인 터널링을 차단하는 특성이 뛰어나기 때문이다. MOSFET 구조에서 유전체 박막의 두께 감소로 인한 전기적 특성 저하를 보완하기 위해서 high-K 재료가 대두되었고 현재 주를 이루고 있다. 그러나 현재까지 $HfO_2$에 대한 nano-mechanical 특성 연구는 부족한 상태이므로 본 연구에서는 게이트 절연층으로 최적화하기 위하여 $HfO_2$ 박막의 nano-mechanical properties를 자세히 조사하였다. 시료는 rf magnetron sputter를 이용하여 Si (silicon) 기판 위에 Hafnium target으로 산소유량(4, 8 sccm)을 달리하여 증착하였고, 이후 furnace에서 400에서 $800^{\circ}C$까지 질소분위기에서 20분간 열처리를 실시하였다. 실험결과 산소 유량을 8 sccm으로 증착한 시료가 열처리 온도가 증가할수록 누설전류 특성 성능이 우수 해졌다. Nano-indenter로 측정하고 Weibull distribution으로 정량적 계산을 한 결과, $HfO_2$ 박막의 stress는 as-deposited 시료를 기준으로 $400^{\circ}C$에서는 tensile stress로 변화되었다. 그러나 온도가 증가(600, $800^{\circ}C$)할수록 compressive stress로 변화 되었다. 특히, $400^{\circ}C$ 열처리한 시료에서 hardness 값이 (산소유량 4 sccm : 5.35 GPa, 8 sccm : 5.54 GPa) 가장 감소되었다. 반면에 $800^{\circ}C$ 열처리한 시료에서는(산소유량 4 sccm : 8.09 GPa, 8 sccm : 8.17 GPa) 크게 증가된 것을 확인하였다. 이를 통해 온도에 따른 $HfO_2$ 박막의 stress 변화를 해석하였다.

Stress Dependence of Thermal Stability of Nickel Silicide for Nano MOSFETs

  • Zhang, Ying-Ying;Lim, Sung-Kyu;Lee, Won-Jae;Zhong, Zhun;Li, Shi-Guang;Jung, Soon-Yen;Lee, Ga-Won;Wang, Jin-Suk;Lee, Hi-Deok
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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    • pp.15-16
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    • 2006
  • The thermal stability of nickel silicide with compressively and tensilely stressed nitride capping layer has been investigated in this study. The Ni (10 nm) and Ni/Co/TiN (7/3/25 nm) structures were deposited on the p-type Si substrate. The stressed capping layer was deposited using plasma enhanced chemical vapor deposition (PECVD) after silicide formation by one-step rapid thermal process (RTP) at $500^{\circ}C$ for 30 sec. It was found that the thermal stability of nickel silicide depends on the stress induced by the nitride capping layer. In the case of Ni (10 nm) structure, the high compressive sample shows the best thermal stability, whereas in the case of Ni/Co/TiN (7/3/25 nm) structure, the high compressive sample shows the worst thermal stability.

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