• ETRI Journal
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• v.37 no.6
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• pp.1176-1187
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• 2015

This work proposes a highly efficient sensorless motor driver chip for various permanent-magnet synchronous motors (PMSMs) in a wide power range. The motor driver chip is composed of two important parts. The digital part is a sensorless controller consisting mainly of an angle estimation block and a speed control block. The analog part consists of a gate driver, which is able to sense the phase current of a motor. The sensorless algorithms adapted in this paper include a sliding mode observer (SMO) method that has high robust characteristics regarding parameter variations of PMSMs. Fabricated SMO chips detect back electromotive force signals. Furthermore, motor current-sensing blocks are included with a 10-bit successive approximation analog-to-digital converter and various gain current amplifiers for proper sensorless operations. Through a fabricated SMO chip, we were able to demonstrate rated powers of 32 W, 200 W, and 1,500 W.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.10
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• pp.54-61
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• 2011

In this paper, a simple analytical model for deriving the I-V characteristics of a cylindrical surrounding gate SOI MOSFET with intrinsic silicon core is suggested. The Poisson equation in the intrinsic silicon core and the Laplace equation in the gate oxide layer are solved analytically. The surface potentials at both source and drain ends are obtained by means of the bisection method. From them, the surface potential distribution is used to describe the I-V characteristics in a closed-form. Simulation results seem to show the dependencies of the I-V characteristics on the various device parameters and applied bias voltages within a range of satisfactory accuracy.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.36 no.4
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• pp.385-390
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• 2023

In this paper, the 1,700 V level SiC-based power MOSFET device widely used in electric vehicles and new energy industries was designed, that is, a single trench gate power MOSFET structure and a double trench gate power MOSFET structure were proposed to analyze electrical characteristics while changing the design and process parameters. As a result of comparing and analyzing the two structures, it can be seen that the double trench gate structure shows quite excellent characteristics according to the concentration of the drift layer, and the breakdown voltage characteristics according to the depth of the drift layer also show excellent characteristics of 200 V or more. Among them, the trench gate power MOSFET device can be applied not only to the 1,700 V class but also to a voltage range above it, and it is believed that it can replace all Si devices currently applied to electric vehicles and new energy industries.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.12
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• pp.120-127
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• 2016

This study examined the dynamic characteristics of the gate to identify the optimal gate installation direction according to the installation direction. A 1:31 scale model was constructed for a 47.5m prototype gate using acrylic. The scaled weights were tuned by adding lead weights. The first step was to measure the natural frequencies of the model gates, and compare them with finite-element analysis of the prototypes as a calibration. The scaled model was tested in a 1.6 m wide concrete flume for two orientations to determine the effects of the gate orientation on structural vibrations. Vertical vibrations were measured under a range of operational conditions, including a range of bottom opening heights and different upstream and downstream water levels. For large bottom opening heights in the normal direction, relatively large vibrations were induced by vortices shed at the plate bottom that would strike the horizontal truss member. This phenomenon was avoided in the reverse direction. For small bottom opening heights in the normal direction, these vibrations were caused by a suction force that developed at the gate bottom. The gate model in the reverse direction was preferred because of its low overall vibrational response under general gate opening and flow level combinations.

• JSTS:Journal of Semiconductor Technology and Science
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• v.14 no.3
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• pp.263-267
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• 2014

Super junction trench gate power MOSFETs have been receiving attention in terms of the trade-off between breakdown voltage and on-resistance. The vertical structure of super junction trench gate power MOSFETs allows the on-resistance to be reduced compared with conventional Trench Gate Power MOSFETs. The heat release of devices is also decreased with the reduction of on-resistance. In this paper, Lattice Temperature of two devices, Trench Gate Power MOSFET and Super junction trench gate power MOSFET, are compared in several temperature circumstance with the same Breakdown Voltage and Cell-pitch. The devices were designed by 100V Breakdown voltage and measured from 250K Lattice Temperature. We have tried to investigate how much temperature rise in the same condition. According as temperature gap between top of devices and bottom of devices, Super junction trench gate power MOSFET has a tendency to generate lower heat release than Trench Gate Power MOSFET. This means that Super junction trench gate power MOSFET is superior for wide-temperature range operation. When trench etching process is applied for making P-pillar region, trench angle factor is also important component. Depending on trench angle, characteristics of Super junction device are changed. In this paper, we focus temperature characteristic as changing trench angle factor. Consequently, Trench angle factor don't have a great effect on temperature change.

• 전기의세계
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• v.14 no.6
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• pp.1-7
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• 1965

This paper provides the analysis of the differential amplifier using the insulated gate, metala-oxide-semiconductor type field-effect-transistor(MOS FET), for its active element and the power drift of the amplifer. From these analytical considerations some design standardsn were found for the MOS FET differential amplifier available for the measurement of the very small current (pico-ampare range). A differential amplifier was designed and built in the view of above considerations. Its equivalent input gate voltages of the thermal drift and the power drift were 0.57mV/.deg. C in the range 25.deg. C-60.deg. C and 8.8mV/V in the range of 20% drift of its orginal value, respectively.

• 한국해양학회지
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• v.30 no.4
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• pp.262-270
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• 1995

A comparative study to understand the changes in physical and sedimentological natures was carried out in the Keum Estuary before and after the gate-close of Keum River weir. After closing of weir-gate maximum tidal current speed decreased about 30∼40% compared with that of the previous gate-opening period. Water masses also represent vertical stratifications both on water salinity and water transparency. The Keum Estuary seems to be changed from the well-mixed type estuary during the gate-opening period to the "partially-mixed type" and/or "salt-wedge type" estuary after the closing of weir-gate. The concentrations of suspended matter range 10∼100 mg/l in surface waters after the gate-close of Keum River Weir, representing about 1/4 to 1/3 decrease than those during the gate-close of Keum River Weir, representing about 1/4 to 1/3 decrease than those during the gate0opening period. Such decrease of suspended mater appears to be due to the decrease in the resuspension of bottom sediments, and also due to the vertical stratification of water masses that prevented the upward diffusion of turbid bottom waters. It is, therefore, expected that the depositional environment of Keum Estuary has been changing into the low energy conditions after the closing of weir gate, resulting in the rapid deposition of fine suspended matters within the Keum Estuary.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.10 no.6
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• pp.243-249
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• 2010

In this thesis, in order to a equivalent circuit-analytical study for a symmetric double gate type MOSFET, we slove analytically the 2D Poisson's equation in a a silicon body. To solve the threshold voltage in a symmetric double gate type MOSFET from the derived expression for the surface potential which the two-dimensional potential distribution of a symmetric double gate type MOSFET is assumed approximately. This thesis can use short and long channel in a silicon body we introduce a new the threshold voltage model in a symmetric double gate type MOSFET and measure it the distance about the range of channel length up to 0.1 [${\mu}m$].

• JSTS:Journal of Semiconductor Technology and Science
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• v.5 no.3
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• pp.195-203
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• 2005

Recently, a novel multi-bit nonvolatile memory based on double gate (DG) MOSFET is proposed to overcome the short channel effects and to increase the memory density. We need more complex voltage schemes for DG MOSFET devices. In view of peripheral circuits driving memory cells, one should consider various voltage sources used for several operations. It is one of the key issues to minimize the number of voltage sources. This criterion needs more caution in considering a DG nonvolatile memory cell that inevitably requires more number of events for voltage sources. Therefore figuring out the permissible range of operating bias should be preceded for reliable operation. We found that reliable operation largely depends on the depletion conditions of the silicon channel according to charge amount stored in the floating gates and the negative control gate voltages applied for read operation. We used Silvaco Atlas, a 2D numerical simulation tool as the device simulator.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.8
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• pp.609-615
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• 2011

This paper is studied for the improvement of the characteristics of gate oxide with 3-nm-thick gate oxide by deuterium ion implantation methode. Deuterium ions were implanted to account for the topography of the overlaying layers and placing the D peak at the top of gate oxide. A short anneal at forming gas to nitrogen was performed to remove the damage of D-implantation. We simulated the deuterium ion implantation to find the optimum condition by SRIM (stopping and range of ions in matter) tool. We got the optimum condition by the results of simulation. We compare the electrical characteristics of the optimum condition with others terms. We also analyzed the electrical characteristics to change the annealing conditions after deuterium ion implantation. The results of the analysis, the breakdown time of the gate oxide was prolonged in the optimum condition. And a variety of annealing, we realized the dielectric property that annealing is good at longer time. However, the high temperature is bad because of thermal stress.