• Journal of the Korean Vacuum Society
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• v.11 no.2
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• pp.103-107
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• 2002

Metal/ferroelectric/semiconductor field effect transistors(MFSFET′s) with various gate electrodes, that are aluminum, platinum and poly-Si, using rapid thermal annealed $LiNbO_3$/Si(100) structures were fabricated and the properties of the FET′s have been discussed. The drain current of the "on" state of FET with Pt electrode was more than 3 orders of magnitude larger than the "off" state current at the same "read" gate voltage of 1.5 V, which means the memory operation of the MFSFET. A write voltage as low as about $\pm$4 V, which is applicable to low power integrated circuits, was used for polarization reversal. The retention properties of the FET using Al electrode were quite good up to about $10^3$ s and using Pt electrode remained almost the same value of its initial value over 2 days at room temperature.

• Proceedings of the KIEE Conference
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• 2003.11b
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• pp.271-274
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• 2003

This paper presents a Built-in Current Sensor that detect defects in CMOS integrated circuits using the current testing technique. This scheme employs a cross-coupled connected PMOS transistors, it is used as a current comparator. Our proposed scheme is a negligible impart on the performance of the circuit undo. test (CUT). In addition, in the normal mode of the CUT not dissipation extra power, high speed detection time and applicable deep submicron process. The validity and effectiveness are verified through the HSPICE simulation on circuits with defects. The entire area of the test chip is $116{\times}65{\mu}m^2$. The BICS occupies only $41{\times}17{\mu}m^2$ of area in the test chip. The area overhead of a BICS versus the entire chip is about 9.2%. The chip was fabricated with Hynix $0.35{\mu}m$ 2-poly 4-metal N-well CMOS technology.

• Proceedings of the IEEK Conference
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• 2000.07b
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• pp.615-618
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• 2000

A number of studies have recently been made on hardware for a biological neuron f3r application with information processing functions of neural networks. We have been trying to produce hardware from the viewpoint that development of a new hardware neuron model is one of the important problems in the study of neural networks. In this paper, we first discuss the circuit structure of a pulse-type hardware neuron model with the enhancement-mode MOSFETs (E-MOSFETs). And we construct a pulse-type hardware neuron model using I-MOSFETs. As a result, it is shown that our proposed new model can exhibit firing phenomena even if the power supply voltage becomes less than 1.5[V]. So it is verified that our model is profitable for IC.

• Journal of Information Display
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• v.13 no.4
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• pp.179-183
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• 2012

In this paper, a gate driver circuit for In-Ga-Zn-O thin-film transistors (TFTs) driven by only two clock signals is reported. In this circuit, the TFTs are turned off with a negative $V_{GS}$ by the two clock signals. As a result, it works properly and suppresses power consumption increase even though the TFT $V_T$ shifts in the negative direction.

• Proceedings of the KIEE Conference
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• 2003.07c
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• pp.1662-1664
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• 2003

An electron gun system for a nanosecond pulse linac has been built and tested. The gun grid is driven with a grid pulser, which consists of an avalanche transistor pulser and parallel triode amplifier. The amplifier is installed in an end hole of the electron gun and provided for power amplification and polarity change of the output pulses of the avalanche transistor pulser. An output pulse of 200 V and 2 ns FWHM was obtained by using the grid pulser of can type transistors. Measurements with a test bench show that the electron gun can deliver 2ns pulse with with currents larger than 3A.

• Transactions on Electrical and Electronic Materials
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• v.18 no.3
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• pp.141-143
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• 2017

Novel structured thin film transistors (TFTs) of amorphous silicon zinc tin oxide (a-SZTO) were designed and fabricated with a thin metal layer between the source and drain electrodes. A SZTO channel was annealed at $500^{\circ}C$. A Ti/Au electrode was used on the SZTO channel. Metals are deposited between the source and drain in this novel structured TFTs. The mobility of the was improved from $14.77cm^2/Vs$ to $35.59cm^2/Vs$ simply by adopting the novel structure without changing any other processing parameters, such as annealing condition, sputtering power or processing pressure. In addition, stability was improved under the positive bias thermal stress and negative bias thermal stress applied to the novel structured TFTs. Finally, this novel structured TFT was observed to be less affected by back-channel effect.

• Electronics and Telecommunications Trends
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• v.38 no.6
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• pp.52-61
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• 2023

With semiconductor scaling approaching the physical limits, devices including CMOS (complementary metal-oxide-semiconductor) components have managed to overcome yet are currently struggling with several technical issues like short-channel effects. Evolving from the process node of 22 nm with FinFET (fin field effect transistor), state-of-the-art semiconductor technology has reached the 3 nm node with the GAA-FET (gate-all-around FET), which appropriately addresses the main issues of power, performance, and cost. Technical problems remain regarding the foundry of GAA-FET, and next-generation devices called post-GAA transistors have not yet been devised, except for the CFET (complementary FET). We introduce a CFET that spatially stacks p- and n-channel FETs on the same footprint and describe its structure and fabrication. Technical details like stacking of nanosheets, special spacers, hetero-epitaxy, and selective recess are more thoroughly reviewed than in similar articles on CFET fabrication.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.22 no.12
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• pp.1060-1068
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• 2011

In this paper, Current-Mode Class-D(CMCD) RF Power Amplifier(PA) is designed and implemented at 900 MHz. Conventional CMCD PA has output parallel resonator to reconstruct a fundamental frequency component of the output signal. However the resonator can be removed by connecting inverse class-F PAs because even-harmonic components can be removed by CMCD PA's push-pull structure. Using load-pull, inverse class-F PA with GaN transistors is designed, and CMCD PA with the inverse class-F PA is implemented. The CMCD PA has 64.5 % drain efficiency, 34.2 dBm output power. Comparing with the drain efficiency of a CMCD PA with parallel resonator, the CMCD with the inverse class-F technology has 13.6 % improved drain efficiency.

• JSTS:Journal of Semiconductor Technology and Science
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• v.17 no.2
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• pp.265-270
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• 2017

4H-SiC has attracted attention for high-power and high-temperature metal-oxide-semiconductor field-effect transistors (MOSFETs) for industrial and automotive applications. The gate oxide in the 4H-SiC MOS system is important for switching operations. Above $1000^{\circ}C$, thermal oxidation initiates $SiO_2$ layer formation on SiC; this is one advantage of 4H-SiC compared with other wide band-gap materials. However, if post-deposition annealing is not applied, thermally grown $SiO_2$ on 4H-SiC is limited by high oxide charges due to carbon clusters at the $SiC/SiO_2$ interface and near-interface states in $SiO_2$; this can be resolved via low-temperature deposition. In this study, low-temperature $SiO_2$ deposition on a Si substrate was optimized for $SiO_2/4H-SiC$ MOS capacitor fabrication; oxide formation proceeded without the need for post-deposition annealing. The $SiO_2/4H-SiC$ MOS capacitor samples demonstrated stable capacitance-voltage (C-V) characteristics, low voltage hysteresis, and a high breakdown field. Optimization of the treatment process is expected to further decrease the effective oxide charge density.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.27 no.10
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• pp.917-925
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• 2016

Schmitt Trigger logic is a gate level design method to have hysteresis characteristics to improve noise immunity in digital circuits. Dynamic Threshold voltage MOS(DTMOS) Schmitt trigger circuits can improve noise immunity without adding additional transistors but by controlling substrate bias. The performance of DTMOS Schmitt trigger logic has not been verified yet in standard CMOS process through measurement. In this paper, DTMOS Schmitt trigger logic was implemented and verified using Magna $0.18{\mu}m$ MPW process. DTMOS Schmitt trigger buffer, inverter, NAND, NOR and simple digital logic circuits were made for our verification. Hysteresis characteristics, power consumption, and delay were measured and compared with common CMOS logic gates. EM Immunity enhancement was verified through Direct Power Injection(DPI) noise immunity test method. DTMOS Schmitt trigger logics fabricated using CMOS process showed a significantly improved EM Immunity in 10 M~1 GHz frequency range.