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Impedance Calculation of Power Distribution Networks for High-Speed DRAM Module Design  

Lee, Dong-Ju (Chungbuk National University)
Younggap You (Dept. of Computer and Communication Eng. Chungbuk National University)
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Abstract
A systematic design approach for Power distribution network (PDN) is presented aiming at applications to DRAM module designs. Three main stages are comprised in this design approach: modeling and simulation of a PDN based on a two-dimensional transmission line structure employing a partial element equivalent circuit (PEEC); verification of the simulation results through comparison to measured values; and design space scanning with PDN parameters. Impedance characteristics for do-coupling capacitors are analyzed to devise an effective way to stabilize power and ground plane Performance within a target level of disturbances. Self-impedance and transfer-impedance are studied in terms of distance between circuit features and the size of do-coupling capacitors. A simple equation has been derived to find the do-coupling capacitance values yielding impedance lower than design target, and thereby reducing the overall computation time. The effectiveness of the design methodology has been demonstrated using a DRAM module with discrete do-coupling capacitors and a strip structure.
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1 B. Young, Digital Signal Integrity, Modeling and Simulation with Interconnects and Packages, Prentice-Hall, 2000
2 N. J. Na, et al., 'Modeling and transient simulation of planes in electronic packages,' IEEE Trans. on Advanced Packaging, Vol. 23, No. 3. pp. 340-352, August 2000   DOI   ScienceOn
3 I. Novak, 'Lossy power distribution network with thin dielectric layers and/or thin conductive layers,' IEEE Trans. on Advanced Packaging, Vol. 23, No. 3, pp. 353-360, August 2000   DOI   ScienceOn
4 L.D. Smith, R. Anderson and T. Roy, 'Power plane SPICE models and simulated performance for materials and geometries,' IEEE Trans. on Advanced Packaging, Vol. 24, No. 3, pp. 277-287, August 2001   DOI   ScienceOn
5 J.H. Kim and M. Swaminathan, 'Modeling of irregular shaped power distribution planes using transmission matrix method,' IEEE Trans. on Advanced Packaging, Vol. 24, No. 3, pp. 334-346, August 2001   DOI   ScienceOn
6 E.D. Alvarez, J.P. Krusius and Kroeger, 'Modeling and simulation of integrated capacitors for high frequency chip power decoupling,' IEEE Trans. on Components and Packaging Tech, Vol. 23, No. 4, December 2000   DOI   ScienceOn
7 L.D. Smith, et al., T. R, 'Power distribution system design methodology and capacitor selection for modern CMOS technology,' IEEE Trans. on Advanced Packaging, Vol. 22, No. 3, pp. 284-291, August 1999   DOI