• Title/Summary/Keyword: Power-Ground Plane

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An Aperture-coupled Microstrip Shaped-beam Array antenna for the PCS Basestation. (개구 결합 구조를 갖는 PCS 기지국용 마이크로스트립 정형 빔 배열 안테나)

  • 여운식;김광조;강승택;김형동
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.8 no.6
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    • pp.363-644
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    • 1997
  • This paper presents the design and fabrication of a shaped-beam array antenna which will be used for a PCS basestation using structure that is coupled to a microstrip line by an aperture on the interening ground plane. The shaped-beam pattern is obtained by an antenna synthesis method. An array antenna considering the mutual coupling between array elements patches) and a feeding network are designed by CAD tools. The feeding network is designed by using the Wilkinson power divider to obtain the optimized shaped-beam. The designed results are compared with the measured data.

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The Comparative Study on Age-associated Gait Analysis in Normal Korean (우리나라 연령별 보행분석 비교연구)

  • Yoon, Na-Mi;Yoon, Hee-Jong;Park, Jang-Sung;Jeong, Hwa-Su;Kim, Geon
    • The Journal of Korean Physical Therapy
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    • v.22 no.2
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    • pp.15-23
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    • 2010
  • Purpose: This study was done to establish reference data for temporo-spatial, kinematic and kinetic parameters for normal Koreans as they age. Methods: Normal adults and children without a previous history of musculoskeletal problems were enrolled in this study. The normal subjects were divided by age into three groups: Group I: children ($11.95{\pm}0.29$ years); Group II: young adults ($23.90{\pm}3.67$ years); Group III: older adults ($71.40{\pm}4.08$ years). The temporo-spatial and kinematic data were measured using 6 MX3 cameras while each subject walked through a 10 m walkway at a self-selected speed. The kinetic data were measured using 2 force plates and were calculated by inverse dynamics. Results: Motion patterns are typically associated with a specific phase of the gait cycle. Our results were as follows: 1. There were significant differences between the different age groups in temporo-spatial parameters such as cadence, double support, time of foot off, stride length, step length, and walking speed. 2. There were significant differences between the groups in kinematic parameters such as range of motion (ROM) of the hip, knee and ankle in the sagittal plane, ROM of the pelvis, hip and knee in the coronal plane and ROM of the pelvis, hip and ankle in the transverse plane. 3. There were significant differences between the groups in kinetic parameters such as joint moments of force, joint mechanical power generation or absorption and ground reaction forces. Conclusion: The results of this study can be utilized (a) as a reference for kinematic and kinetic data of gait analysis in normal Koreans, and (b) as an aide in evaluating and treating patients who have problems relating to gait.

A Method for Reducing the Number of Metal Layers for Embedded LSI Package

  • Ohshima, Daisuke;Mori, Kentaro;Nakashima, Yoshiki;Kikuchi, Katsumi;Yamamichi, Shintaro
    • Journal of the Microelectronics and Packaging Society
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    • v.17 no.4
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    • pp.27-33
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    • 2010
  • We have successfully demonstrated a high-pin-count and thin embedded-LSI package to realize next generation's mobile terminals. The following three design key points were applied: (i) Using Cu posts, (ii) Using the coreless structure, (iii) Using a Cu plate as the ground plane. In order to quantitatively determine the contribution of the three points, the five-stage process for reducing the number of metal layers is described by means of the electrical simulation. The point-(i) and (ii) are effective from the viewpoint of the power integrity (PI); that is, these points play important roles in reducing the number of metal layers, and especially the point-(ii) contributes at least twice as the point-(i). The point-(iii) is not effective in the PI, but has a few effects on the signal integrity (SI). For reducing the number of metal layers, we should, at first, pay attention whether the PI characteristics fulfill the specification, and then we should confirm the SI characteristics.

Design of Power Detection Block for Wireless Communication Transmitter Systems (무선통신 송신시스템용 전력검출부 설계)

  • Hwang, Mun-Su;Koo, Jae-Jin;Ahn, Dal;Lim, Jong-Sik
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.8 no.5
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    • pp.1000-1006
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    • 2007
  • This paper presents a power detector circuit which monitors the transmitting power for the application in CDMA cell phones. The proposed power detector are composed of coupler for coupling output power and detector fur monitoring output power. The designed coupler has low loss characteristic because it adopts the stripline structure which consists of two ground planes at both sides of signal plane. The design frequency is 824-849MHz which is the Tx band fur CDMA mobile terminal, and the coupling factor of the stripline coupler is -20dB. A schottky barrier diode is adopted for detector design because of its high speed operation with minimized loss. The required impedance matching is performed to improve the linearity and sensitivity of output voltage at relatively low detector input level where the nonlinear characteristic of diode exists. The package parasitics as well as intrinsic diode model are considered for simulation of the detector. The predicted performances agree well with the measured results.

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The Study on the improvement plan for Military combat power by base of NCW against the future War (미래전쟁을 대비한 NCW기반 전투력 발전방안 연구)

  • Heo, Yeong Dae
    • Convergence Security Journal
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    • v.17 no.5
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    • pp.153-161
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    • 2017
  • The gain a decision by a prediction supposition future combat. Take a future combat by the method fighting of U.S. Army in the Irak war. A make combat progress is from real time information to precision bombing for a guided weapon by GPS, a intelligence satellite, a pilotless scout plane, real time simultaneous and unification combat power are the kernel element of gain a decision fighting power by network in the ground, sky, marine, universe, cyberspace. The NCW is in a sense network center war organic be connected by networking a factor of operation. Any where networking information collection, command and decision, blow system. The Study on the improvement plan for Military combat power by base of NCW abainst the future War. Construct an integrate intelligence network apply to future combat.

DRAM Package Substrate Using Via Cutting Structure (비아 절단 구조를 사용한 DRAM 패키지 기판)

  • Kim, Moon-Jung
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.48 no.7
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    • pp.76-81
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    • 2011
  • A new via cutting structure in 2-layer DRAM package substrate has been fabricated to lower its power distribution network(PDN) impedance. In new structure, part of the via is cut off vertically and its remaining part is designed to connect directly with the bonding pad on the package substrate. These via structure and substrate design not only provide high routing density but also improve the PDN impedance by shortening effectively the path from bonding pad to VSSQ plane. An additional process is not necessary to fabricate the via cutting structure because its structure is completed at the same time during a process of window area formation. Also, burr occurrence is minimized by filling the via-hole inside with a solder resist. 3-dimensional electromagnetic field simulation and S-parameter measurement are carried out in order to validate the effects of via cutting structure and VDDQ/VSSQ placement on the PDN impedance. New DRAM package substrate has a superior PDN impedance with a wide frequency range. This result shows that via cutting structure and power/ground placement are effective in reducing the PDN impedance.

Design of 4-Layer PCB Considering EMC for Automotive Bluetooth Speaker (차량용 블루투스 스피커를 위한 EMC를 고려한 4층 PCB 설계)

  • Yoon, Ki-Young;Kim, Boo-Gyoun;Lee, Seongsoo
    • Journal of IKEEE
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    • v.25 no.4
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    • pp.591-597
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    • 2021
  • This paper proposes an EMC-aware PCB design method to reduce electromagnetic emission, where trace length and teturn path of critical signal are shortened by changing chip location and trace layout on the PCB, while additional filters or decoupling capacitors are not required. In the proposed method, signal velocity is calculated for various signals on the PCB. Critical signal with the fastest signal velocity is determined and its return path is shortened as much as possible by placing chip location and trace routing first. Return path of critical signal should be carefully designed not to have discontinuity. Power plane and ground plane should be carefully designed not to be divided, since these planes are the reference of return path. The proposed method was applied to automotive directional Bluetooth speaker which failed to pass CISPR 32 and CISPR 25 EMC tests. Its PCB was redesigned based on the proposed method and it easily passed the EMC tests. The proposed method is useful to EMC-sensitive electronic equipments.

Impedance Calculation of Power Distribution Networks for High-Speed DRAM Module Design (고속DRAM모듈 설계에 대한 전원평면의 임피던스계산)

  • Lee, Dong-Ju;Younggap You
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.39 no.3
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    • pp.49-60
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    • 2002
  • A systematic design approach for Power distribution network (PDN) is presented aiming at applications to DRAM module designs. Three main stages are comprised in this design approach: modeling and simulation of a PDN based on a two-dimensional transmission line structure employing a partial element equivalent circuit (PEEC); verification of the simulation results through comparison to measured values; and design space scanning with PDN parameters. Impedance characteristics for do-coupling capacitors are analyzed to devise an effective way to stabilize power and ground plane Performance within a target level of disturbances. Self-impedance and transfer-impedance are studied in terms of distance between circuit features and the size of do-coupling capacitors. A simple equation has been derived to find the do-coupling capacitance values yielding impedance lower than design target, and thereby reducing the overall computation time. The effectiveness of the design methodology has been demonstrated using a DRAM module with discrete do-coupling capacitors and a strip structure.

Magnetic Resonant Wireless Power Transfer with L-Shape Arranged Resonators for Laptop Computer

  • Choi, Jung Han;Kang, Seok Hyon;Jung, Chang Won
    • Journal of electromagnetic engineering and science
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    • v.17 no.3
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    • pp.126-132
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    • 2017
  • In this study, we designed, measured, and analyzed a rearranged L-shape magnetic resonance coupling wireless power transfer (MR-WPT) system for practical applications with laptops. The typical four resonator MR-WPT (Tx part: source loop and Tx coil; Rx part: Rx coil and load loop) is difficult to apply to small-sized stationary and mobile applications, such as laptop computers, tablet-PCs, and smartphones, owing to the large volume of the Rx part and the spatial restrictions of the Tx and Rx coils. Therefore, an L-shape structure, which is the orthogonal arrangement of the Tx and Rx parts, is proposed for indoor environment applications, such as at an L-shaped wall or desk. The relatively large Tx part and Rx coil can be installed in the wall and the desk, respectively, while the load loop is embedded in the small stationary or mobile devices. The transfer efficiency (TE) of the proposed system was measured according to the transfer distance (TD) and the misaligned locations of the load loop. In addition, we measured the TE in the active/non-active state and monitor-open/closed state of the laptop computer. The overall highest TE of the L-shape MR-WPT was 61.43% at 45 cm TD, and the TE decreased to 27.9% in the active and monitor-open state of the laptop computer. The conductive ground plane has a much higher impact on the performance when compared to the impact of the active/non-active states. We verified the characteristics and practical benefits of the proposed L-shape MR-WPT compared to the typical MR-WPT for applications to L-shaped corners.

A Design of 3 dB Power Divider using Slow-wave Characteristic (Slow-wave 특성을 이용한 3 dB 전력 분배기 설계)

  • Kim, Chul-Soo;Park, Jun-Seok;Ahn, Dal;Kim, Geun-young
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.10 no.5
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    • pp.694-700
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    • 1999
  • In this paper, we studied the design of power divider using the slow-wave effect of Photonic Bandgap structure, which is etched on the ground plane. The proposed PBG structure can provides the changing of the characteristic impedance of the transmission line and the group delay velocity characteristic. Therefore we can make wider width than the width of conventional transmission line and decrease the length of transmission line. We presented the application for power divider using the characteristic impedance and electrical length extracted from scattering parameter. As adding proposed defect units, the effect of defect is studied. The experimental results show good agreements with the simulated results.

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